FIELD
[0001] The present invention relates to an apparatus and method for measuring one or more
properties of electron bunches or other groups of charged particles. The electron
bunches may be electron bunches within a free electron laser (FEL) radiation source,
for example an FEL radiation source configured to produce radiation having a wavelength
in a range 4nm to 25nm. The radiation source may, for example, be configured to provide
radiation to a lithographic apparatus for projecting a pattern from a patterning device
onto a substrate.
BACKGROUND
[0002] It is known to use free electron laser (FEL) radiation sources to produce radiation
of a desired wavelength, in which an electron beam comprising a periodic sequence
of electron bunches is passed through an undulator to generate the radiation. Such
sources can be used to produce radiation in a range 4 nm to 25 nm, for example extreme
ultra-violet (EUV) radiation, or at other desired wavelengths.
[0003] In known FEL radiation sources, ions are produced from residual gas in the electron
beam through collisional ionization.
[0004] Known FEL sources include LINACs for accelerating (and decelerating) electron bunches
before (and after) they pass through the undulator. Energy recovery LINACs can be
used, which are usually designed to operate with a balanced cavity load close to zero
(e.g. currents in accelerating and decelerating beams match, and energy extracted
and deposited upon acceleration and deceleration almost match).
WO2014/202585 A discloses a measurement apparatus coupled to a cavity for monitoring a charge density
distribution of electron bunches preceding entry into an undulator of a free electron
laser to produce EUV radiation beam used for lithography purposes.
[0005] The sequence of electron bunches, which may be referred to as an electron bunch train,
may comprise a sequence of electron bunches spaced apart in time, and having different
energies and being at different stages of the acceleration and deceleration cycle.
It is important that all bunches are precisely aligned in the LINAC or LINACs, both
in a lateral direction (e.g. lateral position in a plane perpendicular to the direction
of propagation) and longitudinal direction (e.g. separation between successive bunches
in time or distance in a direction of propagation of the bunches).
[0006] Precise alignment of the bunches can be important to ensure that the electric field
integrated over the path length is constant/stable for all bunch energy thereby to
assure a well-defined energy of the generated radiation. A gradient in electron energy
may be applied over the bunch, such that the electrons in front of the bunch have
higher energy than the electrons at the end of the bunch, in view of the eventual
bunch compression that may be performed using magnets, to ensure that the integrated
field per electron for a given position in the bunch is constant/stable. Precise alignment
of the bunches is also important as any deviation of the bunches from the centre of
the LINAC will result in a kick due to a gradient in the magnetic field. Both effects
may have a large impact on the propagation of the bunches and consequently the yield
and stability of the generated radiation.
[0007] Beam position monitors are known, which can be used to determine lateral position
of an electron beam or electron bunch sequence, or any other suitable charged particle
beam. A known beam position monitor is based on capacitive pickup of the coulomb field
of the traversing beam. Four electrodes can be spaced with an angular separation of
90° around the beam path. For each quadrant, an electrode picks up a signal. From
the signals the 2-D lateral position of the beam can be reconstructed based on the
charge induced on the electrode. The charge on the electrodes is read using read-out
electronics. Since the falling time following performance of a measurement is slow
and since reflections on the electrodes disturb the signal the difference in position
between two adjacent bunches can be difficult or impossible to measure using such
a known beam position monitor. Other beam position monitors are also known which use
different types of electrodes and electrode geometries, for example with electrodes
positioned with different angular separations.
[0008] Bunch arrival time monitors are also known. A known bunch arrival time monitor measures
the time of arrival of a bunch with respect to, for instance, a master clock. In such
a known monitor, dedicated electrodes may be coupled to electro-optic modulator crystals
rather than the read-out electronics used for beam position monitors. Four such electrodes
can be spaced with an angular separation of 90° around the beam path, with each pair
of opposing electrodes being coupled to a respective electro-optic modulator crystal.
Thus, two electro-optic modulator crystals are used to obtain measurements from the
four electrodes, with each pair opposing electrodes being coupled to a respective
one of the electro-optic crystals. The electric field measured by an electrode is
a function of the proximity of the bunch to the electrode, although in many arrangements
the signals of two opposing electrodes are combined to eliminate position dependence.
The monitor may be configured to provide a fine readout channel with high bandwidth
limited range and a coarse channel with lower bandwidth and large measurement range.
[0009] The arrival time of a bunch is measured using the electro-optic modulator crystals,
which change their optical properties when an electric field is applied. The changing
electric field changes the properties of the crystal. A pulsed femtosecond laser,
which may in some cases be guided by an optical fibre, probes the crystals. The timing
of the optical reference pulse is adjusted such that the pulses sample the pick-up
signal at its zero crossing. At this operation point the inherent dependence of the
arrival time measurement on the bunch charge is reduced. All subsequent electron bunches
whose time of arrival deviates from this reference point cause an amplitude modulation
of the sampling laser pulses. Other bunch arrival time monitors with different electrode
types and arrangements, or including other components such as R.F. cavities are also
known.
[0010] The position of bunches in FEL radiation sources can be precisely adjusted using
bending magnets and combiners/spreaders. However, accurate adjustments would require
accurate diagnostics to see whether the bunch train in the LINACs is aligned correctly.
Typical known beam position monitors cannot distinguish between different energies
and may integrate measurements over all bunches
[0011] It is an aim of the present invention to provide an improved or at least alternative
apparatus and method for measuring at least one property of an electron bunch or other
charged particle bunch, for example in a radiation source.
SUMMARY
[0012] According to an aspect of the invention, there is provided a measurement apparatus
for measuring at least one property of an electron bunch or other group of charged
particles travelling through a cavity, comprising: a plurality of electrodes arranged
around the cavity; a plurality of optical sensors, wherein the plurality of electrodes
are configured to provide signals to the optical sensors thereby to modulate at least
one optical property of the optical sensors; at least one laser source for providing
a laser beam comprising a series of laser pulses to the plurality of optical sensors
to obtain measurements representative of said at least one optical property of the
optical sensors; and a processing resource configured to process at least a first
measurement signal from a first one of the optical sensors and a second measurement
signal from a second one of the optical sensors, thereby to determine at least one
property of the electron bunch or other group of charged particles, wherein the at
least one property comprises: charge and/or lateral position.
[0013] Thus, measurements charge and/or lateral position of individual electron bunches
within a bunch train, or other individual groups of charged particles, may be obtained.
That can be particularly useful in the context of a LINAC of a free electron radiation
source in which closely spaced electron bunches of different energies make up an electron
bunch train that passes through the LINAC, and in which variations in charge and/or
position of the bunches of different energies can ultimately have a significant effect
on the radiation produced by the radiation source.
[0014] The lateral position may comprise position in a plane perpendicular to a longitudinal
direction of the cavity and/or perpendicular to a desired path of the electron bunch.
Each sensor may comprise at least one sensing component, for example, a suitable electro-optic
modulator crystal and at least one measuring component, for example a diode or other
electronic component or circuitry, to provide a measurement signal that is dependent
on said at least one optical property of the at least one sensing component.
[0015] The plurality of optical sensors may comprise a plurality of electro-optic modulators,
the first one of the optical sensors may comprise a first one of the electro-optic
modulators, and the second one of the optical sensors may comprise a second one of
the electro-optic modulators. The plurality of optical sensors may comprise a plurality
of electro-optic crystals.
[0016] The at least one property may comprise lateral position, and the processing of the
first measurement signal, which is from the first one of the optical sensors. and
the second measurement signal, which is from the second one of the optical sensors,
may comprise determining a difference between the first measurement signal and the
second measurement signal.
[0017] The plurality of optical sensors may comprise at least one further optical sensor,
and the processing resource may be further configured to process at least one further
measurement signal from said at least one further optical sensor, to determine said
at least one property.
[0018] The processing resource may be configured to process a third measurement signal from
a third one of the optical sensors and a fourth measurement signal from a fourth one
of the optical sensors.
[0019] The processing of the first measurement signal and the second measurement signal
may be to determine a position of the electron bunch or other group of charged particles
in a first lateral direction, and the processing of the third measurement signal and
the fourth measurement signal may be to determine a position of the electron bunch
or other group of charged particles in a second lateral direction.
[0020] The second direction may be substantially orthogonal to the first direction. The
first direction and the second direction may be in a plane substantially orthogonal
to the path of the electron bunch or other group of charged particles.
[0021] The at least one property of the electron bunch or other group of charged particles
may comprise charge of the electron bunch or other group of charged particles, and
the processing resource may be configured to determine the charge in dependence on
a sum of measurement signals.
[0022] The sum of measurement signals may comprise or be representative of a sum of at least
the first and second measurement signals.
[0023] The sum of measurement signals may comprise or be representative of a sum of at least
the first, second, third and fourth measurement signals.
[0024] The first optical sensor from which the first measurement signal is obtained may
receive signals from a first one of the electrodes, and the second optical sensor
from which the second measurement signal is obtained may receive signals from a second
one of the electrodes.
[0025] The first one of the electrodes may be substantially diametrically opposed to the
second one of the electrodes.
[0026] The third optical sensor from which the third measurement signal is obtained may
receive signals from a third one of the electrodes, and the fourth optical sensor
from which the fourth measurement signal is obtained may receive signals from a fourth
one of the electrodes
[0027] The third one of the electrodes may be substantially diametrically opposed to the
fourth one of the electrodes with respect to the path of the electron bunch or other
group of charged particles.
[0028] The apparatus may comprise a propagation cavity. The first one of the electrodes
may be arranged at one side of the propagation cavity and the second one of the electrodes
may be arranged at the opposite side of the propagation cavity. The first one of the
electrodes may be arranged at an angular separation of approximately 180 degrees from
the second one of the electrodes. The third one of the electrodes may be arranged
at an angular separation of approximately 180 degrees from the fourth one of the electrodes.
The first, second, third and fourth electrodes may be arranged to have angular separations
of approximately 90 degrees. The apparatus may comprise further electrodes in addition
to the first, second, third and fourth electrodes. Angular separations other than
approximately 90 degrees or approximately 180 degrees may be used. Signals from the
further electrodes may, for example, be used as a check or to obtain improved signal-to-noise
ratio or to obtain further information concerning the electron bunch or other group
of charged particles.
[0029] The laser source may be configured to provide the series of laser pulses such that
the first measurement signal comprises a local maximum signal for the first one of
the optical sensors and the second measurement signal comprises a local maximum signal
for the second one of the optical sensors.
[0030] The optical sensors and the electrodes may be arranged such that in operation each
one of the optical sensors receives signals from a respective single one of the electrodes.
[0031] The apparatus may further comprise a beam splitter for splitting the laser beam,
such that synchronised series of laser pulses are provided to each of the optical
sensors.
[0032] The laser source, the beam splitter and the optical sensors may be arranged so that
in operation laser pulses arrive substantially simultaneously at each of the optical
sensors.
[0033] The electron bunch or other group of charged particles may be one of a sequence of
electron bunches or other groups of charged particles, the sequence of electron bunches
or other groups of charged particles may comprise electron bunches or other groups
of charged particles each having one of a plurality of different energies.
[0034] The sequence of electron bunches or other groups of charged particles may comprise
a sequence of electron bunches or other groups of charged particles of a radiation
source, and a controller may be configured to alter an operating parameter of the
radiation source for electron bunches or other groups of charged particles having
a selected one of the plurality of energies.
[0035] The controller may be configured to monitor at least one of the first measurement
signal, the second measurement signal, and/or a parameter derived from the first measurement
signal and/or the second measurement signal, thereby to identify whether the electron
bunch or other group of charged particles whose lateral position and/or charge is
determined is an electron bunch or other group of charged particles of the selected
energy. The operating parameter may comprise a timing parameter.
[0036] Energies of electron bunches or other groups of charged particles of the sequence
may be in a range 100 MeV to 1000 MeV.
[0037] The processing resource may be configured to determine said at least one property
for a succession of electron bunches or other groups of charged particles and to monitor
for a change in a value of said property.
[0038] In a further aspect of the invention, which may be provided independently, there
is provided a method of measuring at least one property of an electron bunch or other
group of charged particles travelling through a cavity, comprising: obtaining signals
from a plurality of electrodes arranged around the cavity; providing the signals to
a plurality of optical sensors, thereby to modulate at least one optical property
of the optical sensors; obtaining measurements representative of said at least one
optical property of the optical sensors; and processing at least a first measurement
signal from a first one of the optical sensors and a second measurement signal from
a second one of the optical sensors, thereby to determine at least one property of
the electron bunch or other group of charged particles, wherein the at least one property
comprises: charge and/or lateral position.
[0039] In another aspect of the invention, which may be provided independently, there is
provided a radiation source comprising: an electron source for generating bunches
of electrons; at least one linear accelerator (LINAC) for accelerating and decelerating
the bunches of electrons; an undulator configured such that in operation passage of
the bunches of electrons through the undulator generates radiation at a desired wavelength;
a plurality of steering units for guiding the bunches of electrons along a desired
electron bunch path between the electron source, the at least one LINAC and the undulator;
and a measurement apparatus as claimed or described herein arranged to measure at
least one property of an electron bunch in the radiation source.
[0040] In another aspect of the invention, which may be provided independently, there is
provided a lithographic system comprising a radiation source as claimed or described
herein, and a lithographic apparatus arranged to receive radiation from the radiation
source and to use the radiation to project a pattern from a patterning device onto
a substrate.
[0041] Aspects and/or features of the invention set out above or below may be combined with
other aspects and/or features of the invention as will be readily apparent to the
skilled person.
BRIEF DESCRIPTION OF THE DRAWINGS
[0042] Embodiments of the invention will now be described, by way of example only, with
reference to the accompanying schematic drawings, in which:
- Figure 1 is a schematic illustration of a lithographic system comprising a radiation
source and a plurality of lithographic apparatus;
- Figure 2 is a schematic illustration of a lithographic apparatus that forms part of
the lithographic system of Figure 1;
- Figure 3 is a schematic illustration of a free electron laser;
- Figure 4 is a schematic illustration of a lithographic system including a radiation
source comprising two free electron lasers;
- Figure 5 is a schematic illustration of an optical system;
- Figure 6 is a schematic illustration of a further free-electron laser;
- Figure 7 is a schematic illustration of a free-electron laser radiation source including
two energy-recover multi-pass LINACs; and
- Figure 8 is a schematic diagram of a measurement apparatus for measuring properties
of electron bunches according to an embodiment.
DETAILED DESCRIPTION
[0043] Figure 1 shows a lithographic system LS, comprising: a radiation source SO, a beam
splitting apparatus 20 and a plurality of lithographic apparatus LA
1-LA
20. The radiation source SO comprises at least one free electron laser and is configured
to generate an extreme ultraviolet (EUV) radiation beam B (which may be referred to
as a main beam). The main radiation beam B is split into a plurality of radiation
beams B
1-B
20 (which may be referred to as branch beams), each of which is directed to a different
one of the lithographic apparatus LA
1-LA
20, by the beam splitting apparatus 20. The branch radiation beams B
1-B
20 may be split off from the main radiation beam B in series, with each branch radiation
beam being split off from the main radiation beam B downstream from the preceding
branch radiation beam. The beam splitting apparatus may, for example, comprise a series
of mirrors (not shown) which are each configured to split off a portion of the main
radiation beam B into a branch radiation beam B
1-B
20.
[0044] The branch radiation beams B
1-B
20 are depicted in Figure 1 as being split off from the main radiation beam B such that
the branch radiation beams B
1-B
20 propagate in directions which are approximately perpendicular to the direction of
propagation of the main radiation beam B. However, in some embodiments the branch
radiation beams B
1-B
20 may instead be split off from the main radiation beam B such that an angle between
the direction of propagation of each branch radiation beam B
1-B
20 and the direction of propagation of the main radiation beam is substantially less
than 90 degrees. This may allow mirrors of the beam splitting apparatus to be arranged
such that the main radiation beam B is incident on the mirrors at an angle of incidence
which is less than normal. This may advantageously decrease the amount of radiation
which is absorbed by the mirrors and therefore increase the amount of radiation which
is reflected from the mirrors and which is provided to the lithographic apparatus
LA
1-LA
20 via the branch radiation beams B
1-B
20.
[0045] The lithographic apparatus LA
1-LA
20 may all be positioned on the same vertical level. The vertical level on which the
lithographic apparatus LA
1-LA
20 are positioned may be substantially the same vertical level as the vertical level
on which the beam splitting apparatus 20 is positioned and on which the main beam
B is received from the radiation source SO. Alternatively, the beam splitting apparatus
20 may direct at least some of the branch radiation beams B
1-B
20 to one or more different vertical levels on which at least some of the lithographic
apparatus LA
1-LA
20 are positioned. For example, the main radiation beam B may be received by the beam
splitting apparatus on a basement or ground floor vertical level. The beam splitting
apparatus 20 may direct at least some branch radiation beams B
1-B
20 to a vertical level which is positioned above the beam splitting apparatus and on
which at least some of the lithographic apparatus LA
1-LA
20 are positioned. The lithographic apparatus LA
1-LA
20 may be positioned on multiple vertical levels and as such the beam splitting apparatus
20 may direct the branch radiation beams B
1-B
20 to different vertical levels in order to be received by the lithographic apparatus
LA
1-LA
20.
[0046] The radiation source SO, beam splitting apparatus 20 and lithographic apparatus LA
1-LA
20 may all be constructed and arranged such that they can be isolated from the external
environment. A vacuum may be provided in at least part of the radiation source SO,
beam splitting apparatus 20 and lithographic apparatus LA
1-LA
20 so as to minimise the absorption of EUV radiation. Different parts of the lithographic
system LS may be provided with vacuums at different pressures (i.e. held at different
pressures which are below atmospheric pressure).
[0047] Figure 2 is a schematic depiction of a lithographic apparatus LA
1 of the lithographic system LS shown in Figure 1. The lithographic apparatus LA
1 comprises an illumination system IL, a support structure MT configured to support
a patterning device MA (e.g. a mask), a projection system PS and a substrate table
WT configured to support a substrate W. The illumination system IL is configured to
condition the branch radiation beam B
1 that is received by the lithographic apparatus LA
1 before it is incident upon the patterning device MA. The projection system PS is
configured to project the branch radiation beam B
1 (now patterned by the mask MA) onto the substrate W. The substrate W may include
previously formed patterns. Where this is the case, the lithographic apparatus aligns
the patterned radiation beam B
1 with a pattern previously formed on the substrate W.
[0048] The branch radiation beam B
1 that is received by the lithographic apparatus LA
1 passes into the illumination system IL from the beam splitting apparatus 20 through
an opening 8 in an enclosing structure of the illumination system IL. Optionally,
the branch radiation beam B
1 may be focused to form an intermediate focus at or near to the opening 8.
[0049] The illumination system IL may include a facetted field mirror device 10 and a facetted
pupil mirror device 11. The faceted field mirror device 10 and faceted pupil mirror
device 11 together provide the radiation beam B
1 with a desired cross-sectional shape and a desired angular distribution. The radiation
beam B
1 passes from the illumination system IL and is incident upon the patterning device
MA held by the support structure MT. The patterning device MA reflects and patterns
the radiation beam to form a patterned beam B
11. The illumination system IL may include other mirrors or devices in addition to or
instead of the faceted field mirror device 10 and faceted pupil mirror device 11.
The illumination system IL may for example include an array of independently moveable
mirrors. The independently moveable mirrors may for example measure less than 1mm
across. The independently moveable mirrors may for example be MEMS devices.
[0050] Following reflection from the patterning device MA the patterned radiation beam B
11 enters the projection system PS. The projection system comprises a plurality of mirrors
13, 14 which are configured to project the radiation beam B
11 onto a substrate W held by the substrate table WT. The projection system PS may apply
a reduction factor to the radiation beam, forming an image with features that are
smaller than corresponding features on the patterning device MA. A reduction factor
of 4 may for example be applied. Although the projection system PS has two mirrors
13, 14 in Figure 2, the projection system may include any number of mirrors (e.g.
six mirrors).
[0051] In some embodiments a lithographic system LS may include one or more mask inspection
apparatus (not shown). A mask inspection apparatus may include optics (e.g. mirrors)
configured to receive a branch radiation beam B
1-B
20 from the beam splitting apparatus 20 and direct the branch radiation beam at a mask
MA. The mask inspection apparatus may further include optics (e.g. mirrors) configured
to collect radiation reflected from the mask and form an image of the mask at an imaging
sensor. The image received at the imaging sensor may be used to determine one or more
properties of the mask MA. The mask inspection apparatus may, for example, be similar
to the lithographic apparatus LA1 shown in Figure 2, with the substrate table WT replaced
with an imaging sensor.
[0052] In some embodiments a lithographic system LS may include one or more Aerial Image
Measurement System (AIMS) which may be used to measure one or more properties of a
mask MA. An AIMS may, for example, be configured to receive a branch radiation beam
B
1-B
20 from the beam splitting apparatus 20 and use the branch radiation beam B
1-B
20 to determine one or more properties of a mask MA.
[0053] The radiation source SO comprises a free electron laser FEL which is operable to
produce a beam of EUV radiation. Optionally, the radiation source SO may comprise
more than one free electron laser FEL.
[0054] A free electron laser comprises an electron source, which is operable to produce
a bunched relativistic electron beam, and a periodic magnetic field through which
the bunches of relativistic electrons are directed. The periodic magnetic field is
produced by an undulator and causes the electrons to follow an oscillating path about
a central axis. As a result of the acceleration caused by the magnetic fields the
electrons spontaneously radiate electromagnetic radiation generally in the direction
of the central axis. The relativistic electrons interact with radiation within the
undulator. Under certain conditions, this interaction causes the electrons to bunch
together into microbunches, modulated at the wavelength of radiation within the undulator,
and coherent emission of radiation along the central axis is stimulated.
[0055] Figure 3 is a schematic depiction of a free electron laser FEL comprising an electron
source 21, a linear accelerator 22, a steering unit 23 and an undulator 24. The electron
source 21 may alternatively be referred to as an injector.
[0056] The electron source 21 is operable to produce a beam of electrons E. The electron
source 21 may, for example, comprise a photo-cathode or a thermionic cathode and an
accelerating electric field. The electron beam E is a bunched electron beam E which
comprises a series of bunches of electrons. The electron beam E is accelerated to
relativistic energies by the linear accelerator 22. In an example, the linear accelerator
22 may comprise a plurality of radio frequency cavities, which are axially spaced
along a common axis, and one or more radio frequency power sources, which are operable
to control the electromagnetic fields along the common axis as bunches of electrons
pass between them so as to accelerate each bunch of electrons. The cavities may be
superconducting radio frequency cavities. Advantageously, this allows: relatively
large electromagnetic fields to be applied at high duty cycles; larger beam apertures,
resulting in fewer losses due to wakefields; and for the fraction of radio frequency
energy that is transmitted to the beam (as opposed to dissipated through the cavity
walls) to be increased. Alternatively, the cavities may be conventionally conducting
(i.e. not superconducting), and may be formed from, for example, copper. Other types
of linear accelerators may also be used. For example, the linear accelerator 22 may
comprise a laser accelerator, wherein the electron beam E passes through a focused
laser beam and the electric field of the laser beam causes the electrons to accelerate.
[0057] The relativistic electron beam E which exits the linear accelerator 22 enters the
steering unit 23. The steering unit 23 is operable to alter the trajectory of the
relativistic electron beam E so as to direct the electron beam E from the linear accelerator
22 to the undulator 24. The steering unit 23 may, for example, comprise one or more
electromagnets and/or permanent magnets configured to generate a magnetic field in
the steering unit 23. The magnetic field exerts a force on the electron beam E which
acts to alter the trajectory of the electron beam E. The trajectory of the electron
beam E upon leaving the linear accelerator 22 is altered by the steering unit 23 so
as to direct the electrons to the undulator 24.
