(19)
(11) EP 3 412 121 A1

(12)

(43) Date of publication:
12.12.2018 Bulletin 2018/50

(21) Application number: 16889178.6

(22) Date of filing: 01.02.2016
(51) International Patent Classification (IPC): 
H05K 1/11(2006.01)
H05K 3/42(2006.01)
 H05K 3/46(2006.01)
B82Y 30/00(2011.01)
(86) International application number:
PCT/FI2016/050062
(87) International publication number:
WO 2017/134331 (10.08.2017 Gazette 2017/32)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(71) Applicant: Elcoflex OY
90440 Kempele (FI)

(72) Inventor:
  • TARVAINEN, Timo
    90440 Kempele (FI)

(74) Representative: Berggren Oy, Helsinki & Oulu 
Isokatu 32
90100 Oulu
90100 Oulu (FI)

   


(54) METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD