[0001] The invention relates to an on-chip voltage generation circuit integrated on a chip.
[0002] In conventional semiconductor chips, different circuits can be used for on-chip generation
of a reference voltage. These conventional on-chip voltage generation circuits can
be based on band gaps and/or Zener diodes and comprise different electronic components
connected in different configurations comprising transistors, diodes, resistors. Depending
on the needed reference voltage, temperature, supply voltage or process variations
behaviour, one of the listed above solution can be chosen. A Semiconductor chip comprises
in most cases a plurality of integrated MOSFET transistors comprising a threshold
voltage. The knowledge of the exact value of the threshold voltage of the MOSFET transistors
integrated on the chip is mandatory for trimming the internal chip circuitry for reaching
a best performance of the electronic circuits on the chip.
[0003] Accordingly, it is an object of the present invention to provide information about
the threshold voltage of MOSFET transistors integrated on a semiconductor chip.
[0004] This object is achieved by an on-chip voltage generation circuit according to the
first aspect of the present invention.
[0005] The invention provides according to the first aspect of the present invention an
on-chip voltage generation circuit integrated on a chip, wherein said on-chip voltage
generation circuit is adapted to generate a voltage equivalent to a threshold voltage
of MOSFETs integrated on said chip.
[0006] In a possible embodiment of the on-chip voltage generation circuit according to the
first aspect of the present invention, the voltage generated by said on-chip voltage
generation circuit is equal to the threshold voltage of MOSFETs implemented in the
on-chip voltage generation circuit and other MOSFETs of electronic circuits integrated
on the same chip.
[0007] In a possible embodiment of the on-chip voltage generation circuit according to the
first aspect of the present invention, a bias current is generated by an on-chip bias
current generation circuit of said chip depending on the voltage generated by said
on-chip voltage generation circuit of said chip.
[0008] In a possible embodiment of the on-chip voltage generation circuit according to the
first aspect of the present invention, the voltage generated by said on-chip voltage
generation circuit is output to a test pin of said chip.
[0009] In a further possible embodiment of the on-chip voltage generation circuit according
to the first aspect of the present invention, an external measurement circuit is connected
to the test pin of the chip and is adapted to measure the voltage generated by said
on-chip voltage generation circuit of said chip.
[0010] In a further possible embodiment of the on-chip voltage generation circuit according
to the first aspect of the present invention, a processing unit is adapted to analyse
the voltage measured by said external measurement circuit to derive information about
process parameters.
[0011] In a still further possible embodiment of the on-chip voltage generation circuit
according to the first aspect of the present invention, the voltage generated by said
on-chip voltage generation circuit is measured by an on-chip measurement circuit integrated
on said chip.
[0012] In a still further possible embodiment of the on-chip voltage generation circuit
according to the first aspect of the present invention, the on-chip voltage generation
circuit comprises identical MOSFET diode connected transistors operated in a strong
inversion and saturation region.
[0013] In a possible embodiment of the on-chip voltage generation circuit according to the
first aspect of the present invention, a first electrical current is passed through
a first MOSFET of said on-chip voltage generation circuit and a second electrical
current is passed through a second MOSFET of said on-chip voltage generation circuit,
wherein the second electrical current is a current replica of the first electrical
current and has a current strength being four times the current strength of the first
electrical current.
[0014] In a possible embodiment of the on-chip voltage generation circuit according to the
first aspect of the present invention, the on-chip voltage generation circuit comprises
a buffer circuit adapted to buffer a gate-source voltage of the second MOSFET of said
on-chip voltage generation circuit.
[0015] In a still further possible embodiment of the on-chip voltage generation circuit
according to the first aspect of the present invention, the on-chip voltage generation
circuit comprises a subtracting circuit adapted to subtract the difference voltage
between the gate-source voltage of the second MOSFET and first MOSFET from the gate-source
voltage of the first MOSFET to generate an output voltage being equivalent to the
threshold voltage of the MOSFET on chip transistors implemented in the on-chip voltage
generation circuit of said chip.
[0016] In a still further possible embodiment of the on-chip voltage generation circuit
according to the first aspect of the present invention, the buffer circuit comprises
a first operational amplifier having an output fed back directly to an inverting input
of the first operational amplifier and having a non-inverting input connected to a
drain terminal of the second MOSFET of said on-chip voltage generation circuit.
[0017] In a still further possible embodiment of the on-chip voltage generation circuit
according to the first aspect of the present invention, the subtracting circuit comprises
a second operational amplifier having an output fed back via a resistor to an inverting
input of said second operational amplifier and having a non-inverting input connected
to a drain terminal of the first MOSFET of said on-chip voltage generation circuit.
[0018] In a further possible embodiment of the on-chip voltage generation circuit according
to the first aspect of the present invention, the output of the first operational
amplifier is connected via a further resistor to the inverting input of the second
operational amplifier.
[0019] In a further possible embodiment of the on-chip voltage generation circuit according
to the first aspect of the present invention, the resistance of both resistors is
equal.
[0020] The invention further provides according to a second aspect a chip comprising an
on-chip voltage generation circuit according to the first aspect of the present invention
being adapted to generate an output voltage corresponding to a threshold voltage of
MOSFETs integrated in said chip and applied to a test pin of said chip for measurement
by an external measurement circuit and/or applied to an internal on-chip measurement
circuit integrated on said chip.
[0021] In a possible embodiment of the chip according to the second aspect of the present
invention, the chip further comprises at least one on-chip bias current generation
circuit integrated on the chip adapted to generate a bias current.
[0022] The invention further provides according to a third aspect a method for deriving
information about a threshold voltage of MOSFETs integrated on the chip, the method
comprising the steps of:
generating a voltage corresponding to a threshold voltage of MOSFETs integrated on
said chip by an on-chip voltage generation circuit of the chip; and
measuring the generated voltage by a measurement circuit.
[0023] In a possible embodiment of the method for deriving information about a threshold
voltage of MOSFETs integrated on the chip, the generated voltage measured by said
measurement circuit is further analysed to derive information about process parameters.
[0024] In the following, possible embodiments of different aspects of the present invention
are described in more detail with reference to the enclosed figures.
- Fig. 1
- shows a block diagram for illustrating a possible exemplary embodiment of an on-chip
voltage generation circuit according to the first aspect of the present invention;
- Fig. 2
- shows a circuit diagram for illustrating a possible exemplary embodiment of an on-chip
voltage generation circuit according to the first aspect of the present invention;
- Fig. 3
- shows a further circuit diagram for illustrating a further possible implementation
of an on-chip voltage generation circuit according to the first aspect of the present
invention;
- Fig. 4
- shows a block diagram for illustrating a further possible exemplary embodiment of
an on-chip voltage generation circuit according to the first aspect of the present
invention;
- Fig. 5
- shows a further diagram for illustrating a further possible exemplary embodiment of
an on-chip voltage generation circuit according to the first aspect of the present
invention;
- Fig. 6
- shows a flowchart for illustrating a possible exemplary embodiment of a method for
deriving information about a threshold voltage according to the third aspect of the
present invention;
- Fig. 7
- shows a further flowchart for illustrating a further possible exemplary embodiment
of a method for deriving information according to the third aspect of the present
invention.
[0025] As can be seen in Fig. 1, a chip 1 comprises in the illustrated embodiment at least
one on-chip voltage generation circuit 2 integrated on the chip 1. The chip 1 can
be a semiconductor chip fabricated in a manufacturing process and can comprise a plurality
of electronic circuits each having MOSFET transistors. The MOSFET transistors integrated
on the chip 1 can be characterized by their threshold voltage V
th. The threshold voltage V
th of the MOSFET transistors depends on process parameters and can vary from chip to
chip and from wafer to wafer. PCM data provided during the fabrication process do
not always correspond to the real values of the threshold voltage because they can
be measured for instance on a test structure. Further, the measurement conditions
for measuring the threshold voltage V
th may not correspond to the conditions which the integrated circuit 1 faces during
normal usage or operation. The knowledge of the threshold voltage V
th of the MOSFETs integrated on the chip 1 is necessary for trimming any internal chip
circuitry of electronic components or electronic circuits integrated on the same chip
for reaching an optimal performance of the electronic circuits. As can be seen in
the embodiment illustrated in Fig. 1, the chip 1 comprises an on-chip voltage generation
circuit 2, the on-chip voltage generation circuit 2 which is fabricated in the same
manufacturing process as the remaining electronic circuits of the chip 1 and is implemented
by circuits comprising the same MOSFETs as used in the remaining electronic circuits
of the chip 1. The on-chip voltage generation circuit 2 integrated on the chip 1 is
configured to generate an output voltage V
out equivalent to the threshold voltage V
th of the MOSFETs implemented on the chip 1. In the illustrated embodiment of Fig. 1,
the chip 1 comprises a single on-chip voltage generation circuit 2. In further possible
embodiments, the chip 1 can comprise more than one on-chip voltage generation circuit
2 located at different positions on the integrated chip 1. The voltage V
out generated by the on-chip voltage generation circuit 2 is equivalent to the threshold
voltage V
th of MOSFETs implemented in the on-chip voltage generation circuit 2 itself and equivalent
to the threshold voltage of MOSFETs used in other electronic circuits integrated on
the same chip 1. In a possible embodiment, the generated voltage of the on-chip voltage
generation circuit 2 can be passed to an associated test pin of the chip 1. The voltage
V
out generated by the on-chip voltage generation circuit 2 applied to the test pin of
the integrated circuit 1 can then be measured by an external measurement circuit to
derive information about the threshold voltage V
th of the MOSFETs integrated on the chip 1. The output threshold voltage applied to
the test pin of the integrated chip 1 can also be used for an external power supply
and/or generating a bias current used for the electronic circuitry within the integrated
chip 1. The measured threshold voltage V
th of the MOSFETs integrated on the chip 1 further allows a designer of the integrated
chip 1 to use the information for debugging faults in the chip design.
[0026] Fig. 2 shows a possible embodiment of an on-chip voltage generation circuit 2 integrated
on a chip 1. In the illustrated embodiment of Fig. 2, the on-chip voltage generation
circuit 2 comprises two identical MOSFET transistors 3, 4. The MOSFETs 3, 4 are connected
in diode configuration as load of a corresponding PMOS current source as illustrated
in Fig. 2. The MOSFETs 3, 4 are operated in a strong inversion and saturation region.
As illustrated in Fig. 2, the gate terminals G of the MOSFETs 3, 4 are connected directly
to the respective drain terminals D of the MOSFETs 3, 4. Further, the source terminals
S of the MOSFETs 3, 4 are connected to a common ground 6. As shown in Fig. 2, a first
electric current I1 is passed through the first MOSFET 3 and a second electrical current
I2 is passed to the second MOSFET 4 of the on-chip voltage generation circuit 2. The
second electrical current I2 is in a possible embodiment a current replica of the
first electrical current I1 and comprises a current strength being four times the
current strength of the first electrical current I1. In the illustrated embodiment
of Fig. 2, the on-chip voltage generation circuit 2 further comprises a buffer circuit
7 adapted to buffer a gate-source voltage V
gs of the second MOSFET 4 of the on-chip voltage generation circuit 2. The on-chip voltage
generation circuit 2 further comprises in the illustrated embodiment a subtracting
circuit 8 implemented by an inverting amplifier adapted to subtract the difference
voltage between the gate-source voltage of the second MOSFET and first MOSFET from
the gate-source voltage of the first MOSFET 4 to generate an output voltage V
out being equivalent to the threshold voltage V
th of the all identical MOSFETs on the chip 1 as the threshold voltage is a common parameter
for all identical MOSFETs in one chip. The generated output voltage V
out is applied in the illustrated embodiment to an output terminal 9 of the on-chip voltage
generation circuit 2.
[0027] The working principle of the on-chip voltage generation circuit 2 as illustrated
in Fig. 2 is described in the following. The MOSFET transistors 3, 4 operate in a
strong inversion and saturation region. The electrical current flowing through such
a MOSFET device I
dsat can be described by the following formula:

wherein
µ is the charge carrier effective mobility,
W is the gate width,
L is the gate length,
Cox is the gate oxide capacitance per unit area,
Vth is the transistor threshold voltage,
Vgs is the voltage applied to the gate terminal,
Vds is the drain-source voltage and
λ is the channel length modulation parameter.
[0028] From equation (1), the gate-source voltage V
gs of the MOSFET transistor can be derived as follows:

[0029] The two identical MOSFET transistors 3, 4 are connected in diode configuration. Through
the first MOSFET 3, a first current I1 is passed through. Through the MOSFET 4, a
second electrical current I2 is passed having a current strength being four times
the current strength of the first electrical current I1:

[0030] Based on the formula (2), the gate-source voltage of MOSFET 3 can be described as
follows:

[0031] From the configuration illustrated in Fig. 2, the drain-source voltages V
ds of both MOSFET transistors 3, 4 can be set to be equal:

[0032] Accordingly,

[0033] The drain-source voltages V
DS of both MOSFET transistors 3, 4 can be set to be equal (see equation (5)) or the
MOSFET transistors 3, 4 can be designed such that they are long enough to make the
channel length modulation parameter negligible. For this case, one can replace

to get:

[0034] Accordingly, the gate-source voltage V
gs1 of the first MOSFET 3 is higher than the threshold voltage V
th by voltage V
0v and the gate-source voltage V
gs2 of the second MOSFET transistor 4 is higher than V
th by twice the voltage V
0v. Consequently, the gate-source voltage V
gs1 of the first MOSFET transistor 3 differs from the gate-source voltage V
gs2 of the second MOSFET transistor 4 by the voltage V
0v. Consequently, by calculating the difference between the gate-source voltage V
gs2 of the second MOSFET 4 and the gate-source voltage V
gs1 of the first MOSFET 3, the threshold voltage V
th of the MOSFETs 3, 4 is achieved. This is performed by means of the buffer circuit
7 and the subtracting circuit 8 as illustrated in the embodiment of Fig. 2. The buffer
circuit 7 can be implemented by an operational amplifier as illustrated in Fig. 2
and acts as a buffer for the gate-source voltage V
gs2 of the second MOSFET 4. The subtracting circuit 8 comprises an operational amplifier
8A. The subtracting circuit 8 is adapted to subtract the difference voltage between
the gate-source voltage of the second MOSFET 4 and first MOSFET 3 to generate an output
voltage V
out being equivalent to the threshold voltage V
th of the on-chip MOSFET transistors.The on-chip voltage generation circuit 2 does output
the output voltage V
out at its output terminal 9. The threshold voltage V
th of the MOSFETs 3, 4 also corresponds to the threshold voltages V
th of other MOSFETs integrated on the same chip 1. In the illustrated embodiment of
Fig. 2, the buffer circuit 7 comprises a first operational amplifier 7A having an
output being fed back directly to an inverting input (-) of the first operational
amplifier 7A and having a non-inverting input (+) connected directly to the drain
terminal D of the second MOSFET 4 of the on-chip voltage generation circuit 2. Further,
in the illustrated embodiment of Fig. 2, the subtracting circuit 8 comprises a second
operational amplifier 8A having an output fed back via a resistor 8B to an inverting
input (-) of the second operational amplifier 8A and having a non-inverting input
(+) being connected directly to the drain terminal D of the first MOSFET 3 of the
on-chip voltage generation circuit 2 as illustrated in Fig. 2. As can be seen in Fig.
2, the output of the first operational amplifier 7A of the buffer circuit 7 is connected
via a further resistor 8C of the subtracting circuit 8 to the inverting input (-)
of the second operational amplifier 8A.
[0035] In a possible embodiment, the resistance of the resistor 8C is equal to the resistance
of the resistor 8B. In this embodiment, the output voltage V
out of the on-chip voltage generation circuit 2 is given as follows:

[0036] Fig. 3 shows a possible exemplary embodiment of an on-chip voltage generation circuit
2 according to the first aspect of the present invention.
[0037] In the illustrated embodiment of Fig. 3, the on-chip voltage generation circuit 2
comprises bias terminals 10, 11, 12 used for operating the on-chip voltage generation
circuit 2. The first bias terminal 10 provides a bias for generating a current replica.
The current replica is generated by the current mirroring PMOS transistors 13, 14
as illustrated in Fig. 3. The second bias terminal 11 is adapted to receive a bias
for the cascoding PMOS transistors 15, 16. The on-chip voltage generation circuit
2 further comprises a third bias terminal 12 for cascoding NMOS transistors 17, 18
as shown in Fig. 3. The on-chip voltage generation circuit 2 shown in Fig. 3 comprises
a buffer circuit 7 having a first operational amplifier 7A comprising a non-inverting
input connected to the cascaded diode connected NMOS FET 4. Further, the on-chip voltage
generation circuit 2 comprises a subtracting circuit 8 including an operational amplifier
8A having a non-inverting input connected to the cascaded diode connected NMOS FET
3. The generated output voltage V
out output at the output terminal 9 of the on-chip voltage generation circuit 2 is equivalent
to the threshold voltages V
th of the used NMOS transistors.
[0038] Fig. 4 shows a possible further embodiment of an integrated chip 1. In the illustrated
embodiment, the output voltage V
out generated by the on-chip voltage generation circuit 2 which is equivalent to the
threshold voltage V
th of the MOSFETs implemented on the chip 1 is applied internally to an on-chip bias
current generation circuit 19. The on-chip bias current generation circuit 19 is also
integrated on the chip 1 and is adapted to generate bias currents I
BIAS. In the illustrated exemplary embodiment, the generated bias current I
BIAS can be supplied to a further electronic circuitry 20 also integrated on the chip
1. Further, in the illustrated embodiment of the chip 1 as shown in Fig. 4, the chip
1 comprises an integrated measurement circuit 21 adapted to measure and/or to store
the generated voltage output by the integrated on-chip voltage generation circuit
2. The measured voltage can then be output via an external pin 22 of the chip 1 or
used for other purposes.
[0039] In a preferred embodiment, the on-chip voltage generation circuit 2 applies the generated
voltage V
th directly to a test pin 23 of the integrated circuit 1 as illustrated in Fig. 5. The
integrated circuits implemented on chip 1 can comprise a further electronic circuitry
besides the on-chip voltage generation circuit 2 as illustrated in Fig. 5. The voltage
generated by the on-chip voltage generation circuit 2 is applied to the test pin 23
of the chip 1. In a possible embodiment, an external measurement circuit 24 can be
connected to the test pin 23 of the chip 1, wherein the external measurement circuit
24 is adapted to measure the voltage generated by the on-chip voltage generation circuit
2 of the chip 1. In a possible embodiment, the external measurement circuit 24 can
be integrated in a test apparatus 25 having a processing unit 26 adapted to analyse
the voltage measured by the external measurement circuit 24 to derive information
about process parameters. These process parameters can for instance comprise manufacturing
process parameters of manufacturing processes for manufacturing the integrated chip
1. The information or data derived by the processing unit 26 can be output to a user
such as a chip designer and/or to an operator during a manufacturing process and/or
during quality control. Further, the information and data derived by the processing
unit 26 can be used to generate automatically control signals in a manufacturing process
for fabricating electronic chips 1. The monitoring or test apparatus 25 as illustrated
in Fig. 5 can be used to monitor and/or control a manufacturing process. Further,
the apparatus 25 can be used for supporting a chip designer when designing an electronic
chip 1. In the illustrated embodiment, the external measurement circuit 24 integrated
in the apparatus 25 monitors a single voltage generated by a single on-chip voltage
generation circuit 2 of the chip 1. In a further possible embodiment, the integrated
chip 1 can comprise several on-chip voltage generation circuits 2 located at different
locations each connected to an associated test pin 23 to output a voltage monitored
and evaluated by the test apparatus 25. In a further possible embodiment, the processing
apparatus 26 can also generate control signals in response to the measured voltage
being equivalent to the threshold voltage used for trimming a further internal chip
circuitry of the integrated chip 1.
[0040] Fig. 6 shows a flowchart of a possible exemplary embodiment of a method for deriving
information about a threshold voltage of MOSFETs integrated on a chip 1 according
to a further aspect of the present invention.
[0041] In a first step S1, a voltage is generated corresponding to a threshold voltage of
MOSFETs integrated on the chip 1 by an on-chip voltage generation circuit 2 of the
chip 1. In a further step S2, the generated voltage is measured by a measurement circuit.
The measurement circuit can be either integrated on the same chip 1 or implemented
by an external measurement circuit such as the measurement circuit 24 illustrated
in the embodiment of Fig. 5.
[0042] Fig. 7 shows a flowchart of a further possible exemplary embodiment, wherein the
measured voltage is further processed in step S3 to derive information about process
parameters. As can be seen in Fig. 7, the voltage measured in step S2 is further processed
in step S3 to derive information about the process parameters and/or operation parameters
of the chip under test. The derived information and data can further be processed
to generate automatically control signals used for controlling the manufacturing process
of the chip 1 and/or the operation process of the chip 1. The derived information
can also be used for trimming an internal circuitry of the monitored chip 1. In a
possible embodiment, the derived information can be passed to a chip designer or chip
design tool which uses the information for the right setting of chip control registers.
Accordingly, the voltage generated by the on-chip voltage generation circuit 2 and
measured by the measurement circuit can be used for many different purposes.
REFERENCE SIGN LIST
[0043]
- 1
- integrated chip
- 2
- on-chip voltage generation circuit
- 3
- first MOSFET
- 4
- second MOSFET
- 5
- power supply terminal
- 6
- reference potential
- 7
- buffering circuit
- 7A
- operational amplifier
- 8
- subtracting circuit
- 8A
- operational amplifier
- 8B
- resistor
- 8C
- resistor
- 9
- output terminal
- 10, 11, 12
- bias terminals
- 13, 14
- PMOS transistors
- 15, 16
- cascoding PMOS transistors
- 17, 18
- cascoding NMOS transistors
- 19
- on-chip bias current generation circuit
- 20
- integrated electronic circuitry
- 21
- on-chip measurement circuit
- 22
- output terminal
- 23
- test pin
- 24
- external measurement circuit
- 25
- test apparatus
- 26
- processing unit
1. An on-chip voltage generation circuit (2) integrated on a chip (1),
wherein said on-chip voltage generation circuit (2) is adapted to generate a voltage
equivalent to a threshold voltage, Vth, of MOSFETs integrated on said chip (1).
2. The on-chip voltage generation circuit according to claim 1 wherein the voltage generated
by said on-chip voltage generation circuit (2) is equal to the threshold voltage,
Vth, of MOSFETs implemented in the on-chip voltage generation circuit (2) and of MOSFETs
of other electronic circuits integrated on the same chip (1).
3. The on-chip voltage generation circuit according to claim 1 or 2 wherein a bias current
is generated by an on-chip bias current generation circuit (19) of said chip (1).
4. The on-chip voltage generation circuit according to any of the preceding claims 1
to 3 wherein the voltage generated by said on-chip voltage generation circuit (2)
is output at a test pin (23) of said chip (1).
5. The on-chip voltage generation circuit according to claim 4 wherein an external measurement
circuit (24) connected to the test pin (23) of said chip (1) is adapted to measure
the voltage generated by said on-chip voltage generation circuit (2) of said chip
(1).
6. The on-chip voltage generation circuit according to claim 5 wherein a processing unit
(26) is adapted to analyse the voltage measured by said external measurement circuit
(24) to derive information about process parameters.
7. The on-chip voltage generation circuit according to any of the preceding claims 1
to 3 wherein the voltage generated by said on-chip voltage generation circuit (2)
is measured by an on-chip measurement circuit (21) integrated on said chip (1).
8. The on-chip voltage generation circuit according to any of the preceding claims 1
to 7 wherein said on-chip voltage generation circuit (2) comprises identical MOSFET
diode connected transistors (3, 4) operated in a strong inversion and saturation region.
9. The on-chip voltage generation circuit according to claim 8 wherein a first electrical
current (I1) is passed through a first MOSFET (3) of said on-chip voltage generation
circuit (2) and a second electrical current (I2) is passed through a second MOSFET
(4) of said on-chip voltage generation circuit (2),
wherein the second electrical current (I2) is a current replica of the first electrical
current (I1) and has a current strength being four times the current strength of the
first electrical current (I1).
10. The on-chip voltage generation circuit according to claim 9 wherein the on-chip voltage
generation circuit (2) comprises a buffer circuit (7) adapted to buffer a gate-source
voltage of the second MOSFET (4) of said on-chip voltage generation circuit (2).
11. The on-chip voltage generation circuit according to claim 10 wherein the on-chip voltage
generation circuit (2) comprises a subtracting circuit (8) adapted to subtract the
difference voltage between the gate-source voltage of the second MOSFET (4) and first
MOSFET (3) to generate an output voltage being equivalent to the threshold voltage,
Vth, of the on-chip MOSFET transistors.
12. The on-chip voltage generation circuit according to claim 10 or 11 wherein the buffer
circuit (7) comprises a first operational amplifier (7A) having an output fed back
directly to an inverting input (-) of said first operational amplifier (7A) and having
a non-inverting input (+) connected to a drain terminal (D) of the second MOSFET (4)
of said on-chip voltage generation circuit (2).
13. The on-chip voltage generation circuit according to any of the preceding claims 10
to 12 wherein the subtracting circuit (8) comprises a second operational amplifier
(8A) having an output fed back via a resistor (8B) to an inverting input (-) of said
second operational amplifier (8A) and having a non-inverting input (+) connected to
a drain terminal (D) of said first MOSFET (3) of said on-chip voltage generation circuit
(2).
14. The on-chip voltage generation circuit according to claim 12 or 13 wherein the output
of the first operational amplifier (7A) is connected via a further resistor (8C) to
the inverting input (-) of the second operational amplifier (8A).
15. The on-chip voltage generation circuit according to claim 13 or 14 wherein the resistance
of both resistors (8B, 8C) is equal.
16. A chip (1) comprising an on-chip voltage generation circuit (2) according to any of
the preceding claims 1 to 15 adapted to generate an output voltage corresponding to
a threshold voltage, Vth, of MOSFETs integrated on said chip (1) and applied to a test pin (23) of said chip
(1) for measurement by an external measurement circuit (24) and/or applied to an internal
on-chip measurement circuit (21) integrated on said chip (1).
17. The chip according to claim 16 further comprising at least one on-chip bias current
generation circuit (19) integrated on said chip (1) and adapted to generate a bias
current in response to the voltage generated by said on-chip voltage generation circuit
(2) of said chip (1).
18. A method for deriving information about process parameters of a chip (1) comprising
the steps of:
- generating (S1) a voltage corresponding to a threshold voltage, Vth, of MOSFETs integrated on said chip (1) by an on-chip voltage generation circuit
(2) of said chip;
- measuring (S2) the generated voltage by a measurement circuit and
- analysing (3) the measured voltage to derive information about process parameters.