[0058] In embodiments in which the steering unit 23 comprises one or more electromagnets
and/or permanent magnets, the magnets may be arranged to form one or more of a magnetic
dipole, a magnetic quadrupole, a magnetic sextupole and/or any other kind of multipole
magnetic field arrangement configured to apply a force to the electron beam E. The
steering unit 23 may additionally or alternatively comprise one or more electrically
charged plates, configured to create an electric field in the steering unit 23 such
that a force is applied to the electron beam E. In general the steering unit 23 may
comprise any apparatus which is operable to apply a force to the electron beam E to
alter its trajectory.
[0059] The steering unit 23 directs the relativistic electron beam E to the undulator 24.
The undulator 24 is operable to guide the relativistic electrons along a periodic
path so that the electron beam E interacts with radiation within the undulator 24
so as to stimulate emission of coherent radiation. Generally the undulator 24 comprises
a plurality of magnets, which are operable to produce a periodic magnetic field which
causes the electron beam E to follow a periodic path. As a result the electrons emit
electromagnetic radiation generally in the direction of a central axis of the undulator
24. The undulator 24 may comprise a plurality of sections (not shown), each section
comprising a periodic magnet structure. The electromagnetic radiation may form bunches
at the beginning of each undulator section. The undulator 24 may further comprise
a mechanism for refocusing the electron beam E such as, for example, a quadrupole
magnet in between one or more pairs of adjacent sections. The mechanism for refocusing
the electron beam E may reduce the size of the electron bunches, which may improve
the coupling between the electrons and the radiation within the undulator 24, increasing
the stimulation of emission of radiation.
[0060] As electrons move through the undulator 24, they interact with the electric field
of the electromagnetic radiation in the undulator 24, exchanging energy with the radiation.
In general the amount of energy exchanged between the electrons and the radiation
will oscillate rapidly unless conditions are close to a resonance condition, given
by:

where
λem is the wavelength of the radiation,
λu is the undulator period,
γ is the Lorentz factor of the electrons and
K is the undulator parameter.
A is dependent upon the geometry of the undulator 24: for a helical undulator
A=1, whereas for a planar undulator
A=2. In practice, each bunch of electrons will have a spread of energies although this
spread may be minimised as far as possible (by producing an electron beam E with low
emittance). The undulator parameter K is typically approximately 1 and is given by:

where
q and
m are, respectively, the electric charge and mass of the electrons,
B0 is the amplitude of the periodic magnetic field, and c is the speed of light.
[0061] The resonant wavelength
λem is equal to the first harmonic wavelength spontaneously radiated by electrons moving
through the undulator 24. The free electron laser FEL may operate in self-amplified
spontaneous emission (SASE) mode. Operation in SASE mode may require a low energy
spread of the electron bunches in the electron beam E before it enters the undulator
24. Alternatively, the free electron laser FEL may comprise a seed radiation source,
which may be amplified by stimulated emission within the undulator 24.
[0062] Electrons moving through the undulator 24 may cause the amplitude of radiation to
increase, i.e. the free electron laser FEL may have a non-zero gain. Maximum gain
may be achieved when the resonance condition is met or when conditions are close to
but slightly off resonance.
[0063] An electron which meets the resonance condition as it enters the undulator 24 will
lose (or gain) energy as it emits (or absorbs) radiation, so that the resonance condition
is no longer satisfied. Therefore, in some embodiments the undulator 24 may be tapered.
That is, the amplitude of the periodic magnetic field and/or the undulator period
λu may vary along the length of the undulator 24 in order to keep bunches of electrons
at or close to resonance as they are guided though the undulator 24. Note that the
interaction between the electrons and radiation within the undulator 24 produces a
spread of energies within the electron bunches. The tapering of the undulator 24 may
be arranged to maximise the number of electrons at or close to resonance. For example,
the electron bunches may have an energy distribution which peaks at a peak energy
and the tapering maybe arranged to keep electrons with this peak energy at or close
to resonance as they are guided though the undulator 24. Advantageously, tapering
of the undulator has the capacity to significantly increase conversion efficiency.
The use of a tapered undulator may increase the conversion efficiency (i.e. the portion
of the energy of the electron beam E which is converted to radiation in the radiation
beam B) by more than a factor of 2. The tapering of the undulator may be achieved
by reducing the undulator parameter K along its length. This may be achieved by matching
the undulator period
λu and/or the magnetic field strength
B0 along the axis of the undulator and/or a parameter (often denoted A) defining polarisation
of produced radiation and defined by undulator geometry to the electron bunch energy
to ensure that they are at or close to the resonance condition. Meeting the resonance
condition in this manner increases the bandwidth of the emitted radiation.
[0064] After leaving the undulator 24, the electromagnetic radiation is emitted as a radiation
beam B'. The radiation beam B' comprises EUV radiation and may form all or part of
the radiation beam B which is provided to the beam splitting apparatus 20 (depicted
in Figure 1) and which forms the branch radiation beams B
1-20 which are provided to the lithographic apparatus LA
1-20.
[0065] In the embodiment of a free electron laser which is depicted in Figure 3, the electron
beam E' which leaves the undulator 24 enters a second steering unit 25. The second
steering unit 25 alters the trajectory of the electron beam E' which leaves the undulator
24 so as to direct the electron beam E' back through the linear accelerator 22. The
second steering unit 25 may be similar to the steering unit 23 and may, for example,
comprise one or more electromagnets and/or permanent magnets. The second steering
unit 25 does not affect the trajectory of the radiation beam B' which leaves the undulator
24. The steering unit 25 therefore decouples the trajectory of the electron beam E'
from the radiation beam B'. In some embodiments, the trajectory of the electron beam
E' may be decoupled from the trajectory of the radiation beam B' (e.g. using one or
more magnets) before reaching the second steering unit 25.
[0066] The second steering unit 25 directs the electron beam E' to the linear accelerator
22 after leaving the undulator 24. Electron bunches which have passed through the
undulator 24 may enter the linear accelerator 22 with a phase difference of approximately
180 degrees relative to accelerating fields in the linear accelerator 22 (e.g. radio
frequency fields). The phase difference between the electron bunches and the accelerating
fields in the linear accelerator 22 causes the electrons to be decelerated by the
fields. The decelerating electrons E' pass some of their energy back to the fields
in the linear accelerator 22 thereby increasing the strength of the fields which accelerate
the electron beam E arriving from the electron source 21. This arrangement therefore
recovers some of the energy which was given to electron bunches in the linear accelerator
22 (when they were accelerated by the linear accelerator) in order to accelerate subsequent
electron bunches which arrive from the electron source 21. Such an arrangement may
be known as an energy recovering LINAC.
[0067] Electrons E' which are decelerated by the linear accelerator 22 are absorbed by a
beam dump 26. The steering unit 23 may be operable to decouple the trajectory of the
electron beam E' which has been decelerated by the linear accelerator 22 from the
trajectory of the electron beam E which has been accelerated by the linear accelerator
22. This may allow the decelerated electron beam E' to be absorbed by the beam dump
26 whilst the accelerated electron beam E is directed to the undulator 24.
[0068] Alternatively the free electron laser FEL may comprise a beam splitting unit (not
shown) which is separate from the steering unit 23 and which is configured to decouple
the trajectory of the accelerated electron beam E from the trajectory of the decelerated
electron beam E' upstream of the steering unit 23.
[0069] Alternatively the trajectory of the accelerated electron beam E may be decoupled
from the trajectory of the decelerated electron beam E' by generating a substantially
constant magnetic field. The difference in energies between the accelerated electron
beam E and the decelerated electron beam E' causes the trajectories of the two electron
beams to be altered by different amounts by the constant magnetic field. The trajectories
of the two electron beams will therefore become decoupled from each other.
[0070] The beam dump 26 may, for example, include a large amount of water or a material
with a high threshold for radioactive isotope generation by high energy electron impact.
For example, the beam dump 26 may include aluminium with a threshold for radioactive
isotope generation of approximately 15MeV. By decelerating the electron beam E' in
the linear accelerator 22 before it is incident on the beam dump 26, the amount of
energy the electrons have when they are absorbed by the beam dump 26 is reduced. This
reduces the levels of induced radiation and secondary particles produced in the beam
dump 26. This removes, or at least reduces, the need to remove and dispose of radioactive
waste from the beam dump 26. This is advantageous since the removal of radioactive
waste requires the free electron laser FEL to be shut down periodically and the disposal
of radioactive waste can be costly and can have serious environmental implications.
[0071] When operating as a decelerator, the linear accelerator 22 may be operable to reduce
the energy of the electrons E' to below a threshold energy. Electrons below this threshold
energy may not induce any significant level of radioactivity in the beam dump 26.
[0072] In some embodiments a decelerator (not shown) which is separate to the linear accelerator
22 may be used to decelerate the electron beam E' which has passed through the undulator
24. The electron beam E' may be decelerated by the decelerator in addition to being
decelerated by the linear accelerator 22 or instead of being decelerated by the linear
accelerator 22. For example, the second steering unit 25 may direct the electron beam
E' through a decelerator prior to the electron beam E' being decelerated by the linear
accelerator 22. Additionally or alternatively the electron beam E' may pass through
a decelerator after having been decelerated by the linear accelerator 22 and before
being absorbed by the beam dump 26. Alternatively the electron beam E' may not pass
through the linear accelerator 22 after leaving the undulator 24 and may be decelerated
by one or more decelerators before being absorbed by the beam dump 26.
[0073] Optionally, the free electron laser FEL may comprise one or more bunch compressors
(not shown). A bunch compressor may be disposed downstream or upstream of the linear
accelerator 22. A bunch compressor is configured to bunch electrons in the electron
beam E and spatially compress existing bunches of electrons in the electron beam E.
One type of bunch compressor comprises an acceleration field directed parallel to
the electron beam E. An electron in the electron beam E interacts with the provided
field and bunches with other electrons nearby. The imposed energy difference for electrons
in the bunch translates into a different propagation time to the non-relativistic
case. Thus at a certain distance from such a bunch compressor the beam can be compressed
longitudinally. Another type of bunch compressor comprises a magnetic chicane, wherein
the length of a path followed by an electron as it passes through the chicane is dependent
upon its energy. This type of bunch compressor may be used to compress a bunch of
electrons which have been accelerated in a linear accelerator 22 by a plurality of
conductors whose potentials oscillate at, for example, radio frequencies.
[0074] A gain length of the undulator defines a characteristic scale of light amplification.
Gain length shortens with higher charge density in the bunch sent through the undulator.
Thus it can be beneficial to compress the bunch radially and longitudinally. Simultaneously,
bunch emittance degradation rate increases for a compressed bunch. That is, normalized
emittance grows per meter of propagation in the beam line, and higher losses due to
wakefields and coherent synchrotron radiation are associated with shorter bunches.
Thus it can be most beneficial to place a bunch compressor between the steering unit
23 and the undulator 24.
[0075] The free electron laser FEL shown in Figure 3 is housed within a building 31. The
building 31 may comprise walls which do not substantially transmit radiation which
is generated in the free electron laser FEL whilst the free electron laser FEL is
in operation. For example, the building 31 may comprise thick concrete walls (e.g.
walls which are approximately 4 metres thick). The walls of the building 31 may be
further provided with radiation shielding materials such as, for example, lead and/or
other materials which are configured to absorb neutrons and/or other radiation types.
Providing walls of a building 31 with radiation absorbing materials may advantageously
allow the thickness of the walls of the building 31 to be reduced. However adding
radiation absorbing materials to a wall may increase the cost of constructing the
building 31. A relatively cheap material which may be added to a wall of the building
31 in order to absorb radiation may, for example, be a layer of earth.
[0076] In addition to providing walls of the building 31 which have radiation shielding
properties. The building 31 may also be configured to prevent radiation generated
by the free electron laser FEL from contaminating ground water below the building
31. For example, the base and/or foundations of the building 31 may be provided with
radiation shielding materials or may be sufficiently thick to prevent radiation from
contaminating ground water below the building 31. In an embodiment the building 31
may be positioned at least partly underground. In such an embodiment ground water
may surround portions of the exterior of the building 31 as well as being below the
building 31. Radiation shielding may therefore be provided around the exterior of
the building 31 in order to prevent radiation from contaminating ground water which
surrounds the building 31.
[0077] In addition to or as an alternative to shielding radiation at the exterior of the
building 31, radiation shielding may also be provided inside of the building 31. For
example, radiation shielding may be provided inside the building 31 at locations proximate
to portions of the free electron laser FEL which emit large amounts of radiation.
[0078] The building 31 has a width W and a length L. The width W and the length L of the
building 31 is partly determined by the size of a loop 32 which the electron beam
E follows through the free electron laser FEL. The loop 32 has a length 33 and a width
35.
[0079] The length 33 of the loop 32 is determined by the length of the linear accelerator
22 and the length of the undulator 24. A given length of linear accelerator 22 may,
for example, be required in order to accelerate the electron beam E to high enough
energies such that the electrons emit EUV radiation in the undulator 24. For example,
a linear accelerator 22 may have a length of greater than about 40 metres. In some
embodiments a linear accelerator 22 may have a length of up to about 80 metres. Additionally
a given length of undulator 24 may be required in order to stimulate emission of coherent
radiation in the undulator 24. For example, an undulator 24 may have a length of greater
than about 40m. In some embodiments an undulator 24 may have a length of up to about
60 metres.
[0080] The width of the loop is determined by the radius of curvature with which the steering
unit 23 adjusts the trajectory of the electron beam E. The radius of curvature of
the electron beam E in the steering unit 23 may depend, for example, on the velocity
of the electrons in the electron beam E and on the strength of a magnetic field which
is generated in the steering unit 23. An increase in the strength of a magnetic field
which is generated in the steering unit 23 will decrease the radius of curvature of
the electron beam E whereas an increase in the velocity of the electrons will increase
the radius of curvature of the electron beam E. The radius of curvature of the electron
beam E through the steering unit 23 may, for example, be approximately 12m. In some
embodiments the radius of curvature of the electron beam E through the steering unit
23 may be less than 12m. For example, the radius of curvature of an electron beam
E through the steering unit 23 may be approximately 7m.
[0081] The loop 32 which the electron beam E follows through the free electron laser FEL
may have a length 33 which is greater than about 60 metres. In some embodiments the
loop 32 may have a length 33 which is up to about 120 metres. The loop 32 may have
a width 35 which is greater than about 12 metres. In some embodiments the loop 32
may have a width 35 which is up to about 25 metres.
[0082] The building 31 may also house other components. For example, electrical cabinets
37 which contain electrical components which supply electrical power to, for example,
the undulator 24, the steering units 23, 25 and/or other components of the free electron
laser FEL may be housed within the building 31. It may be advantageous to provide
the electrical cabinets 37 in close proximity to the undulator 24 as is shown in Figure
3. However electrical cabinets 37 may be positioned in other positions relative to
the components of the free electron laser FEL.
[0083] Additionally cryogenic cooling cabinets 39 which contain apparatus which is configured
to provide cryogenic cooling to components of the free electron laser FEL may be housed
within the building 31. Cryogenic cooling may, for example, be provided to the linear
accelerator 22 and may cool superconducting cavities of the linear accelerator 22.
It may be advantageous to provide the cryogenic cooling cabinets 39 in close proximity
to the linear accelerator 22. This may reduce any energy loss between the cryogenic
cooling cabinets 39 and the linear accelerator 22.
[0084] It may be desirable to provide electrical cabinets 37 and cryogenic cooling cabinets
39 on the outside of the loop 32 which the electron beam E follows through the free
electron laser FEL (as is shown in Figure 3). Providing the cabinets 37, 39 on the
outside of the loop 32 may allow easy access to the cabinets, for example, to monitor,
control, maintain and/or repair components which are housed within the cabinets 37,
39. As will be appreciated from Figure 3, positioning the cabinets 37, 39 on the outside
of the loop 32 may increase the minimum width W of the building 31 which is required
to house the components of the free electron laser FEL within the building 31. The
building 31 may also house other components which are not shown in Figure 3 which
may also determine the dimensions of the building 31.
[0085] As is shown in Figure 3, a wall 47 is positioned between the loop 32 which the electron
beam follows through the free electron laser FEL and the electric cabinets 37. A wall
47 is also positioned between the loop 32 and the cryogenic cooling cabinets 39. The
walls 47 may shield the electric cabinets 37 and the cryogenic cabinets 39 from radiation
which is generated by the electron beam E in the free electron laser FEL. This protects
the components in the cabinets 37, 39 from being damaged by radiation and may allow
maintenance workers to access the cabinets 37, 39 whilst the free electron laser FEL
is in operation without being exposed to dangerous levels of radiation.
[0086] In the embodiment depicted in Figure 3 the cabinets 37, 39 are shown as being housed
in the same building 31 as the loop 32 which the electron beam follows through the
free electron laser FEL whilst being shielded from the loop 32 by the walls 47. The
cryogenic cooling components which are housed within the cabinets 39 may generate
vibrations which may be transferred to components of the free electron laser FEL and
may adversely affect components of a free electron laser FEL which are sensitive to
vibrations. In order to prevent vibrations which are generated by cryogenic cooling
components from transferring to sensitive parts of the free electron laser, a portion
of the building 31 in which the cryogenic cooling cabinets 39 are housed may be mechanically
isolated from the portion of the building in which sensitive components are housed.
For example, the cryogenic cooling cabinets 39 may be mechanically isolated from the
linear accelerator 22, the steering unit 23 and the undulator 24. In order to provide
mechanical isolation the portion of the building 31 in which the cryogenic cooling
cabinets 39 are housed may, for example, have separate foundations to a portion of
the building in which the linear accelerator 22, the steering unit 23 and the undulator
24 are housed.
[0087] Alternatively the cryogenic cooling cabinets 39 and/or the electrical cabinets 37
may be housed in one or more buildings which are separate from the building 31. This
may ensure that the cabinets 37, 39 are shielded from radiation which is produced
by the electron beam E and that sensitive components of the free electron laser FEL
are mechanically isolated from the cryogenic cooling cabinets 39.
[0088] A lithographic system LS may comprise a single free electron laser FEL. The free
electron laser FEL may supply an EUV radiation beam to a beam splitting apparatus
20 which provides branch radiation beams to a plurality of lithographic apparatus.
The radiation source SO may comprise an optical system which includes dedicated optical
components configured to direct a radiation beam B' output from a free electron laser
FEL to a beam splitter 20 of a lithographic system LS. Since EUV radiation is generally
well absorbed by all matter, reflective optical components are generally used (rather
than transmissive components) so as to minimise losses. The dedicated optical components
of the optical system may adapt the properties of the radiation beam produced by the
free electron laser FEL so that it is suitable for acceptance by the illumination
systems IL of the lithographic apparatus LA
1-LA
20 and/or a mask inspection apparatus.
[0089] Alternatively a radiation source SO may comprise a plurality of free electron lasers
(e.g. two free electron lasers) which may each provide an EUV radiation beam to an
optical system which also forms part of the radiation source SO. The optical system
may receive a radiation beam from each of a plurality of free electron lasers and
may combine the radiation beams into a composite radiation beam which is provided
to a beam splitting apparatus 20 in order to provide branch radiation beams B
1-B
20 to lithographic apparatus LA
1-LA
20.
[0090] Figure 4 is a schematic depiction of a lithographic system LS which includes a radiation
source SO comprising a first free electron laser FEL' and a second free electron laser
FEL". The first free electron laser FEL' outputs a first EUV radiation beam B' and
the second free electron laser FEL" outputs a second EUV radiation beam B". The first
free electron laser FEL' is housed within a first building 31'. The second free electron
laser FEL" is housed within a second building 31".
[0091] The first and second radiation beams B', B" are received by an optical system 40.
The optical system 40 comprises a plurality of optical elements (e.g. mirrors) which
are arranged to receive the first radiation beam B' and the second radiation beam
B" and output a main radiation beam B. At times at which both the first and second
free electron lasers are operating, the main radiation beam B is a composite radiation
beam which comprises radiation from both the first and second radiation beams B',
B". The composite radiation beam B is provided to the beam splitting apparatus 20
which provides branch radiation beams B
1-B
20 to lithographic apparatus LA
1-LA
20.
[0092] The arrangement which is depicted in Figure 4 in which two free electron lasers are
arranged to provide radiation beams B', B" to form a main radiation beam B, may allow
one of the free electron lasers to be turned off whilst radiation is continuously
provided to the lithographic apparatus LA
1-LA
20. For example, one of the free electron lasers may be taken out of operation in order
to, for example, allow the free electron laser to be repaired or to undergo maintenance.
In this event the other free electron laser may continue to provide a radiation beam
which is received by the optical system 40. In the event that only one of the free
electron lasers provides radiation to the optical system 40, the optical system 40
is operable to form a main radiation beam B which comprises radiation from the free
electron laser which is providing radiation to the optical system 40. This allows
for continuous operation of the lithographic apparatus LA
1-LA
20 even when one of the free electron lasers is taken out of operation.
[0093] Figure 5 is a schematic depiction of an embodiment of an optical system 40 according
to an embodiment of the invention which is arranged to receive a beam of radiation
B', B" from each of the free electron lasers FEL', FEL" and to output an output radiation
beam B. The radiation beam B that is output by the optical system 40 is received by
the beam splitting apparatus 20 (see Figure 1).
[0094] The optical system 40 comprises four optical elements: first and second optical elements
132, 134 associated with a first one of the free electron lasers FEL'; and first and
second optical elements 136, 138 associated with a second one of the free electron
lasers FEL". The optical elements 132, 134, 136, 138 are arranged to alter the size
and shape of the cross section of the radiation beams B', B" from the free electron
lasers FEL', FEL".
[0095] In particular, the first optical elements 132, 136 are convex mirrors, which act
to increase the cross sectional area of the radiation beams B', B" from the free electron
lasers FEL', FEL". Although in Figure 5 the first optical elements 132, 136 appear
to be substantially flat in the x-y plane they may be convex both in this plane and
in the z direction. Since the first optical elements 132, 136 are convex, they will
increase the divergence of the EUV radiation beams B', B", thereby decreasing the
heat load on mirrors downstream of them. The first optical element 132 is therefore
a diverging optical element arranged to increase the cross sectional area of the radiation
beam B' received from the first free electron laser FEL'. The first optical element
136 is a diverging optical element arranged to increase the cross sectional area of
the radiation beam B" received from the second free electron laser FEL. This may allow
mirrors downstream to be of a lower specification, with less cooling, and therefore
less expensive. Additionally or alternatively, it may allow the downstream mirrors
to be nearer to normal incidence. In practice, the radiation beam B output by the
radiation source SO may be split by a plurality of consecutive, static, knife edge
mirrors arranged in series in the path of the beam B. Increasing the size of the beam
B (by, for example, using convex mirrors as the first optical elements 132, 136) reduces
the accuracy with which the mirrors must be located in the beam B path. Therefore,
this allows for more accurate splitting of the output beam B by the splitting apparatus
20.
[0096] The second optical elements 134, 138 are concave and are complementary in shape to
the first optical elements such that the beams leaving the second optical elements
134, 138 have substantially zero divergence. Therefore, downstream of the second optical
elements 134, 138 the beams are substantially collimated. Again, although in Figures
5 the second optical elements 134, 138 appear to be substantially flat in the x-y
plane they are in fact concave both in this plane and in the z direction.
[0097] It may be preferable for the output beam B, which is received by the beam splitting
apparatus 20, to have a different shape and/or intensity distribution to that output
by the free electron lasers FEL', FEL". For example, a rectangular shape may be preferable
to a circular beam for consecutive knife edge extraction mirrors within the beam splitting
apparatus 20. Therefore, in addition to increasing the cross sectional area of the
radiation beams B', B", the optical elements 132, 134, 136, 138 may act to alter the
cross sectional shape of the radiation beams B', B". In particular, the optical elements
132, 134, 136, 138 may be astigmatic or aspherical and may be shaped so as to ensure
that the radiation beams B', B" leaving the second optical elements 134, 138 are more
rectangular in shape than the radiation beams B', B" produced by the free electron
lasers FEL', FEL". For example, the optical elements may be shaped so that the beams
B', B" leaving the second optical elements 134, 138 are generally rectangular but
with rounded corners, although other shapes are also possible. The two dimensions
of such a rectangular shape may be related to radii of curvature of the optical elements
in two perpendicular directions such as, for example, in the x-y plane and in the
z direction. Advantageously, this allows the mirrors that are used to split the output
radiation beam B into branch radiation beams B
1-B
20 (see Figure 1) before they enter the lithographic apparatuses LA
1-LA
20, to be identical or at least very similar. This is especially beneficial from a manufacturing
point of view.
[0098] When both of the free electron lasers FEL', FEL" are on, the optical system 40 is
operable to combine their radiation beams B', B" to form a composite radiation beam
B. In this embodiment, this is achieved by offsetting the first and second optical
elements 132, 134 of the first free electron laser FEL' from those 136, 138 of the
second free electron laser FEL" in the x-direction so that the beams B', B" leaving
the second optical elements 134, 138 are both adjacent to each other and mutually
parallel. In particular, the first and second optical elements 132, 134 of the first
free electron laser FEL' are disposed "downstream" (with respect to the direction
of propagation of the laser beams B', B") of those 136, 138 of the second free electron
laser FEL".
[0099] In such an arrangement, the optical system 40 is operable to combine the two radiation
beams B', B" to form a composite radiation beam. The composite beam is the output
radiation beam B output by the optical system 40. It will be appreciated that Figure
5 is merely exemplary and that the optical system 40 may be implemented other than
as shown in Figure 5.
[0100] Referring again to Figure 4, the buildings 31', 31" are configured to substantially
prevent radiation (other than the radiation beams B', B") which is generated by an
operating free electron laser from propagating out of the buildings 31', 31". Housing
the first and second free electron lasers inside separate buildings therefore allows
maintenance and/or repair to be safely carried out on one of the free electron lasers
whilst the other free electron laser continues to operate. For example, the first
electron laser FEL' may be taken out of operation in order to allow the first free
electron laser FEL' to be repaired or to undergo maintenance. During this time the
second free electron laser FEL" may continue to operate in order to provide radiation
to the optical system 40 and to the lithographic apparatus LA
1-LA
20. Radiation will therefore be generated in the second building 31" due to the operation
of the second free electron laser FEL". Dangerous levels of radiation do not however
leave the second building 31" and do not enter the first building 31' due to the radiation
shielding which is provided by the walls of the second building 31". The first building
may therefore be safely entered by maintenance workers in order to repair or carry
out maintenance to the first free electron laser FEL'.
[0101] A further pass FEL radiation source is now described briefly with reference to Figure
6. The single pass FEL radiation source of Figure 6 is similar to that of Figure 3,
and includes an electron source in the form of injector 221, a merger component 219
for merging electron bunches from the injector 221 into an electron bunch stream,
a LINAC 222 including a series of LINAC modules, an undulator 224, and a demerger
component 225 for extracting decelerated electron bunches and directing them towards
a beam dump 226. The radiation source also includes steering units, not shown in Figure
6, that are operable to direct electron bunches along an electron bunch path 227 leading
from the injector 221 through the LINAC 222, where they are accelerated, through the
undulator 224, back through the LINAC 222, where they are decelerated, and then to
the dump 226.
[0102] Each of the components of the single pass FEL radiation source 220 of Figure 6 is
similar or the same as a corresponding component of the radiation source of Figure
3, and both radiation sources operate in a similar way.
[0103] In operation of the FEL radiation source 220, each electron bunch passes through
the LINAC 222 once during an acceleration phase, and once during a deceleration phase,
and hence the FEL radiation source may be referred to as a single pass FEL radiation
source.
[0104] The acceleration phase of an electron bunch in this case may be considered to comprise
the passage of the electron bunch from the entry to the LINAC 222 for the first time
until the entry of the electron bunch into the undulator 224, even though it will
be appreciated that the increase in energy of the electron bunch during the acceleration
phase primarily occurs during passage of the electron bunch through the LINAC. The
deceleration phase of an electron bunch in this case may be considered to comprise
the passage of the electron bunch from the exit of the undulator 224 up to the exit
of the electron bunch from the LINAC 222 for the last time, even though it will be
appreciated that the decrease in energy of the electron bunch during the deceleration
phase primarily occurs during passage of the electron bunch through the LINAC 222.
[0105] Turning to a two-pass rather than a single-pass configuration, a two-pass FEL radiation
source 240 according to an embodiment is illustrated schematically in Figure 7.
[0106] The two pass, split acceleration FEL radiation source 240 of Figure 7 includes an
electron source in the form of injector 241, a merger component 239 for merging electron
bunches from the injector 241 into an electron bunch stream, a pair of LINACs 242a,
242b each including a series of LINAC modules, an undulator 244, and a demerger component
245 for extracting decelerated electron bunches and directing them towards a beam
dump 246. The radiation source also includes steering units, not shown in Figure 6,
that are operable to direct electron bunches along an electron bunch path 247.
[0107] Each of the components of the single pass FEL radiation source 240 of Figure 7 is
similar or the same as a corresponding component of the FEL radiation sources of Figures
3 or 6. The radiation source 242 is configured to operate in such a way that, for
each of the LINACs 242a, 242b accelerating and decelerating electron bunches pass
through the LINAC closely spaced in time and 180 degrees out of phase relative to
the r.f. fields such that energy is effectively exchanged between the accelerating
and decelerating bunches and the LINAC operates as an energy recovery LINAC.
[0108] In operation of the FEL radiation source 240, each electron bunch passes through
each of the LINACs 242a, 242b twice during an acceleration phase and twice during
a deceleration phase, and hence the FEL radiation source may be referred to as a two-pass
FEL radiation source.
[0109] The acceleration phase of an electron bunch in this case may be considered to comprise
the passage of the electron bunch from the entry to the LINAC 242a for the first time
until the entry of the electron bunch into the undulator 244, even though it will
be appreciated that the increase in energy of the electron bunch during the acceleration
phase primarily occurs during passage of the electron bunch through the LINACs 242a,
242b. The deceleration phase of an electron bunch in this case may be considered to
comprise the passage of the electron bunch from the exit of the undulator 244 up to
the exit of the electron bunch from the LINAC 244a for the last time, even though
it will be appreciated that the decrease in energy of the electron bunch during the
deceleration phase primarily occurs during passage of the electron bunch through the
LINACs 242a, 242b.
[0110] An electron bunch path 247 is shown schematically in Figure 7 and certain sequential
points on the electron bunch path 247 for an electron bunch leaving the injector 241
are indicated by reference numerals a1, a2, a3, a4, a5, a6, a7, a8. An electron bunch
passes between points a1 to a8, also passing through the LINACs 242a, 242b and the
undulator 244, as can be understood by following the path 247 of Figure 7 via points
a1 to a8. The electron bunch path includes a number of loops such that each electron
bunch passes through the LINACs more than once, as can be seen from Figure 7. In operation,
a repeating bunch train comprising successive electron bunches of different energies
(for example, energies in a range 100 MeV to 1000 MeV) passes through the LINACs 242a,
242b.
[0111] In one embodiment the electron bunch repetition frequency may be around 1.5 GHz,
but could have any other suitable value in other embodiments, for example in a range
100 MHz to 2 GHz. The electron bunches may, for example, have an electron bunch duration
in a range 10 fs r.m.s. to 10 ps r.m.s (when measured at the electron source) but
could have other suitable durations in alternative embodiments.
[0112] A measurement apparatus for measuring charge or position of electron bunches as they
pass through a LINAC, for example LINAC 242b of the apparatus of Figure 7, is now
described. A pickup apparatus forming part of the measurement apparatus includes electrodes
302, 304, 306, 308 arranged around a cavity 310 through which the electron bunches
pass in operation. The pickup apparatus also includes housings (not shown) for the
electrodes and for electrical connections that are arranged to provide signals from
the electrodes 302, 304, 306, 308 to electro-optic modulators 322, 324, 326, 328 comprising
electro-optic crystals. The electro-optic modulators 322, 324, 326, 328 are Mach-Zender
type electro-optic modulators, but any suitable type of electro-optic modulators can
be used in alternative embodiments.
[0113] The electro-optic modulators 322, 324, 326, 328 and electrodes 302, 304, 306, 308
are shown schematically in Figure 8. The measurement apparatus also includes a femtosecond
laser 330 that provides a femtosecond laser beam to a beam splitter 332 that splits
the beam into four separate probe beams. Each probe beam is directed to a respective
one of the electro-optic modulators 322, 324, 326, 328 by a respective fibre-optic
waveguide (not shown, for clarity) or via any other suitable arrangement of optical
components. A processing resource in the form of controller 320 is connected to the
laser 330 and beam splitter 332 arrangement and monitors measurement signals from
the electro-optic modulators 322, 324, 326, 328 that are obtained by modulation of
the sampling laser beams due to their interaction with the electro-optic modulators
322, 324, 326, 328. The apparatus in the embodiment of Figure 8 is arranged so that
the pulses of each probe beam arrives at their respective electro-optic modulators
322, 324, 326, 328 simultaneously. In some embodiments, additional delay components
(for example a precisely adjustable optical delay line) are used where necessary to
ensure that the split beams arrive at the electro-optic modulators simultaneously.
The use of four separate beams enables measurement of position in two directions (e.g.
x and y directions). In some embodiments, where it is desired to measure position
in only dimension, two beams rather than four beams are used.
[0114] The controller 320 in this case comprises dedicated control circuitry forming part
of the measurement apparatus but in other embodiments the controller or other processing
resource may comprise any suitable combination of software and hardware, for example
software installed on a PC or other general purpose computer. In some embodiments
the controller 320 or other processing resource comprises one or more ASICs or FPGAs.
[0115] The controller 320 is configured to process measurement signals from the electro-optic
modulators thereby to determine at least one property of an electron bunch passing
through the cavity between the electrodes 302, 304, 306, 308. The at least one property
may comprise charge of the electron bunch and/or lateral position.
[0116] Considering first the determination of lateral position, in the embodiment of Figure
8 the controller 320 receives respective measurement signals from each of electro-optic
modulators 322, 324, 326, 328.
[0117] Each one of the electrodes 302, 304, 306, 308 has a respective separate electro-optic
modulator 322, 324, 326, 328 to which it is connected. In operation each electro-optic
modulator 322, 324, 326, 328 is probed by its respective split probe beam obtained
from the femtosecond laser 330, and thus each is effectively probed at the same time
by the same laser pulse from the femtosecond laser 330.
[0118] In the embodiment of Figure 8 operation of the femtosecond laser 330 is synchronised
with the passage of the electron bunches through the cavity such that each electro-optic
modulator 322, 324, 326, 328 is probed by the laser pulse substantially at a maximum
of the electro-optic modulator signal cycle, e.g. substantially at the moment when
the passage of the electron bunch causes a maximum signal to be generated by each
electro-optic modulator. A calibration procedure can be performed, for example by
gradually varying the timing of the laser pulses, until measurement signals at the
maximum point are obtained.
[0119] In a well calibrated set-up the difference of the maxima of the measurement signals
obtained from electro-optic modulators connected to two opposing electrodes (for example,
measurement signals obtained from electro-optic modulators 322, 326 connected to opposing
electrodes 302, 306) is a measure of the lateral position in the cavity (e.g. in a
beam pipe) of the electron bunch producing those measurement signals.
[0120] In the embodiment of Figure 8, the controller 320 determines the difference between
the measurement signals obtained in respect of electrodes 302, 306. That difference
is representative of the lateral position of the electron bunch in the plane of the
electrodes relative to a line between electrodes 302, 306. For example, in a suitably
calibrated set-up if there is no difference in the measurement signals obtained in
respect of electrodes 302, 306 that may indicate that the electron bunch is equidistant
from electrodes 302, 306.
[0121] The controller 320 also determines the difference between measurement signals obtained
from electro-optic modulators 324, 328 in respect of opposing electrodes 304, 308.
That difference is representative of the lateral position of the electron bunch in
the plane of the electrodes relative to a line between electrodes 304, 308.
[0122] By combining the two difference measurements, the controller 320 is able to determine
the position of the electron bunch at the time of measurement in relation to the plane
of the electrodes 302, 304, 306, 308. In this embodiment, the desired position of
the electron bunch is at the centre of the plane of the electrodes 302, 304, 306,
308 and operating parameters of the radiation source may be adjusted in response to
the position of the electron bunch being determined to be not at that centre point.
[0123] As well as or instead of determining the lateral position of the electron bunch,
the controller 320 can also process the measurement signals from the electro-optic
modulators 322, 324, 326, 328 to determine the charge of the electron bunch. In one
mode of operation the controller 320 sums corresponding measurement signals from each
of the electro-optic modulators 322, 324, 326, 328 to determine a parameter representative
of the charge of the electron bunch.
[0124] The sum of the measurement signals can be taken as being dependent on both the total
charge of the bunch and the longitudinal position of the bunch relative to the plane
of electrodes 302, 304, 306, 308. However if the measurement apparatus has been set
up initially (for example by suitably varying the timing of the laser pulses) to ensure
that the measurement signals are maxima, it can be supposed that the electron bunches
are at a longitudinal position substantially coincident with the plane of the electrodes
302, 304, 306, 308 at the time of the measurement, and thus the sum of the measurement
signals can be taken as being representative of the total charge of the bunch. By
way of further explanation, if one were to take an embodiment in which two sensors,
sensor 1 and sensor 2 were opposed to each other in the same longitudinal plane, and
measurement signal of amplitude A was obtained from sensor 1 and measurement signal
of amplitude B was obtained simultaneously from sensor 2, then if the apparatus was
calibrated such that A + B was equal to (or proportional to) total charge of the bunch,
a lateral position of the bunch at the measurement time could be taken to be equal
to (or proportional to) (A-B)/(A+B).
[0125] In one mode of operation, the controller 320 is configured to repeatedly obtain measurement
signals that correspond to electron bunches of the same energy passing through the
plane of electrodes 302, 304, 306, 308, for example by obtaining measurement signals
at a repetition frequency that matches the desired or expected repetition frequency
of the electron bunches. The controller 320 monitors the sum of the measurement signals
and, if it is supposed that the charge of the bunches is constant, a variation in
the sum of the measurement signals over time can be taken as indicating that the timing
of the electron bunches is drifting away from the desired timing. For example, a reduction
in the sum of the measurement signals can be taken as indicating that the electron
bunch has either not yet arrived at the plane of the electrodes 302, 304, 306, 308,
or has already passed through the plane of the electrodes 302, 304, 306, 308, at the
moment of measurement.
[0126] Thus, given a constant charge, a drifting amplitude of the sum of the measurements
in time may indicate a phase difference, corresponding to a variation in bunch time
of arrival. Thus, the apparatus can be used for bunch time of arrival monitoring either
alone or simultaneously with determination of charge and/or lateral position.
[0127] In the embodiment of Figure 8, the electron bunch that is measured is one of a sequence
of electron bunches passing through the LINAC. In the case where the apparatus is
being used to measure electron bunches in LINAC 242b of the apparatus of Figure 7,
each successive bunch of the sequence has one of four different energies, and each
bunch is either in an acceleration phase or deceleration phase and has arrived at
the LINAC from one of the arcs corresponding to points a1, a3, a5 or a7.
[0128] In the embodiment of Figure 8 it is not possible to determine from a single measurement
the energy of the bunch, for example which of the four expected energies the bunch
possesses in the case of measurements of electron bunches in LINAC 242b of the apparatus
of Figure 7. However, given a known repetition frequency of the laser pulses from
a master clock and the phase from the first measurement, other bunches of the same
energy can be measured as well. For example, by repeating measurements at an expected
repetition frequency (or suitable fraction of that frequency) for electron bunches
of a particular energy value it can be ensured that each of those measurements is
of an electron bunch of the same energy (even if the particular energy is unknown).
[0129] In one mode of operation, the controller 320 alters at least one operating parameter
of the radiation source in order to affect at least one property of electron bunches
of a particular energy and then monitors the measurements obtained from the electro-optic
modulators in order to determine whether the alteration of the at least one operating
parameter has affected the measurements. If the alteration of the parameter does affect
the measurements then it may be concluded, either automatically by the controller
320, or by an operator, that the electron bunch that is being measured using the electro-optic
modulators is the one that has been affected by the alteration of the operating parameter(s).
[0130] The alteration of the operating parameter may comprise for example an adjustment
of the setting of electron beam optics in one or more of the arcs corresponding to
points a1, a3, a5 or a7 (or points a2, a4, a6 or a8). If an adjustment of the setting
of electron beam optics for an arc that corresponds to a particular one of the electron
bunch energies produces a significant alteration in the measurements obtained using
the electro-optic modulators (for example a variation of amplitude of the measurements
due to a variation in electron bunch timing) it may be concluded that it is electron
bunches of that energy that are being measured.
[0131] Any suitable operating parameter may be altered, for example any suitable operating
parameter that may affect the timing of passage of electron bunches of a particular
energy through the LINAC. For instance, the operating parameter may comprise an operating
parameter of bending magnets and/or combiners/spreaders is used to control the passage
of electron bunches.
[0132] The controller 320 may alter the at least one operating parameter of the radiation
source directly by sending one or more instructions directly to the relevant components
of the radiation source, or by sending an instruction or request to a further controller
that controls operation of the radiation source.
[0133] Operation of the apparatus of Figure 8 is described in relation to measurement of
electron bunches in the two-pass radiation source of Figure 7. However, the embodiment
of Figure 8, and other embodiments, may also be used to measure electron bunches in
other radiation sources, for example the single pass radiation sources of Figure 3
or Figure 6. Whilst the use of embodiments to measure electron bunches passing through
LINACs of an FEL radiation source has been described, such embodiments may also be
used to measure electron bunches in any other suitable circumstances, and embodiments
are not limited to the measurement of electron bunches in LINACs or radiation sources.
[0134] Embodiments have been described in which electrodes are used to measure properties
of electron bunches passing through the cavity between the electrodes. The electrodes
may, for example, in some embodiments be located inside an electron beam propagation
chamber, for example a beam pipe of a LINAC, or in other embodiments may be located
outside the walls, or embedded in the walls, of such chamber.
[0135] Any suitable components, for example any suitable types of lasers, splitters, pick-up
apparatus electrodes and electro-optic modulators, may be used in the measurement
apparatus according to embodiments. For instance, in embodiments the lasers, splitters,
pick-up apparatus electrodes and/or electro-optic modulators are of the same or similar
type as those described in A. Angelovski et al, "High bandwidth pickup design for
bunch arrival-time monitors for free electron laser", Physical Review Special Topics
- Accelerators and Beams 15, 112803-1 to 112803-8 (2012) or M.K.Bock et al, "Recent
Developments of the Bunch Arrival Time Monitor with Femtosecond Resolution at Flash",
Proceedings of IPAC'10, Kyoto, Japan, WEOCMH02.
[0136] Embodiments may provide fast single/beam position measurements using electro-optic
crystals probed with a femtosecond laser. Embodiments may provide fast single bunch
charge measurements using electro-optic crystals probed with a femtosecond laser.
Embodiments may provide simultaneous bunch position and bunch arrival time measurements
using electro-optic crystals probed with a femtosecond laser.
[0137] Although embodiments have been described in relation to the determination of one
or more properties of electron bunches, apparatus and methods according to alternative
embodiments can be used to determine one or more properties (for example charge and/or
lateral or other position) of other types of charged particles, for example groups
of positrons, protons or ions. Furthermore, although embodiments have been described
in relation to measurements in a LINAC of a radiation source, apparatus and methods
according to alternative embodiments can be used to determine one or more properties
of electron bunches or other groups of charged particles in any other suitable environment,
system or arrangement. For example, embodiments could be used to determine properties
of electron beams and positron beams (or other groups of charged particles) fired
at a target.
[0138] Although embodiments have been described in relation to the determination of properties
of successive electron bunches of a single bunch train, the apparatus and methods
of embodiments can be used to perform measurements that can distinguish between overlapping
bunch trains that have a phase difference between them. For example, by suitable selection
of timing and frequency of operation of the laser pulses provided to the optical sensors,
embodiments can be tuned to determine properties of electron bunches or other groups
of charged particles that have a particular repetition frequency.
[0139] While specific embodiments of the invention have been described above, it will be
appreciated that the invention may be practiced otherwise than as described. The descriptions
above are intended to be illustrative, not limiting. Thus it will be apparent to one
skilled in the art that modifications may be made to the invention as described without
departing from the scope of the claims set out below.
1. A measurement apparatus for measuring at least one property of an electron bunch or
other group of charged particles travelling through a cavity (310), comprising:
a plurality of electrodes (302-308) arranged around the cavity;
a plurality of optical sensors (322-328), wherein the plurality of electrodes are
configured to provide signals to the optical sensors thereby to modulate at least
one optical property of the optical sensors;
at least one laser source (330) for providing a laser beam comprising a series of
laser pulses to the plurality of optical sensors to obtain measurements representative
of said at least one optical property of the optical sensors; and
a processing resource (320) configured to process at least a first measurement signal
from a first one of the optical sensors and a second measurement signal from a second
one of the optical sensors, thereby to determine at least one property of the electron
bunch or other group of charged particles, wherein the at least one property comprises:
charge and/or lateral position.
2. Apparatus according to Claim 1, wherein the plurality of optical sensors comprise
a plurality of electro-optic modulators, the first one of the optical sensors comprises
a first one of the electro-optic modulators, and the second one of the optical sensors
comprises a second one of the electro-optic modulators.
3. An apparatus according to Claim 1 or 2, wherein the at least one property comprises
lateral position, and the processing of the first measurement signal, which is from
the first one of the optical sensors, and the second measurement signal, which is
from the second one of the optical sensors, comprises determining a difference between
the first measurement signal and the second measurement signal.
4. An apparatus according to any preceding claim, wherein the plurality of optical sensors
comprises at least one further optical sensor, and the processing resource is further
configured to process at least one further measurement signal from said at least one
further optical sensor, to determine said at least one property.
5. An apparatus according to Claim 4, wherein the processing resource is configured to
process a third measurement signal from a third one of the optical sensors and a fourth
measurement signal from a fourth one of the optical sensors.
6. An apparatus according to Claim 5, wherein the processing of the first measurement
signal and the second measurement signal is to determine a position of the electron
bunch or other group of charged particles in a first lateral direction, and
the processing of the third measurement signal and the fourth measurement signal is
to determine a position of the electron bunch in a second lateral direction.
7. An apparatus according to Claim 6, wherein the second direction is substantially orthogonal
to the first direction.
8. An apparatus according to any preceding claim, wherein the at least one property of
the electron bunch or other group of charged particles comprises charge of the electron
bunch or other group of charged particles, and the processing resource is configured
to determine the charge in dependence on a sum of measurement signals.
9. An apparatus according to Claim 8, wherein the sum of measurement signals comprises
or is representative of a sum of at least the first and second measurement signals.
10. An apparatus according to Claim 9 as dependent on Claim 5, wherein the sum of measurement
signals comprises or is representative of a sum of at least the first, second, third
and fourth measurement signals
11. An apparatus according to any preceding claim, wherein the first optical sensor from
which the first measurement signal is obtained receives signals from a first one of
the electrodes, and the second optical sensor from which the second measurement signal
is obtained receives signals from a second one of the electrodes.
12. An apparatus according to any preceding claim, wherein the first one of the electrodes
is substantially diametrically opposed to the second one of the electrodes.
13. An apparatus according to Claim 5 or any of Claims 6 to 12 as dependent on Claim 5,
wherein the third optical sensor from which the third measurement signal is obtained
receives signals from a third one of the electrodes, and the fourth optical sensor
from which the fourth measurement signal is obtained receives signals from a fourth
one of the electrodes.
14. An apparatus according to Claim 5 or any of Claims 6 to 13 as dependent on Claim 5,
wherein the third one of the electrodes is substantially diametrically opposed to
the fourth one of the electrodes with respect to an electron bunch path.
15. An apparatus according to any preceding claim, wherein the laser source is configured
to provide the series of laser pulses such that the first measurement signal comprises
a local maximum signal for the first one of the optical sensors and the second measurement
signal comprises a local maximum signal for the second one of the optical sensors.
16. An apparatus according to any preceding claim, wherein the optical sensors and the
electrodes are arranged such that in operation each one of the optical sensors receives
signals from a respective single one of the electrodes.
17. An apparatus according to any preceding claim, wherein the apparatus further comprises
a beam splitter for splitting the laser beam, such that synchronised series of laser
pulses are provided to each of the optical sensors.
18. An apparatus according to any preceding claim, wherein the laser source, the beam
splitter and the optical sensors are arranged so that in operation laser pulses arrive
substantially simultaneously at each of the optical sensors.
19. An apparatus according to any preceding claim, wherein the electron bunch or other
group of charged particles is one of a sequence of electron bunches or other groups
of charged particles, the sequence of electron bunches or other groups of charged
particles comprising electron bunches or other groups of charged particles each having
one of a plurality of different energies.
20. An apparatus according to Claim 19, wherein the sequence of electron bunches or other
groups of charged particles is a sequence of electron bunches or other groups of charged
particles of a radiation source, and a controller of the radiation source is configured
to alter an operating parameter of the radiation source for electron bunches or other
groups of charged particles having a selected one of the plurality of energies.
21. An apparatus according to Claim 20, wherein the controller is configured to monitor
at least one of the first measurement signal, the second measurement signal, and/or
a parameter derived from the first measurement signal and/or the second measurement
signal, thereby to identify whether the electron bunch or other group of charged particles
whose lateral position and/or charge is determined is an electron bunch or other group
of charged particles of the selected energy.
22. An apparatus according to any of Claims 19 to 21, wherein energies of electron bunches
of the sequence are in a range 100 MeV to 1000 MeV.
23. An apparatus according to any preceding claim, wherein the processing resource is
configured to determine said at least one property for a succession of electron bunches
and to monitor for a change in a value of said property.
24. A method of measuring at least one property of an electron bunch or other group of
charged particles travelling through a cavity, comprising:
obtaining signals from a plurality of electrodes arranged around the cavity;
providing the signals to a plurality of optical sensors, thereby to modulate at least
one optical property of the optical sensors;
obtaining measurements representative of said at least one optical property of the
optical sensors; and
processing at least a first measurement signal from a first one of the optical sensors
and a second measurement signal from a second one of the optical sensors, thereby
to determine at least one property of the electron bunch or other group of charged
particles, wherein the at least one property comprises:
charge and/or lateral position.
25. A radiation source (220) comprising:
an electron source (221) for generating bunches of electrons;
at least one linear accelerator (LINAC) (222) for accelerating and decelerating the
bunches of electrons;
an undulator (224) configured such that in operation passage of the bunches of electrons
through the undulator generates radiation at a desired wavelength;
a plurality of steering units for guiding the bunches of electrons along a desired
electron bunch path between the electron source, the at least one LINAC and the undulator;
and
a measurement apparatus according to any of Claims 1 to 23 arranged to measure at
least one property of an electron bunch in the radiation source.
26. A lithographic system comprising a radiation source according to Claim 25, and a lithographic
apparatus arranged to receive radiation from the radiation source and to use the radiation
to project a pattern from a patterning device onto a substrate.
1. Eine Messvorrichtung zum Messen mindestens einer Eigenschaft eines Elektronenbündels
oder einer anderen Gruppe geladener Teilchen, die sich durch einen Hohlraum (310)
bewegen, beinhaltend:
eine Vielzahl von Elektroden (302-308), die um den Hohlraum angeordnet sind;
eine Vielzahl von optischen Sensoren (322-328),
wobei die Vielzahl von Elektroden konfiguriert ist, den optischen Sensoren Signale
bereitzustellen, um dadurch mindestens eine optische Eigenschaft der optischen Sensoren
zu modulieren;
mindestens eine Laserquelle (330), um der Vielzahl von optischen Sensoren einen Laserstrahl
bereitzustellen, der eine Reihe von Laserimpulsen beinhaltet, um Messungen zu erhalten,
die für die mindestens eine optische Eigenschaft der optischen Sensoren repräsentativ
sind; und
eine Verarbeitungsressource (320), die konfiguriert ist, mindestens ein erstes Messsignal
von einem ersten der optischen Sensoren und ein zweites Messsignal von einem zweiten
der optischen Sensoren zu verarbeiten, um dadurch mindestens eine Eigenschaft des
Elektronenbündels oder der anderen Gruppe geladener Teilchen zu bestimmen, wobei die
mindestens eine Eigenschaft Folgendes beinhaltet:
Ladung und/oder seitliche Position.
2. Vorrichtung gemäß Anspruch 1, wobei die Vielzahl von optischen Sensoren eine Vielzahl
von elektrooptischen Modulatoren beinhaltet, wobei der erste der optischen Sensoren
einen ersten der elektrooptischen Modulatoren beinhaltet und der zweite der optischen
Sensoren einen zweiten der elektrooptischen Modulatoren beinhaltet.
3. Vorrichtung gemäß Anspruch 1 oder 2, wobei die mindestens eine Eigenschaft die seitliche
Position beinhaltet und das Verarbeiten des ersten Messsignals, das von dem ersten
der optischen Sensoren kommt, und des zweiten Messsignals, das von dem zweiten der
optischen Sensoren kommt, das Bestimmen eines Unterschieds zwischen dem ersten Messsignal
und dem zweiten Messsignal beinhaltet.
4. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die Vielzahl von optischen
Sensoren mindestens einen weiteren optischen Sensor beinhaltet und die Verarbeitungsressource
ferner konfiguriert ist, mindestens ein weiteres Messsignal von dem mindestens einen
weiteren optischen Sensor zu verarbeiten, um die mindestens eine Eigenschaft zu bestimmen.
5. Vorrichtung gemäß Anspruch 4, wobei die Verarbeitungsressource konfiguriert ist, ein
drittes Messsignal von einem dritten der optischen Sensoren und ein viertes Messsignal
von einem vierten der optischen Sensoren zu verarbeiten.
6. Vorrichtung gemäß Anspruch 5, wobei das Verarbeiten des ersten Messsignals und des
zweiten Messsignals dazu dient, eine Position des Elektronenbündels oder der anderen
Gruppe geladener Teilchen in einer ersten seitlichen Richtung zu bestimmen, und
das Verarbeiten des dritten Messsignals und des vierten Messsignals dazu dient, eine
Position des Elektronenbündels in einer zweiten seitlichen Richtung zu bestimmen.
7. Vorrichtung gemäß Anspruch 6, wobei die zweite Richtung im Wesentlichen senkrecht
zu der ersten Richtung ist.
8. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die mindestens eine Eigenschaft
des Elektronenbündels oder der anderen Gruppe geladener Teilchen die Ladung des Elektronenbündels
oder der anderen Gruppe geladener Teilchen beinhaltet und die Verarbeitungsressource
konfiguriert ist, die Ladung in Abhängigkeit einer Summe von Messsignalen zu bestimmen.
9. Vorrichtung gemäß Anspruch 8, wobei die Summe von Messsignalen eine Summe von mindestens
dem ersten und dem zweiten Messsignal beinhaltet oder dafür repräsentativ ist.
10. Vorrichtung gemäß Anspruch 9, wenn von Anspruch 5 abhängig, wobei die Summe von Messsignalen
eine Summe von mindestens dem ersten, dem zweiten, dem dritten und dem vierten Messsignal
beinhaltet oder dafür repräsentativ ist.
11. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei der erste optische Sensor,
von dem das erste Messsignal erhalten wird, Signale von einer ersten der Elektroden
empfängt und der zweite optische Sensor, von dem das zweite Messsignal erhalten wird,
Signale von einer zweiten der Elektroden empfängt.
12. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die erste der Elektroden
der zweiten der Elektroden im Wesentlichen diametral gegenüberliegt.
13. Vorrichtung gemäß Anspruch 5 oder einem der Ansprüche 6 bis 12, wenn von Anspruch
5 abhängig, wobei der dritte optische Sensor, von dem das dritte Messsignal erhalten
wird, Signale von einer dritten der Elektroden empfängt und der vierte optische Sensor,
von dem das vierte Messsignal erhalten wird, Signale von einer vierten der Elektroden
empfängt.
14. Vorrichtung gemäß Anspruch 5 oder einem der Ansprüche 6 bis 13, wenn von Anspruch
5 abhängig, wobei die dritte der Elektroden der vierten der Elektroden in Bezug auf
einen Elektronenbündelweg im Wesentlichen diametral gegenüberliegt.
15. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die Laserquelle konfiguriert
ist, die Reihe von Laserimpulsen so bereitzustellen, dass das erste Messsignal ein
lokales Maximumsignal für den ersten der optischen Sensoren beinhaltet und das zweite
Messsignal ein lokales Maximumsignal für den zweiten der optischen Sensoren beinhaltet.
16. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die optischen Sensoren
und die Elektroden so angeordnet sind, dass im Betrieb jeder einzelne der optischen
Sensoren Signale von einer entsprechenden einzigen der Elektroden empfängt.
17. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die Vorrichtung ferner
einen Strahlteiler zum Teilen des Laserstrahls beinhaltet, sodass jedem der optischen
Sensoren synchronisierte Reihen von Laserimpulsen bereitgestellt werden.
18. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die Laserquelle, der Strahlteiler
und die optischen Sensoren so angeordnet sind, dass im Betrieb Laserimpulse im Wesentlichen
gleichzeitig an jedem der optischen Sensoren ankommen.
19. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei das Elektronenbündel oder
die andere Gruppe geladener Teilchen eines/eine von einer Sequenz von Elektronenbündeln
oder anderen Gruppen geladener Teilchen ist, wobei die Sequenz von Elektronenbündeln
oder anderen Gruppen geladener Teilchen Elektronenbündel oder andere Gruppen geladener
Teilchen beinhaltet, die jeweils eine von einer Vielzahl von unterschiedlichen Energien
aufweisen.
20. Vorrichtung gemäß Anspruch 19, wobei die Sequenz von Elektronenbündeln oder anderen
Gruppen geladener Teilchen eine Sequenz von Elektronenbündeln oder anderen Gruppen
geladener Teilchen einer Strahlungsquelle ist und eine Steuereinheit der Strahlungsquelle
konfiguriert ist, einen Betriebsparameter der Strahlungsquelle für Elektronenbündel
oder andere Gruppen geladener Teilchen, die eine ausgewählte der Vielzahl von Energien
aufweisen, zu ändern.
21. Vorrichtung gemäß Anspruch 20, wobei die Steuereinheit konfiguriert ist, mindestens
eines von dem ersten Messsignal, dem zweiten Messsignal und/oder einem Parameter,
der von dem ersten Messsignal und/oder dem zweiten Messsignal abgeleitet sind, zu
überwachen, um dadurch zu identifizieren, ob das Elektronenbündel oder die andere
Gruppe geladener Teilchen, dessen/deren seitliche Position und/oder Ladung bestimmt
wird, ein Elektronenbündel oder eine andere Gruppe geladener Teilchen der ausgewählten
Energie ist.
22. Vorrichtung gemäß einem der Ansprüche 19 bis 21, wobei Energien von Elektronenbündeln
der Sequenz in einem Bereich von 100 MeV bis 1000 MeV liegen.
23. Vorrichtung gemäß einem der vorhergehenden Ansprüche, wobei die Verarbeitungsressource
konfiguriert ist, die mindestens eine Eigenschaft für eine Abfolge von Elektronenbündeln
zu bestimmen und auf eine Änderung eines Wertes der Eigenschaft hin zu überwachen.
24. Ein Verfahren zum Messen mindestens einer Eigenschaft eines Elektronenbündels oder
einer anderen Gruppe geladener Teilchen, die sich durch einen Hohlraum bewegen, beinhaltend:
Erhalten von Signalen von einer Vielzahl von Elektroden, die um den Hohlraum angeordnet
sind;
Bereitstellen der Signale für eine Vielzahl von optischen Sensoren, um dadurch mindestens
eine optische Eigenschaft der optischen Sensoren zu modulieren;
Erhalten von Messungen, die für die mindestens eine optische Eigenschaft der optischen
Sensoren repräsentativ sind; und
Verarbeiten mindestens eines ersten Messsignals von einem ersten der optischen Sensoren
und eines zweiten Messsignals von einem zweiten der optischen Sensoren, um dadurch
mindestens eine Eigenschaft des Elektronenbündels oder der anderen Gruppe geladener
Teilchen zu bestimmen, wobei die mindestens eine Eigenschaft Folgendes beinhaltet:
Ladung und/oder seitliche Position.
25. Eine Strahlungsquelle (220), beinhaltend:
eine Elektronenquelle (221) zum Erzeugen von Bündeln von Elektronen;
mindestens einen Linearbeschleuniger (LINAC) (222) zum Beschleunigen und Verlangsamen
der Bündel von Elektronen;
einen Undulator (224), der so konfiguriert ist, dass im Betrieb ein Durchgang der
Bündel von Elektronen durch den Undulator Strahlung mit einer gewünschten Wellenlänge
erzeugt;
eine Vielzahl von Lenkeinheiten zum Führen der Bündel von Elektronen entlang einem
gewünschten Elektronenbündelweg zwischen der Elektronenquelle, dem mindestens einen
LINAC und dem Undulator; und
eine Messvorrichtung gemäß einem der Ansprüche 1 bis 23, die angeordnet ist, um mindestens
eine Eigenschaft eines Elektronenbündels in der Strahlungsquelle zu messen.
26. Ein lithographisches System, beinhaltend eine Strahlungsquelle gemäß Anspruch 25 und
eine lithographische Vorrichtung, die angeordnet ist, um Strahlung von der Strahlungsquelle
zu empfangen und die Strahlung zu verwenden, um ein Muster von einer Musteraufbringungseinrichtung
auf ein Substrat zu projizieren.
1. Un appareil de mesure pour mesurer au moins une propriété d'un paquet d'électrons
ou autre groupe de particules chargées progressant à travers une cavité (310), comprenant
:
une pluralité d'électrodes (302-308) agencées autour de la cavité ;
une pluralité de capteurs optiques (322-328),
où la pluralité d'électrodes sont configurées afin de fournir des signaux aux capteurs
optiques afin de moduler de ce fait au moins une propriété optique des capteurs optiques
;
au moins une source laser (330) pour fournir un faisceau laser comprenant une série
d'impulsions laser à la pluralité de capteurs optiques afin d'obtenir des mesures
représentatives de ladite au moins une propriété optique des capteurs optiques ; et
une ressource de traitement (320) configurée afin de traiter au moins un premier signal
de mesure provenant d'un premier des capteurs optiques et un deuxième signal de mesure
provenant d'un deuxième des capteurs optiques, afin de déterminer de ce fait au moins
une propriété du paquet d'électrons ou autre groupe de particules chargées, où l'au
moins une propriété comprend :
une charge et/ou une position latérale.
2. Appareil selon la revendication 1, où la pluralité de capteurs optiques comprennent
une pluralité de modulateurs électro-optiques, le premier des capteurs optiques comprend
un premier des modulateurs électro-optiques, et le deuxième des capteurs optiques
comprend un deuxième des modulateurs électro-optiques.
3. Un appareil selon la revendication 1 ou la revendication 2, où l'au moins une propriété
comprend une position latérale, et le traitement du premier signal de mesure, lequel
provient du premier des capteurs optiques, et du deuxième signal de mesure, lequel
provient du deuxième des capteurs optiques, comprend la détermination d'une différence
entre le premier signal de mesure et le deuxième signal de mesure.
4. Un appareil selon n'importe quelle revendication précédente, où la pluralité de capteurs
optiques comprend au moins un capteur optique supplémentaire, et la ressource de traitement
est configurée en sus afin de traiter au moins un signal de mesure supplémentaire
provenant dudit au moins un capteur optique supplémentaire, afin de déterminer ladite
au moins une propriété.
5. Un appareil selon la revendication 4, où la ressource de traitement est configurée
afin de traiter un troisième signal de mesure provenant d'un troisième des capteurs
optiques et un quatrième signal de mesure provenant d'un quatrième des capteurs optiques.
6. Un appareil selon la revendication 5, où le traitement du premier signal de mesure
et du deuxième signal de mesure est destiné à déterminer une position du paquet d'électrons
ou autre groupe de particules chargées dans une première direction latérale, et
le traitement du troisième signal de mesure et du quatrième signal de mesure est destiné
à déterminer une position du paquet d'électrons dans une deuxième direction latérale.
7. Un appareil selon la revendication 6, où la deuxième direction est substantiellement
orthogonale à la première direction.
8. Un appareil selon n'importe quelle revendication précédente, où l'au moins une propriété
du paquet d'électrons ou autre groupe de particules chargées comprend une charge du
paquet d'électrons ou autre groupe de particules chargées, et la ressource de traitement
est configurée afin de déterminer la charge en fonction d'une somme de signaux de
mesure.
9. Un appareil selon la revendication 8, où la somme de signaux de mesure comprend ou
est représentative d'une somme des premier et deuxième signaux de mesure au moins.
10. Un appareil selon la revendication 9 telle que dépendante de la revendication 5, où
la somme de signaux de mesure comprend ou est représentative d'une somme des premier,
deuxième, troisième et quatrième signaux de mesure au moins.
11. Un appareil selon n'importe quelle revendication précédente, où le premier capteur
optique en provenance duquel est obtenu le premier signal de mesure reçoit des signaux
provenant d'une première des électrodes, et le deuxième capteur optique en provenance
duquel est obtenu le deuxième signal de mesure reçoit des signaux provenant d'une
deuxième des électrodes.
12. Un appareil selon n'importe quelle revendication précédente, où la première des électrodes
est substantiellement diamétralement opposée à la deuxième des électrodes.
13. Un appareil selon la revendication 5 ou n'importe lesquelles des revendications 6
à 12 telles que dépendantes de la revendication 5, où le troisième capteur optique
en provenance duquel est obtenu le troisième signal de mesure reçoit des signaux provenant
d'une troisième des électrodes, et le quatrième capteur optique en provenance duquel
est obtenu le quatrième signal de mesure reçoit des signaux provenant d'une quatrième
des électrodes.
14. Un appareil selon la revendication 5 ou n'importe lesquelles des revendications 6
à 13 telles que dépendantes de la revendication 5, où la troisième des électrodes
est substantiellement diamétralement opposée à la quatrième des électrodes par rapport
à une trajectoire de paquet d'électrons.
15. Un appareil selon n'importe quelle revendication précédente, où la source laser est
configurée afin de fournir la série d'impulsions laser de telle sorte que le premier
signal de mesure comprend un signal local maximum pour le premier des capteurs optiques
et le deuxième signal de mesure comprend un signal local maximum pour le deuxième
des capteurs optiques.
16. Un appareil selon n'importe quelle revendication précédente, où les capteurs optiques
et les électrodes sont agencés de telle sorte que, en fonctionnement, chacun des capteurs
optiques reçoit des signaux provenant d'une seule électrode respective parmi les électrodes.
17. Un appareil selon n'importe quelle revendication précédente, où l'appareil comprend
en sus un diviseur de faisceau pour diviser le faisceau laser, de telle sorte que
des séries d'impulsions laser synchronisées sont fournies à chacun des capteurs optiques.
18. Un appareil selon n'importe quelle revendication précédente, où la source laser, le
diviseur de faisceau et les capteurs optiques sont agencés de sorte que, en fonctionnement,
des impulsions laser arrivent de manière substantiellement simultanée au niveau de
chacun des capteurs optiques.
19. Un appareil selon n'importe quelle revendication précédente, où le paquet d'électrons
ou autre groupe de particules chargées est un élément d'une séquence de paquets d'électrons
ou autres groupes de particules chargées, la séquence de paquets d'électrons ou autres
groupes de particules chargées comprenant des paquets d'électrons ou autres groupes
de particules chargées ayant chacun une énergie parmi une pluralité d'énergies différentes.
20. Un appareil selon la revendication 19, où la séquence de paquets d'électrons ou autres
groupes de particules chargées est une séquence de paquets d'électrons ou autres groupes
de particules chargées d'une source de rayonnement, et un organe de commande de la
source de rayonnement est configuré afin de modifier un paramètre de fonctionnement
de la source de rayonnement pour des paquets d'électrons ou autres groupes de particules
chargées ayant une énergie sélectionnée parmi la pluralité d'énergies.
21. Un appareil selon la revendication 20, où l'organe de commande est configuré afin
de surveiller au moins un élément parmi le premier signal de mesure, le deuxième signal
de mesure, et/ou un paramètre dérivé du premier signal de mesure et/ou du deuxième
signal de mesure, afin d'identifier de ce fait si le paquet d'électrons ou autre groupe
de particules chargées dont la position latérale et/ou la charge est déterminée est
un paquet d'électrons ou autre groupe de particules chargées de l'énergie sélectionnée.
22. Un appareil selon n'importe lesquelles des revendications 19 à 21, où des énergies
de paquets d'électrons de la séquence sont comprises dans un intervalle de 100 MeV
à 1 000 MeV.
23. Un appareil selon n'importe quelle revendication précédente, où la ressource de traitement
est configurée afin de déterminer ladite au moins une propriété pour une succession
de paquets d'électrons et afin de surveiller et guetter un changement dans une valeur
de ladite propriété.
24. Un procédé pour mesurer au moins une propriété d'un paquet d'électrons ou autre groupe
de particules chargées progressant à travers une cavité, comprenant :
le fait d'obtenir des signaux provenant d'une pluralité d'électrodes agencées autour
de la cavité ;
le fait de fournir les signaux à une pluralité de capteurs optiques, afin de moduler
de ce fait au moins une propriété optique des capteurs optiques ;
le fait d'obtenir des mesures représentatives de ladite au moins une propriété optique
des capteurs optiques ; et
le fait de traiter au moins un premier signal de mesure provenant d'un premier des
capteurs optiques et un deuxième signal de mesure provenant d'un deuxième des capteurs
optiques, afin de déterminer de ce fait au moins une propriété du paquet d'électrons
ou autre groupe de particules chargées, où l'au moins une propriété comprend :
une charge et/ou une position latérale.
25. Une source de rayonnement (220) comprenant :
une source d'électrons (221) pour générer des paquets d'électrons ;
au moins un accélérateur linéaire (LINAC) (222) pour accélérer et décélérer les paquets
d'électrons ;
un onduleur (224) configuré de telle sorte que, en fonctionnement, le passage des
paquets d'électrons à travers l'onduleur génère un rayonnement à une longueur d'onde
souhaitée ;
une pluralité d'unités de pilotage pour guider les paquets d'électrons le long d'une
trajectoire de paquet d'électrons souhaitée entre la source d'électrons, l'au moins
un LINAC et l'onduleur ; et
un appareil de mesure selon n'importe lesquelles des revendications 1 à 23 agencé
afin de mesurer au moins une propriété d'un paquet d'électrons dans la source de rayonnement.
26. Un système lithographique comprenant une source de rayonnement selon la revendication
25, et un appareil lithographique agencé afin de recevoir un rayonnement provenant
de la source de rayonnement et afin d'utiliser le rayonnement pour projeter un motif
depuis un dispositif servant à conformer selon un motif sur un substrat.