(19)
(11) EP 3 277 430 A1

(12)

(43) Date of publication:
07.02.2018 Bulletin 2018/06

(21) Application number: 16771755.2

(22) Date of filing: 25.03.2016
(51) International Patent Classification (IPC): 
B05B 1/02(2006.01)
(86) International application number:
PCT/JP2016/001756
(87) International publication number:
WO 2016/157867 (06.10.2016 Gazette 2016/40)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 30.03.2015 US 201514672662
30.03.2015 US 201514672672
30.03.2015 US 201514672688

(71) Applicant: Funai Electric Co., Ltd.
Daito-shi Osaka 574-0013 (JP)

(72) Inventor:
  • NORASAK, Sam
    Daito-shi Osaka 574-0013 (JP)

(74) Representative: Isarpatent 
Patent- und Rechtsanwälte Behnisch Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31
80801 München
80801 München (DE)

   


(54) FLUID EJECTION DEVICE, METHOD OF FORMING FLUID EJECTION DEVICE AND FLUID EJECTION SYSTEM