TECHNICAL FIELD
[0001] The present disclosure relates to a technical field of clothes drying, in particular,
relates to a clothes drying device applying a semiconductor thermoelectric cooler
and a method for drying clothes using the drying device to dry clothes.
BACKGROUND
[0002] A clothes drying device (e.g. a clothes dryer, a washer-dryer, etc.) generally comprises
a clothes accommodating drum for accommodating the clothes to be dried, and a drying
duct which is located outside the clothes accommodating drum and is communicated with
the clothes accommodating drum. A drying airflow is blew into the clothes accommodating
drum through the drying duct. When the drying airflow flows through the clothes accommodating
drum, remained moisture of the clothes in the clothes accommodating drum is heated
into water vapor, the water vapor flows out from the clothes accommodating drum and
flows into the drying duct with the air, and the water vapor is condensed in the upstream
section of the drying duct. The relatively dry air after condensation is continued
to flow in the drying duct and flows into the clothes accommodating drum again for
continuous circulation. The existing washer-dryer generally adopts the way of water
cooling condensation, for the way of water cooling condensation, cold water is required
to continuously be introduced into the drying duct during the clothes drying process,
at the same time, the flow rate of the cold water in the drying duct is required to
be controlled to be relatively small in order to save water as much as possible. Therefore,
the condensing efficiency of the condensation way is relatively lower, and the water
consumption of the condensation way is relatively larger. For the way of air condensation,
it is required to use the room-temperature air outside the device to exchange heat
with the humid and hot air in the drying duct. Since the way needs to exchange heat
by the pipe wall, the condensation efficiency is quite lower, resulting in longer
clothes drying time and higher energy consumption.
[0003] In order to solve the above problems, the invention patent No.
201210387889.4 discloses a condensing device and a dryer having the condensing device. The condensing
device comprises a semiconductor thermoelectric cooler. Two sides of the semiconductor
thermoelectric cooler are respectively connected with a hot end heat releasing sheet
and a cold end heat absorbing heat by a heat conducting block. A thermal insulating
material is filled between the hot end heat releasing sheet and the cold end heat
absorbing sheet to isolate the heat conduction of the hot end heat releasing sheet
and the cold end heat absorbing sheet. The dryer also comprises a drying chamber and
a circulating air duct of which two ends are communicated with the drying chamber.
The condensing device is installed in the circulating air duct. During the flowing
of the air in the circulating air duct, the air flows through the cold end heat absorbing
sheet of the condensing device to be subject to condensation and dehumidification,
in turn, flows through the hot end heat releasing sheet to be heated, and then, returns
to the drying chamber. However, the device exists the following deficiencies:
First of all, although the semiconductor thermoelectric cooler has two functions,
i.e. both cooling and heating, the cooling power of a single cooling element of the
semiconductor thermoelectric cooler is normal. It needs a plurality of unit components
to meet the condensation requirements, which will increase the manufacturing cost
or energy consumption.
[0004] Moreover, in order to further improve the condensing effect, some clothes drying
device only utilizes the heating function of the semiconductor module, a condensing
device is separately arranged in the circulating duct, and the condensing device must
depend on the cold source (such as electric driving, etc.) to achieve the cooling
effect. For example, a Chinese invention patent No.
201210008372.X discloses a new type of dryer, which comprises a case and an inner drum, and also
comprises an air duct, a semiconductor thermoelectric cooler, a condenser and an evaporator.
The inner drum is communicated with the air duct through a communication pipe assembly,
the condenser and the evaporator are located in the air duct. A hot end of the semiconductor
thermoelectric cooler is connected with the condenser through a first heat exchange
pipe, and a cold end of the semiconductor thermoelectric cooler is connected with
the evaporator through a second heat exchange pipe. The communication pipe assembly
is provided with a driving device for making the air in the communication pipe assembly,
the air duct and the inner drum flow, the air duct is provided with a water removing
pipe. Because of the condenser separately arranged, not only the cooling function
of the semiconductor thermoelectric cooler wastes, but also the cost and energy consumption
increase.
[0005] In view of this, the present disclosure is proposed.
SUMMARY
[0006] The first object of the present disclosure is to provide a clothes drying device
which utilizes the heat transfer principle and can cooperate with a semiconductor
module without a cold source to achieve an optimal effect of air condensation and
heating. The second object of the present disclosure is to provide a method for drying
clothes by applying the above clothes drying device.
[0007] In order to achieve the first object of the present disclosure, the technical scheme
is adopted as follows: a clothes drying device, comprising a drum body for accommodating
clothes, an air duct for allowing air to flow and be dried, a condensing module and
a semiconductor module.
[0008] The condensing module comprises a heat absorbing portion and a heat releasing portion,
the heat absorbing portion is arranged in the air duct to absorb heat from air in
the drum body and to preliminarily condense the air; the heat releasing portion is
arranged outside moisture of air duct to dissipate the heat absorbed by the heat absorbing
portion to outside of the clothes drying device;
the semiconductor module is arranged in the air duct and comprises a cold end and
a hot end, the cold end re-condenses moisture of air preliminarily condensed by the
condensing module, the hot end heats the re-condensed air.
[0009] After humid and hot air enters into the air duct, the heat absorbing portion of the
condensing module uses the heat transfer effect to absorb heat from the air and transfer
the heat to the heat releasing portion, and the heat releasing portion dissipates
the heat to the outside of the device, and that forms a condensing circulation. No
other cold source is needed. And the circulation is performed rapidly, the heat can
be continuously transferred, and the water vapor in the humid and hot air can be efficiently
condensed. After preliminarily condensation, secondary condensation is performed by
the semiconductor module, thus, the removal rate of the water vapor in the air is
ensured, and the clothes drying efficiency is further improved. In addition, the condensed
air is heated by using the Peltier effect of the semiconductor module, and eventually
returns to the drum body for drying clothes, as so to reduce energy consumption while
efficiently drying clothes.
[0010] Preferably, the air duct is provided with a chamber formed by outwardly protruding
of a side wall of the air duct, the semiconductor module is arranged in the chamber,
the cold end faces an air inlet of the chamber, and the hot end faces an air outlet
of the chamber; the air passing through the chamber in the air duct enters into the
chamber through the air inlet after being condensed by the cold end, then is heated
by the hot end and flows into next section of the air duct through the air outlet.
[0011] Preferably, the air duct is provided with a horizontal pipe, a side wall of the horizontal
pipe is provided with an outwardly expanding section protruding downwards to form
a transverse D-shaped chamber in the horizontal pipe, two sides of an upper part of
the transverse D-shaped chamber are respectively the air inlet in a horizontal direction
and the air outlet in a vertical direction, the air outlet is communicated with a
vertical pipe, the semiconductor module is arranged between the air inlet and the
air outlet, a drainage outlet is arranged at a bottom of the transverse D-shaped chamber.
[0012] Preferably, the semiconductor module also comprises multilayer heat absorbing fins
vertically arranged at the cold end and multilayer heat releasing fins vertically
arranged at the hot end, gaps between the multilayer heat absorbing fins form an air
inlet passage facing the air inlet, gaps between the multilayer heat releasing fins
form an air outlet passage facing the air outlet, the air entering into the air inlet
is blocked by the cold end in the air let passage and then turns down to enter into
the chamber, and then is guided upwards by an inner wall of the chamber, and flows
out of the chamber through the air outlet passage and the air outlet, to form a U-shaped
ventilation trajectory.
[0013] Preferably, the condensing module is provided with a closed chamber, the closed chamber
contains working fluid, the heat absorbing portion preliminarily condenses moisture
of air by heat absorption and evaporation of the working fluid, the heat releasing
portion dissipates the heat by condensation of the working fluid. The condensation
of the humid and hot air in the air duct is completely realized by the phase change
principle that the fluid is evaporated to absorb heat and is condensed to release
heat, not only the structure is simple, but also the heat transfer speed is rapid.
[0014] Preferably, the condensing module comprises a heat pipe having an evaporation section
and an condensation section, the evaporation section and the condensation section
of the heat pipe are both provided with a heat exchange sheet group, the evaporation
section and the heat exchange sheet group form the heat absorbing portion, the condensation
section and the heat exchange sheet group form the heat releasing portion.
[0015] Preferably, an axial fan is arranged on the heat exchange sheet group of the condensation
section of the heat pipe, airflow of the axial fan dissipates heat of gaps between
heat exchange sheets to further improve the heat dissipation efficiency.
[0016] Preferably, the condensing module comprises a vapor chamber having an evaporation
sector and a condensation sector, the evaporation sector forms the heat absorbing
portion, and the condensation sector forms the heat releasing portion.
[0017] Preferably, the air duct comprises an air exhausting pipe, a condensing passage,
an air returning pipe and a drying passage connected in sequence, the air in the drum
body enters into the air duct through the air exhausting pipe, the heat absorbing
portion of the condensing module is located in the condensing passage, the semiconductor
module is located in the air returning pipe, the drying passage is connected with
the drum body, and a fan for allowing air to circulate is arranged in the drying passage.
[0018] Preferably, the drainage outlet is arranged at a bottom of the condensing passage.
[0019] Preferably, a heater for reheating the air is arranged in the drying passage. The
air is re-heated to further improve the clothes drying efficiency.
[0020] In order to achieve the second object of the present disclosure, the technical scheme
is adopted as follows:
A method for drying clothes in the clothes drying device, comprising the following
steps:
supplying the air for drying the clothes into the drum body, taking moisture of the
clothes away from the drum body by the air to form humid and hot air and the humid
and hot air entering into the air duct;
absorbing the heat of the air in the air duct by the heat absorbing portion of the
condensing module, dissipating the heat from the air to the outside of the device
by the heat releasing portion of the condensing module, and the air being preliminarily
condensed;
and then re-condensing the air by the cold end of the semiconductor module, the re-condensed
air being heated by the hot end of the semiconductor module, and eventually returning
to the drum body to dry clothes again.
[0021] By adopting the above technical scheme, the present disclosure has the following
benefits:
The condensation circulation is realized by using the heat transfer effect and the
principle of phase transition. No other cold source is needed. And the circulation
is performed rapidly, the heat can be continuously transferred, and the water vapor
in the humid and hot air can be efficiently condensed. After preliminarily condensation,
secondary condensation is performed by the semiconductor module, thus, the removal
rate of the water vapor in the air is ensured, and the clothes drying efficiency is
further improved. In addition, the condensed air is heated by using the Peltier effect
of the semiconductor module, and eventually returns to the drum body for drying clothes,
as so to reduce energy consumption while efficiently drying clothes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] As one part of the present disclosure, the drawings are used for providing further
understanding for the present disclosure; and schematic embodiments and descriptions
thereof of the present disclosure are used for explaining the present disclosure without
forming improper restriction to the present disclosure. Apparently, the drawings described
below are only some embodiments, and other drawings can be obtained by those having
ordinary skill in the art according to these drawings on the premise of not making
inventive labor. In the drawings:
Fig. 1 is a front view of a clothes drying device in an embodiment of the present
disclosure;
Fig. 2 is a structure schematic diagram of the clothes drying device in an embodiment
of the present disclosure;
Fig. 3 is a side view of the clothes drying device in an embodiment of the present
disclosure;
Fig. 4 is a structure schematic diagram of a heat pipe and a condensing passage of
the clothes drying device in an embodiment of the present disclosure;
Fig. 5 is a structure and principle schematic diagram of the heat pipe of the clothes
drying device in an embodiment of the present disclosure;
Fig. 6 is a structure schematic diagram of a semiconductor module of the clothes drying
module in an embodiment of the present disclosure;
Fig. 7 is structure and principle schematic diagram of a vapor chamber of the clothes
drying device in another embodiment of the present disclosure.
[0023] Wherein: 1. drum body, 2. air duct, 21. air exhausting pipe, 22. condensing passage,
23. air returning pipe, 231. D-shaped chamber, 24. drying passage, 3. condensing module,
4. semiconductor module, 41. cold end, 42. hot end, 43. heat absorbing fins, 44. heat
releasing fins, 5. heat pipe, 551. pipe shell, 552. fluid absorbing wick, 51. evaporation
section, 52. condensation section, 6. axial fan , 7. fan, 8. vapor chamber, 81. evaporation
sector, 82. condensation sector, 9. heater.
[0024] It is necessary to note that these drawings and word descriptions are not aimed at
restricting the concept scope of the present disclosure in any way, but declaring
the conception of the present disclosure to those skilled in the art through referring
to specific embodiments.
DETAILED DESCRIPTION
[0025] To make the objects, technical schemes and advantages of the embodiments of the present
disclosure clearer, the technical schemes of the embodiments are clearly and completely
described below with reference to the drawings of the embodiments of the present disclosures;
and the following embodiments are used for describing the present disclosure, but
not limiting the scope of the present disclosure.
[0026] In the description of the present disclosure, it is necessary to note that orientation
or position relationships indicated by terms such as 'up', 'down', 'front', 'back',
'left', 'right', 'vertical', 'interior' and 'exterior' are orientation or position
relationships shown on the basis of the drawings, are only used for conveniently describing
the present disclosure and simplifying description without indicating or suggesting
that appointed devices or elements must have specific orientations or be constructed
and operated at the specific orientations. Therefore, the terms cannot be understood
to limit the present disclosure.
[0027] In the description of the present disclosure, it is necessary to note that except
for additional definite provision and restriction, terms such as 'mounting', 'connection'
and 'connecting' should be generally understood. For example, 'connection' may be
fixed connection, detachable connection or integrated connection; 'connection' may
be mechanical connection or electric connection; and 'connection' may be direct connection
or intermediate-medium indirect connection. For those of ordinary skill in the art,
the specific meanings of the above-mentioned terms in the present disclosure can be
understood according to particular cases.
Embodiment 1
[0028] As shown in Fig. 1 and Fig. 2, a clothes drying device comprises a drum body 1 for
accommodating clothes and an air duct 2 for allowing air to flow and be dried, the
clothes drying device also comprises a condensing module 3 and a semiconductor module
4.
[0029] The condensing module 3 comprises a heat absorbing portion and a heat releasing portion.
The heat absorbing portion is arranged in the air duct 2 to absorb the heat from the
air in the drum body 1 and to preliminarily condense moisture of air. The heat releasing
portion is arranged outside the air duct 2 to absorb the heat from the heat absorbing
portion and dissipate the heat to the exterior of the device.
[0030] The semiconductor module 4 is arranged in the air duct 2, and comprises a cold end
41 and a hot end 42. The cold end 41 condenses moisture of air preliminarily condensed
by the condensing module 3 again, and the heat end 42 heats the re-condensed air.
[0031] After humid and hot air enters into the air duct, the heat absorbing portion of the
condensing module 3 uses the heat transfer effect to absorb heat from the air and
transfer the heat to the heat releasing portion, and the heat releasing portion dissipates
the heat to the exterior of the device, and that forms a condensing circulation. No
other cold source is needed. And the circulation is performed rapidly, the heat can
be continuously transferred, and the water vapor in the humid and hot air can be efficiently
condensed. After preliminarily condensation, secondary condensation is performed by
the semiconductor module 4, thus, the removal rate of the water vapor in the air is
ensured, and the clothes drying efficiency is further improved. In addition, the condensed
air is heated by using the Peltier effect of the semiconductor module 4, and eventually
returns to the drum body for drying clothes, as so to reduce energy consumption while
efficiently drying clothes.
Embodiment 2
[0032] As a further preferred implementation mode of the embodiment of the present disclosure,
the air duct 2 is provided with a chamber which is formed by outwardly protruding
of a side wall of the air duct. The semiconductor module 4 is arranged in the chamber,
a cold end 41 faces an air inlet of the chamber, and a hot end 42 faces an air outlet
of the chamber. The air passing through the chamber in the air duct 2 enters into
the chamber through the air inlet after being condensed by the cold end 41, then is
heated by the hot end 42 and is introduced into next section of the air duct through
the air outlet.
[0033] As shown in Fig. 2, as a further preferred implementation mode of the embodiment
of the present disclosure, the air duct 2 comprises a horizontal pipe, a side wall
of the horizontal pipe comprises an outwardly expanding section protruding downwards
to form a transverse D-shaped chamber 231. Two sides of the upper part of the chamber
are respectively the air inlet in a horizontal direction and the air outlet in a vertical
direction, the air outlet is communicated with a vertical pipe. The semiconductor
module 4 is arranged between the air inlet and the air outlet. The bottom of the chamber
is provided with a drainage outlet. The vertical air inlet and the horizontal air
outlet can ensure the fluently air circulation.
[0034] As shown in Fig. 2 and Fig. 6, as a further preferred implementation mode of the
embodiment of the present disclosure, the semiconductor module 4 also comprises: multilayer
heat absorbing fins 43 which is vertically installed at the cold end and multilayer
heat releasing fins 44 which is vertically installed at the hot end. The gaps between
the multiple heat absorbing fins 43 form an air inlet passage facing the air inlet,
and the gaps between the multilayer heat releasing fins 44 form an air outlet passage
facing the air outlet. The air entering in through the air inlet is blocked by the
cold end 41 in air inlet passage and then turns down to enter into the chamber, and
is guided upwards by an inner wall of the chamber, and then flows out of the chamber
through the air outlet passage and the air outlet, to form a U-shaped ventilation
trajectory.
Embodiment 3
[0035] As a further preferred implementation mode of the embodiment of the present disclosure,
the condensing module comprises a closed chamber, the chamber contains working fluid.
The heat absorbing portion preliminarily condenses moisture of air by heat absorption
and evaporation of the working fluid, the heat releasing portion dissipates the heat
by condensation of the working fluid. The condensation of the humid and hot air in
the air duct is completely realized by the phase change principle that the fluid is
evaporated to absorb heat and is condensed to release heat, not only the structure
is simple, but also the heat transfer speed is rapid.
[0036] As shown in Fig. 5, as a further preferred implementation mode of the embodiment
of the present disclosure, the condensing module comprises a heat pipe 5 having an
evaporation section 51 and a condensation section 52. The evaporation section 51 and
the condensation section 52 of the heat pipe 5 are both provided with a heat exchange
sheet group. The evaporation section 51 and the heat exchange sheet group form a heat
absorbing portion, the condensation section 52 and the heat exchange sheet group form
a heat releasing portion.
[0037] As shown in Fig. 5, the heat pipe 5 is composed of a pipe shell 511 and a fluid absorbing
wick 552. An appropriate amount of working fluid is introduced, after pumping the
pipe until the pressure in the pipe is negative, so that a capillary porous material
of the fluid absorbing wick clinging to the inner wall of the pipe is filled with
fluid and then is sealed. One end of the pipe is the evaporation section 51, the other
end is the condensation section 52, and an insulation section can be arranged between
these two ends according to application needs. When heating the evaporation section
51 of the heat pipe 5, the working fluid in the wick is heated and evaporated, heat
around is taken away, and the heat is the latent heat of evaporation of the working
fluid, the vapor flows to the condensation section 52 of the heat pipe from the central
passage to be condensed into fluid, and releases the latent heat at the same time,
the fluid returns to the evaporation section 51 under the action of the capillary
force. In this way, a closed circulation is completed, so that a large amount of heat
is transferred to the heat releasing portion from the heat absorbing portion.
[0038] As shown in Fig. 4, as a further preferred implementation mode of the embodiment
of the present disclosure, an axial fan 6 is arranged on the heat exchange sheet group
of the condensation section 52 of the heat pipe, to further improve the heat dissipation
efficiency.
Embodiment 4
[0039] As shown in Fig. 1, as a further preferred implementation mode of the embodiment
of the present disclosure, the air duct 2 comprises an air exhausting pipe 21, a condensing
passage 22, an air returning pipe 23 and a drying passage 24 which are connected in
turn. The air in the drum body 1 enters into the air duct 2 through the air exhausting
pipe 21. The heat absorbing portion of the condensing module 3 is located inside the
condensing passage 22. The semiconductor module 4 is located in the air returning
pipe23. The drying passage 24 is connected with the drum body 1 and a fan 7 for making
air to circulate is arranged in the drying passage 24.
[0040] The outwardly expanding section is arranged at the air returning pipe 23, and the
outwardly expanding section comprises the air inlet and the air outlet. The air inlet
is connected with the condensing passage 22, and the air outlet is connected with
the drying passage 24. The heat absorbing fins 43 of the semiconductor module is arranged
near the air inlet, the heat releasing fins 44 is arranged near the air outlet. The
air after being preliminarily condensed enters into the outwardly expanding section,
is condensed and heated again in the D-shaped chamber of the outwardly expanding section,
and enters into the drying passage 24 through the air outlet.
[0041] As shown in Fig. 2, as a further preferred implementation mode of the embodiment
of the present disclosure, a heater 9 using for reheating the air is arranged in the
drying passage 24. The air is reheated to further improve the clothes drying efficiency.
Embodiment 5
[0042] As shown in Fig. 7, the differences between the present embodiment and the above
embodiments are as follows: the condensing module 3 comprises a vapor chamber 8 which
has an evaporation sector 81 and a condensation sector 82. The evaporation sector
81 forms the heat absorbing portion of the condensing module 3, and the condensation
sector 82 forms the heat releasing portion of the condensing module 3.
[0043] The working principle of the vapor chamber 8 is same with that of the heat pipe,
and the working principle of the vapor chamber 8 comprises four main steps, i.e. conduction,
evaporation, convection and condensation. The vapor chamber 8 is a dual-phase fluid
device which is formed by the mode that pure water is injected into a container full
of micro structures. The heat enters the vapor chamber from the outer high-temperature
zone through heat conduction, the water around point heat source quickly absorbs the
heat and vaporizes into the vapor, and a large amount of heat energy is taken away.
Then using the latent heat ability of the vapor, the vapor in the vapor chamber diffuses
to low-pressure zone from high-pressure zone, when the vapor is in contact with the
inner wall with lower temperature, the vapor is quickly condensed into liquid and
release heat energy. The condensed water flows back to the point heat source by the
capillary action of the micro structures, to complete a heat transfer cycle and to
form a dual-phase circulation system that the water and the vapor coexist. The vaporization
of the water in the vapor chamber is continued to be carried out, the pressure in
the vapor chamber will maintain equilibrium with the change of the temperature. The
value of the thermal conductivity coefficient is relatively low when the water operates
at a lower temperature, but the vapor chamber can also operate at 5 °C or 10°C because
the viscosity of the water will change at different temperature. Because the backflow
of the liquid depends on the capillary action, the vapor chamber is less affected
by gravity, so that the design space of the application system can be used at any
angle. The vapor chamber needs no power and any moving components, and the vapor chamber
is a completely sealed passive device.
Embodiment 6
[0044] A method for drying clothes adopting the clothes drying device of the above embodiments,
comprises the following steps:
supplying air for drying clothes into the drum body 1, taking moisture of the clothes
away from the drum body 1 by the air to form humid and hot air, and the humid and
hot air enters into the air duct 2.
[0045] The heat of the air entering into the air duct is absorbed by the heat absorbing
portion of the condensing module 3, the absorbed heat of the air is dissipated to
the outside of the device by the heat releasing portion of the condensing module 3,
the air is preliminary condensed.
[0046] Then the preliminary condensed air is re-condensed by the cold end 41 of the semiconductor
module 4, the condensed air is heated by the hot end 42 of the semiconductor module,
and the air eventually returns to the drum body 1 to dry clothes again.
[0047] The implementation solutions of the foregoing embodiments can be further combined
or replaced. The embodiments are merely the description of the preferred embodiments
of the present invention, but are not intended to limiting the conception and scope
of the present invention. Without departing from the scope of the technical solution
of the present invention, any changes and modifications made according to the technical
essence of the present invention by any persons skilled in the present invention shall
all be covered within the scope of the technical solution of the present invention.
1. A clothes drying device, comprising a drum body for accommodating clothes, an air
duct for allowing air to flow and be dried, a condensing module and a semiconductor
module, wherein:
the condensing module comprises a heat absorbing portion and a heat releasing portion,
the heat absorbing portion is arranged in the air duct to absorb heat from air in
the drum body and to preliminarily condense moisture of air; the heat releasing portion
is arranged outside the air duct to dissipate the heat absorbed by the heat absorbing
portion to outside of the clothes drying device;
the semiconductor module is arranged in the air duct and comprises a cold end and
a hot end, the cold end re-condenses moisture of air preliminarily condensed by the
condensing module, the hot end heats the re-condensed air.
2. The clothes drying device according to claim 1, wherein the air duct is provided with
a chamber formed by outwardly protruding of a side wall of the air duct,
the semiconductor module is arranged in the chamber,
the cold end faces an air inlet of the chamber, and the hot end faces an air outlet
of the chamber;
the air passing through the chamber in the air duct enters into the chamber through
the air inlet after being condensed by the cold end, then is heated by the hot end
and flows into next section of the air duct through the air outlet.
3. The clothes drying device according to claim 1 or 2, wherein the air duct is provided
with a horizontal pipe,
a side wall of the horizontal pipe is provided with an outwardly expanding section
protruding downwards to form a transverse D-shaped chamber in the horizontal pipe,
two sides of an upper part of the transverse D-shaped chamber are respectively the
air inlet in a horizontal direction and the air outlet in a vertical direction,
the air outlet is communicated with a vertical pipe, the semiconductor module is arranged
between the air inlet and the air outlet, and
a drainage outlet is arranged at a bottom of the transverse D-shaped chamber.
4. The clothes drying device according to claim 3, wherein the semiconductor module comprises
multilayer heat absorbing fins vertically arranged at the cold end and multilayer
heat releasing fins vertically arranged at the hot end,
gaps between the multilayer heat absorbing fins form an air inlet passage facing the
air inlet, gaps between the multilayer heat releasing fins form an air outlet passage
facing the air outlet,
the air entering into the air inlet is blocked by the cold end in the air let passage
and then turns down to enter into the chamber, and then is guided upwards by an inner
wall of the chamber, and flows out of the chamber through the air outlet passage and
the air outlet, to form a U-shaped ventilation trajectory.
5. The clothes drying device according to claim 1, wherein the condensing module is provided
with a closed chamber, the closed chamber contains working fluid,
the heat absorbing portion preliminarily condenses moisture of air by heat absorption
and evaporation of the working fluid, and
the heat releasing portion dissipates the heat by condensation of the working fluid.
6. The clothes drying device according to claim 5, wherein the condensing module comprises
a heat pipe having an evaporation section and an condensation section,
the evaporation section and the condensation section of the heat pipe are both provided
with a heat exchange sheet group,
the evaporation section and heat exchange sheet group form the heat absorbing portion,
and
the condensation section and heat exchange sheet group form the heat releasing portion.
7. The clothes drying device according to claim 6, wherein an axial fan is arranged on
the heat exchange sheet group of the condensation section of the heat pipe, airflow
of the axial fan dissipates heat of gaps between heat exchange sheets.
8. The clothes drying device according to claim 5, wherein the condensing module comprises
a vapor chamber having an evaporation sector and a condensation sector, the evaporation
sector forms the heat absorbing portion, and the condensation sector forms the heat
releasing portion.
9. The clothes drying device according to claim 1, wherein the air duct comprises an
air exhausting pipe, a condensing passage, an air returning pipe and a drying passage
connected in sequence,
the air in the drum body enters into the air duct through the air exhausting pipe,
the heat absorbing portion of the condensing module is located in the condensing passage,
the semiconductor module is located in the air returning pipe,
the drying passage is connected with the drum body, and a fan for allowing air to
circulate is arranged in the drying passage.
10. The clothes drying device according to claim 9, wherein drainage outlet is arranged
at a bottom of the condensing passage.
11. The clothes drying device according to claim 9, wherein a heater for reheating the
air is arranged in the drying passage.
12. A method for drying clothes in the clothes drying device of any one of claims from
1 to 6, comprising the following steps:
supplying air for drying the clothes into the drum body, taking moisture of the clothes
away from the drum body by the air to form humid and hot air, and the humid and hot
air entering into the air duct;
absorbing the heat of the air in the air duct by the heat absorbing portion of the
condensing module, dissipating the heat from the air to the outside of the device
by the heat releasing portion of the condensing module, and the air being preliminarily
condensed;
and then re-condensing the air by the cold end of the semiconductor module, the re-condensed
air being heated by the hot end of the semiconductor module, and eventually returning
to the drum body to dry clothes again.