(19)
(11) EP 3 275 009 A1

(12)

(43) Date of publication:
31.01.2018 Bulletin 2018/05

(21) Application number: 16769611.1

(22) Date of filing: 23.03.2016
(51) International Patent Classification (IPC): 
H01L 21/28(2006.01)
(86) International application number:
PCT/US2016/023785
(87) International publication number:
WO 2016/154315 (29.09.2016 Gazette 2016/39)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 23.03.2015 US 201514665799

(71) Applicants:
  • Texas Instruments Incorporated
    Dallas, TX 75265-5474 (US)

    AL AT BE BG CH CY CZ DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR 
  • Texas Instruments Deutschland GmbH
    85356 Freising (DE)

    DE 

(72) Inventors:
  • RINCK, Helmut
    85368 Moosburg (DE)
  • BAUER, Gernot
    85368 Moosburg (DE)
  • ZRILE, Robert
    80937 Muenchen (DE)
  • SCHACHTSCHNEIDER, Kai-Alexander
    85296 Rohrbach (DE)
  • OTTE, Michael
    85368 Moosburg (DE)
  • WIESNER, Harald
    84036 Landshut (DE)

(74) Representative: Zeller, Andreas 
Texas Instruments Deutschland GmbH Haggertystraße 1
85356 Freising
85356 Freising (DE)

   


(54) METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON