ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE - Patent 3356579

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EP 3 356 579 A1

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(43)	Date of publication:
	08.08.2018 Bulletin 2018/32

(21)	Application number: 16778284.6

(22)	Date of filing: 30.09.2016

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International Patent Classification (IPC):

C25D 3/58^(2006.01)
C25D 5/10^(2006.01)
C23C 18/48^(2006.01)

C25D 3/60^(2006.01)
C25D 7/00^(2006.01)

(86)	International application number:
	PCT/EP2016/073427

(87)	International publication number:
	WO 2017/055553 (06.04.2017 Gazette 2017/14)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	MA MD

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Priority:

30.09.2015 EP 15187511

(71)	Applicant: Coventya S.p.A.
	22060 Carugo (CO) (IT)

(72)	Inventors:
	NELIAS, Coline 49000 Angers (FR) CIAPPELLI, Samuele 51010 Marliana (PT) (IT)

(74)	Representative: Pfenning, Meinig & Partner mbB
	Patent- und Rechtsanwälte Theresienhöhe 11a 80339 München 80339 München (DE)

(54)	ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE