[0001] This invention relates to a method of producing an electrolyte for electrodeposition
of a chromium-chromium oxide layer on a metal strip.
[0002] Recently, much attention has been given to the development of REACH compliant alternatives
for the hexavalent chromium electrolytes still used for the production of steels for
the packaging industry, such as ECCS. ECCS is an acronym for Electrolytic Chromium
Coated Steel. ECCS is also often called Tin Free Steel (TFS), because this material
was originally developed as a lower cost alternative for tinplate due to the high
tin prices at the time. This material consists of a thin gauge (0.10 - 0.49 mm) low-carbon
steel substrate with a very thin coating comprising a base layer of chromium metal
(50 - 150 mg/m
2) and a top layer of chromium oxide (7 - 35 mg/m
2). This material is particularly suitable for use in the packaging industry. ECCS
is typically used in the production of DRD two-piece cans and components that do not
have to be welded, such as ends, lids, crown corks, twist-off caps and aerosol bottoms
and tops. ECCS excels in adhesion to organic coatings. There are also many examples
of 'non-packaging' applications of ECCS, like automotive components (oil filters,
cylinder head gaskets), building trade (space bars for double glazing, light reflectors)
and house ware (cake tins, gas canister components).
[0003] Traditional chromium electrolytes contain hexavalent chromium, which is usually added
to the electrolyte as chromium trioxide (CrO
3). Hexavalent chromium is nowadays considered a hazardous substance that is potentially
harmful to the environment and constitutes a risk in terms of worker safety. To comply
with occupational safety and health regulations, the toxicity of hexavalent chromium
requires an expensive exhaust system to capture any aerosols being released during
electrolysis and also a complex waste water treatment of the effluents. The harmfulness
of hexavalent chromium (Cr(VI), Cr
6+) is attributed to its high oxidising potential and its easy permeation of biological
membranes. In contrast, trivalent chromium (Cr(III), Cr
3+) is not known to be harmful to body tissue. In fact, it is an important component
of a balanced human and animal diet and a deficiency is detrimental to the glucose
and lipid metabolism in mammals. Therefore, trivalent chromium plating is considered
a benign technology to replace hexavalent chromium plating.
[0004] In the development of an electrolyte based on trivalent chromium such as in
WO20141202316 a problem was encountered in that sulphite pollution of the electrolyte prevented
the deposition of the desired chromium-chromium oxide layer on the metallic substrate.
[0005] It is the object of this invention to provide an improved method for preparing a
sulphite free electrolyte for electroplating an uncoated steel strip with a Cr-CrOx
plating layer from a trivalent Cr-electrolyte.
[0006] The object of this invention is reached by a method of producing a plating electrolyte
for electrodepositing a chromium metal - chromium oxide coating layer on a steel substrate
in a continuous high speed plating line operating at a line speed of at least 60 m/min,
wherein the plating electrolyte comprises a trivalent chromium compound and wherein
the plating electrolyte is free of chloride ions, free of Cr6+-ions and free of boric
acid, wherein the plating electrolyte contains:
- basic chromium(III) sulphate and optionally chromium(III) formate,
- one or more of formic acid, sodium formate and potassium formate as complexing agent,
- one or more of sulphuric acid, sodium sulphate and potassium sulphate,
- optionally sulphuric acid or sodium hydroxide to adjust the pH of the electrolyte
to a value of between 1.0 and 3.0 measured at 25 °C,
to obtain a plating electrolyte which is free from sulphite ions and wherein the plating
electrolyte contains at most 500 mM Cr
3+-ions, complexing agent at a

molar ratio of at least 1:1, 0 to 2800 mM of sulphate (SO
42-).
[0007] The inventors made the observation that a fresh electrolyte solution produced in
accordance with this method on the basis of commercially available basic chromium(III)
sulphate concentrate contained sulphite ions. These sulphite ions were found to adversely
affect the plating quality of the chromium-chromium oxide plating layer deposited
on a steel strip. The desired chromium coating weight could not be deposited with
an acceptable appearance. After a thorough investigation of all relevant parameters
the investors found that the presence of the sulphite ions was the source of the problem.
[0008] Consequently the identification of the problem also presented the solution in that
the fresh electrolyte solution may not contain sulphite ions.
[0009] The final plating electrolyte therefore contains:
- basic chromium(III) sulphate and optionally chromium(III) formate,
- as complexing agent one or more of formic acid, sodium formate, potassium formate,
one or more of sodium sulphate and potassium sulphate,
- and optionally sulphuric acid or sodium hydroxide to adjust the pH of the electrolyte
to a value of between 1.0 and 3.0 measured at 25 °C,
and no sulphite ions, no chloride ions, no Cr
6+-ions and no boric acid
[0010] One obvious way to provide an electrolyte solution without sulphite ions is to prevent
the addition of sulphite ions to the solution. However, when using basic chromium(III)sulphate
as the source for the Cr
3+-ions this appeared to be troublesome. The inventors were able to identify that the
source of the sulphite pollution in the plating electrolyte was the basic chromium(III)
sulphate concentrate that is used for the preparation of the plating electrolyte.
[0011] Basic chromium(III) sulphate (CAS # 12336-95-7), also known as an important ingredient
for the tanning of leather, can be manufactured by reducing Cr(VI) to Cr(III) by the
addition of an excess of sulphur dioxide:
Na
2Cr
2O
7 + 3SO
2 + H
2O ⇆ (CrOHSO
4)
2·Na
2SO
4 (1)
Any excess SO
2 will result in the following reaction:
SO
2 + H
2O → H
2SO
3 (2)
[0012] The sulphurous acid (H
2SO
3) will end up as a contaminant in the final basic chromium(III) sulphate and is identified
as the source of the sulphite-ions in the electrolyte solution. In the aqueous solution
the sulphurous acid will dissociate in SO
32- and H
+ (or H
3O
+). This reaction can be reversed by making the concentrated solution containing the
dissolved basic chromium(III) sulphate or basic chromium(III) sulphate acidic:
SO
32- + 2H
+ ⇆ SO
2↑ + H
2O (2a)
The term concentrated solution can be any concentration between a substantially undiluted
concentrated solution and the final electrolyte solution suitable for disposal in
the plating cells. The advantage of using a concentrated solution is that the amount
of acid needed to drive out the SO
2 is smaller than when using a fully diluted solution, because the SO
2 is driven out by the pH reaching the value needed to shift the equilibrium reaction
(2a) to the right. So the degree of concentration of the concentrated solution is
relatively unimportant and more or less cost driven: the higher the concentration,
the lower the amount of acid needed to drive out the SO
2. After all SO
2 has been driven out from the (concentrated) solution sodium hydroxide or potassium
hydroxide is added to the acid concentrated solution to reduce the acidity. Also formate-ions
as complexing agent are added by adding a suitable amount of one or more of formic
acid, sodium formate, potassium formate and chromium(III) formate to the concentrated
solution to obtain the desired molar ratio of (complexing agent/Cr
3+). Water is added to the solution until an electrolyte solution with the desired concentration
of Cr(III) of at most at most 500 mM Cr
3+-ions is obtained, and finally sulphuric acid or sodium hydroxide or potassium hydroxide
can be added to the electrolyte solution to adjust the pH to the desired value to
obtain the final plating solution (see Figure 1 and the explanation thereof below).
[0014] The plating electrolyte is made free from sulphite ions by preparing the plating
electrolyte in accordance with the following steps:
- 1. dissolving basic chromium(III) sulphate or basic chromium(III) sulphate concentrate
in an initial amount of water to produce a concentrated solution;
- 2. adding sulphuric acid to the concentrated solution to make an acid concentrated
solution and remove sulphite from the solution according to:
- a.
SO32- + 2H+ ⇆ SO2↑ + H2O (2a)
- 3. allowing the SO2 to escape from the acid concentrated solution;
- 4. adding sodium hydroxide or potassium hydroxide to the acid concentrated solution;
- 5. adding formate-ions as complexing agent by adding a suitable amount of one or more
of
- i. formic acid
- ii. chromium(III) formate
- iii. sodium formate
- iv. potassium formate
to the concentrated solution to obtain the desired molar ratio;
- 6. adding water to the concentrated solution until a plating electrolyte with the
desired concentration of Cr(III) of at most at most 500 mM Cr3+-ions is obtained;
- 7. adding sulphuric acid or sodium hydroxide or potassium hydroxide to the plating
electrolyte to adjust the pH to the desired value.
[0015] Whether or not the final plating solution still contains sulphite can be detected
by means of cyclic voltammetry (CV). The addition of chromium(III) formate to the
solution is not believed to introduce sulphite into the solution, but even if it did,
then the sulphite would be removable in the same way as the sulphite introduced along
with the basic chromium(III) sulphate.
[0016] In a preferable embodiment the electrolyte solution contains at most 250 mM of Cr
3+-ions, more preferably the electrolyte solution contains at most 225 mM of Cr
3+-ions and/or at least 100 mM of Cr
3+-ions, preferably at least 125 mM of Cr
3+-ions. This preferred range provides good results in preventing a stripy appearance
of the deposited surface is usually associated with a certain inhomogeneity in the
electroplating process. The inventors found that by increasing the chromium(III) content
in comparison to the content in the state of the art (
WO2014202316 discloses a Cr
3+ electrolyte using 120 g/l (= 385 mM) basic chromium(III)sulphate), the appearance
of the coated strip worsened, and that the stripy appearance persisted. Surprisingly
and counter-intuitively the inventors found that decreasing the amount of metal ions
in the electrolyte resulted in a decrease in the stripy surface and that the surface
becomes even and shiny when the coating was deposited from an electrolyte according
to the method of the invention.
[0017] In an embodiment the pH of the electrolyte solution is at least 1.5, and/or at most
2.8, preferably at most 2.6 or 2.4, more preferably at most 2.2. Although the lower
pH results in a less efficient plating process, the surface quality is much improved
in that it shows no stripes.
[0018] In an embodiment the formate/Cr
3+ molar ratio is at most 2.5:1. The formate-ion is needed as a complexing agent and
the ratio of at most 2.5:1 has proven to be sufficient in most cases. More preferably
the molar ratio is at most 2.0:1, even more preferably 1.75:1. Preferably the molar
ratio is at least 1.1:1, more preferably 1.25:1.
[0019] In an embodiment the electrolyte solution contains at least 75 mM and/or at most
600 mM of sodium formate. When using only sodium formate as the addition of formate,
and no chromium(III) formate as the water soluble chromium salt, then at least 75
mM should be added, preferably at least 100 mM and even more preferably 200 mM. The
maximum is preferably at most 600 mM of sodium formate. If also chromium(III) formate
is added to the electrolyte solution as the water soluble chromium salt then the formate
added this way needs to be subtracted from the sodium formate additions as given herein
above. For example, if 50 mM of formate is added as chromium(III) formate, then the
values for sodium formate become at least 25 mM, preferably at least 50 mM and even
more preferably 150 mM. The maximum is preferably at most 550 mM of sodium formate.
[0020] In an embodiment the electrolyte solution contains at least 210 mM and/or at most
845 mM of sodium sulphate. In an embodiment only sodium hydroxide is used in the plating
electrolyte, and no potassium hydroxide. In an embodiment sodium formate and/or formic
acid and/or chromium(III) formate is used as a source of formate-ions in the plating
electrolyte, and no potassium formate is used. In these embodiments the amount of
potassium in the plating solution is minimised and the amount of sodium is maximised,
which is beneficial for the plating operation.
[0021] In a preferable embodiment the electrolyte solution is made free from sulphite ions
by disposing the final electrolyte solution in one, more or all of the plating cells
of the continuous high speed plating line and leading an electrically conductive substrate
acting as the cathode through the plating line wherein a current is applied to the
strip as cathode and entering the plating cell or cells and an insoluble anode which
current is insufficient to deposit a plating layer from the trivalent Cr-electrolyte,
but which is sufficient to reduce the sulphite ions to sulphide, and thereby removing
the sulphite-ions from the electrolyte solution, and wherein the sulphide escapes
from the electrolyte solution in the form of H
2S. Preferably the anode(s) comprise(s) a catalytic coating of iridium oxide or a mixed
metal oxide. In a preferred embodiment the mixed metal oxide comprises oxides of iridium
and tantalum.
[0022] This catalytic coating reduces or fully eliminates the oxidation of Cr
3+-ions to the undesired and potentially harmful Cr
6+-ions. The electrically conductive substrate can be cold-rolled steel substrates which
can be used once, or over and over again, e.g. stainless steel strips which are unaffected
by passing them through the process, or rejected coils which may be re-used or scrapped
afterwards. The removal of the sulphite in this process is a diffusion based process,
and is time-consuming. It may take several hours (even up to 10-15 hours) to drive
out all sulphite from a fresh plating electrolyte. This process is called dummy plating,
because a strip is processed through the plating line, but no deposit is made on the
strip. To achieve a metal deposit an increased current (current density) is required.
The only result of the dummy plating is that the sulphite is removed from the plating
electrolyte. By means of CV the plating electrolyte can be tested for the presence
of sulphite.
[0023] Once cleaned, the solution stays free from sulphite as long as no new sulphite is
introduced by adding new basic chromium(III) sulphate. When basic chromium (III)sulphate
is added to replenish the chromium plated from the solution, then the amount of sulphite
that is being introduced is relatively small and does not adversely affect the quality
of the plating layer to any significant degree. Moreover, any added sulphite as a
result of replenishment is removed from the solution during normal plating similar
to the dummy plating process but in this case while simultaneously depositing an acceptable
coating layer. Depositing an acceptable coating layer is not possible with a completely
fresh solution, because then the sulphite concentration is much higher.
[0024] In another embodiment of the invention a method is provided wherein the plating electrolyte
is made free from sulphite ions by
- disposing the plating electrolyte in one, more or all of the plating cells of the
continuous high speed plating line;
- leading the steel substrate acting as the cathode through the plating line wherein
a current is applied between an anode and the substrate entering the plating cell
or cells which current is insufficient to deposit a plating layer from the trivalent
Cr-electrolyte, but which is sufficient to reduce the sulphite ions to sulphide at
the cathode, and thereby removing the sulphite-ions from the electrolyte solution,
and wherein the sulphide escapes from the electrolyte solution in the form of H2S.
[0025] In still another embodiment a method is provided wherein the plating electrolyte
is disposed in a holding vessel or container (not being a plating cell of a continuous
high speed plating line) wherein a current is applied between a cathode and an anode
placed in the plating electrolyte which current is insufficient to deposit a plating
layer from the plating electrolyte onto the cathode, but which is sufficient to reduce
the sulphite ions to sulphide at the cathode, wherein the sulphide escapes from the
electrolyte solution in the form of H
2S, thereby removing the sulphite-ions from the plating electrolyte to produce a clean
plating electrolyte for use in the plating cells of a continuous high speed plating
line.
[0026] The method according to the invention can be identified as dummy plating, because
an electrically conductive substrate is led through the plating cells and electrolyte
solution under current, but without actual plating taking place. The only result of
the dummy plating is that the sulphite is removed from the plating solution. It is
possible to use a dummy steel strip for this process which can be used over and over
again, or a commercial strip that is led through the plating cell and electrolyte
more than once, the last time at a current sufficient to deposit a plating layer from
the trivalent Cr-electrolyte.
[0027] By performing the dummy plating in a container or holding vessel the plating line
can be used for plating, and no production time is consumed by first having to remove
the sulphite from the plating electrolyte. The sulphide-free electrolyte can be stored
in the container or holding vessel until it is needed to replenish the electrolyte
in the plating cell(s).
[0028] The invention is also embodied in a method of producing a chromium-chromium oxide
coating on a steel strip, wherein the coated steel strip is preferably used for the
production of cans or containers, lids or other packaging applications. The coated
steel strip is particularly suitable for further providing with a polymer coating
layer or polymer coating system comprising more than one polymer layer. The chromium-chromium
oxide coating may also contain chromium carbide, wherein the carbon from the carbide
is believed to originate from the formate ions. The coating may also comprise sulphate.
[0029] As long as the steel strip is suitable for packaging applications the invention is
not limited to the use of any specific composition of steel substrate.
[0030] Commercial strip is preferably selected from:
o cold-rolled full-hard blackplate, single or double reduced;
o cold-rolled and recrystallisation annealed blackplate;
o cold-rolled and recovery annealed blackplate,
o tinplate, as deposited or flow-melted;
o tinplate, diffusion annealed with an iron-tin alloy consisting of at least 80% of
FeSn (50 at.% iron and 50 at.% tin);
[0031] The invention is also embodied in a method wherein the coated steel substrate is
further coated on 1 or 2 sides by film lamination or direct extrusion, with an organic
coating consisting of a thermoplastic single layer or multi-layer polymer, preferably
wherein the thermoplastic polymer coating is a polymer coating system comprising one
or more layers comprising thermoplastic resins such as polyesters or polyolefins,
acrylic resins, polyamides, polyvinyl chloride, fluorocarbon resins, polycarbonates,
styrene type resins, ABS resins, chlorinated polyethers, ionomers, urethane resins
and functionalised polymers and/or copolymers thereof; and or blends thereof.
[0032] The invention is also embodied in a method wherein the coated blackplate wherein
the thermoplastic polymer coating on the one or both sides of the coated blackplate
is a multi-layer coating system, said coating system comprising at least an adhesion
layer for adhering to the coated blackplate, a surface layer and a bulk layer between
the adhesion layer and the surface layer, wherein the layers of the multi-layer coating
system comprise or consist of polyesters, such as polyethylene terephthalate, IPA-modified
polyethylene terephthalate, CHDM-modified polyethylene terephthalate, polybutylene
terephthalate, polyethylene naphthalate, or copolymers or blends thereof.
[0033] Figure 1 shows the sequence of events in accordance with claim 2.
[0034] In a CV-experiment, the working electrode potential is ramped linearly versus time
and the current response is measured (See Figure 2). 10 cycles were programmed between
the onset of the Oxygen Evolution Reaction (OER) on the anodic side (Upper Vertex
Potential) and the onset of the Hydrogen Evolution Reaction (HER) on the cathodic
side. A scan rate of 100 mV/s was chosen, revealing all typical features (peaks) within
a practical time for completing 10 cycles (ca. 6 min). In most cases, a few cycles
are required for arriving at a stationary condition. In all following figures, the
current density vs. potential of the last 5 cycles is plotted, which are nearly identical.
The working electrode was a Pt rotating disk electrode (∅ 5 mm) at a rotation rate
of 9 s
-1. The counter electrode is a fine meshed cylindrical gauze (∅ 30 mm). The reference
electrode is a saturated calomel electrode (SCE) or a saturated Ag/AgCI/KCI electrode.
The electrolyte temperature was 50 °C and the plating electrolyte had the following
basic composition:
Table 1: Electrolyte compositions.
electrolyte |
Na2SO4 mM |
HCOONa mM |
CrOHSO4 mM |
free formate mM |
pH* @ 25 °C |
reference electrolyte |
900 |
200 |
0 |
200 |
2.8 |
plating electrolyte |
900 |
600 |
400 |
200 |
2.8 |
*The pH was adjusted with sulphuric acid or sodium hydroxide if needed. |
[0035] The typical CV for the reference electrolyte is given in Figure 3. In particular
the occurrence of the so-called surface explosion in the reverse negative going sweep
is striking, where a combination of advantageous conditions for strong CO
2 formation exist, i.e.:
- A high overpotential for oxidation of formate;
- The availability of metallic Pt;
- The absence of CO poisoning.
[0036] The surface explosion is important for good plating behaviour and the absence of
the surface explosion means that bad plating behaviour and bad plating quality is
to be expected.
[0037] In Figure 4 the subsequent CV-results of plating electrolyte subjected to dummy plating
is presented. The fresh plating electrolyte was tested after 0 hours and then after
1, 3, 5, 6, 8 and 10 hours of dummy plating. Only a part of the CV curve is presented
here for clarity. Figure 4 shows the gradual occurrence of the surface explosion with
prolonged dummy plating time, and the stabilisation after 10 hours, indicative of
the absence of any further sulphite in the plating electrolyte. The fact that the
surface explosion re-occurs means that the presence of Cr
3+ has no effect on the surface explosion peak, and that sulphite is the cause of the
suppression of the surface explosion.
[0038] Figure 5 gives a clearer picture of the CV of the fresh plating electrolyte and the
electrolyte after 10 hours of dummy plating. This figure gives the entire CV-curve
of which only a part was presented in Figure 4.
[0039] Proof that the change in CV is the result of the removal of sulphite as a result
of the dummy plating is provided by the smell of H
2S during the dummy plating and the vanishing surface explosion upon addition of Na
2SO
3 to the "cleaned" plating electrolyte. When adding 500 mg/l of Na
2SO
3 the CV is back at the level of the fresh plating electrolyte, suggesting that the
fresh plating electrolyte contained about 500 mg/l of sulphite (see Figure 6, showing
the surface explosion peak when determining the CV of a cleaned plating electrolyte
(i.e. after 10 h of dummy plating), and after the addition of 50, 100, 500, 1000 and
2000 mg/l of Na
2SO
3 respectively. The addition of 500, 1000 or 2000 more or less generates the same curve
and the surface explosion peak is absent in all three cases. When adding 50 or 100
mg/l the height of the surface explosion peak decreases, proving that increasing sulphite
contamination of the electrolyte causes the absence of the surface explosion peak,
and therefore causes the bad plating performance in terms of chromium coating weight
and appearance of the chromium layer. The method according to the invention effectively
overcomes the sulphite contamination of the electrolyte.
[0040] It has become clear that by means of CV the presence of sulphite can be easily determined
and CV is therefore a useful tool in determining the readiness of the plating electrolyte
for starting the plating process.
1. Method of producing a plating electrolyte which is free from sulphite ions for electrodepositing
a chromium metal - chromium oxide coating layer on a steel substrate in a continuous
high speed plating line operating at a line speed of at least 60 m/min, wherein the
plating electrolyte is free of chloride ions, free of Cr
6+-ions and free of boric acid and contains:
- basic chromium(III) sulphate and optionally chromium(III) formate,
- as complexing agent: one or more of formic acid, sodium formate, potassium formate,
- one or more of sulphuric acid, sodium sulphate, potassium sulphate,
- optionally sulphuric acid or sodium hydroxide to adjust the pH of the electrolyte
to a value of between 1.0 and 3.0 measured at 25 °C,
and wherein the plating electrolyte contains at most 500 mM Cr
3+-ions, complexing agent at a

molar ratio of at least 1:1, 0 to 2800 mM of sulphate (SO
42-), wherein the sulphite is removed from the plating electrolyte by converting the
sulphite into sulphur dioxide (g) or into hydrogen sulphide (g).
2. Method according to claim 1 wherein the plating electrolyte is made free from sulphite
ions by preparing the plating electrolyte in accordance with the following steps:
• dissolving basic chromium(III) sulphate or basic chromium(III) sulphate concentrate
in an initial amount of water to produce a concentrated solution;
• adding sulphuric acid to the concentrated solution to make an acid concentrated
solution and remove sulphite from the solution according to:
SO32- + 2H+ ⇆ SO2↑ + H2O (2a)
• allowing the SO2 to escape from the acid concentrated solution;
• adding sodium hydroxide or potassium hydroxide to the acid concentrated solution;
• adding formate-ions as complexing agent by adding a suitable amount of one or more
of
i. formic acid
ii. chromium(III) formate
iii. sodium formate
iv. potassium formate
to the concentrated solution to obtain the desired molar ratio;
• adding water to the concentrated solution until a plating electrolyte with the desired
concentration of Cr(III) of at most at most 500 mM Cr3+-ions is obtained;
• adding sulphuric acid or sodium hydroxide or potassium hydroxide to the plating
electrolyte to adjust the pH to the desired value.
3. Method according to claim 1, wherein the plating electrolyte is made free from sulphite
ions by:
- disposing the plating electrolyte in one, more or all of the plating cells of the
continuous high speed plating line;
- leading the steel substrate acting as the cathode through the plating line wherein
a current is applied between an anode and the substrate entering the plating cell
or cells which current is insufficient to deposit a plating layer from the trivalent
Cr-electrolyte, but which is sufficient to reduce the sulphite ions to sulphide, and
thereby removing the sulphite-ions from the electrolyte solution, and wherein the
sulphide escapes from the electrolyte solution in the form of H2S
or by
- disposing the plating electrolyte is disposed in a container wherein a current is
applied between a cathode and an anode which current is insufficient to deposit a
plating layer from the plating electrolyte, but which is sufficient to reduce the
sulphite ions to sulphide, wherein the sulphide escapes from the electrolyte solution
in the form of H2S, thereby removing the sulphite-ions from the plating electrolyte to produce a clean
plating electrolyte for use in the plating cells of a continuous high speed plating
line.
4. Method according to any one of the preceding claims wherein the pH of the plating
electrolyte is at most 2.8, preferably at most 2.6, more preferably at most 2.2.
5. Method according to any one of the preceding claims wherein only sodium hydroxide
is used, and no potassium hydroxide.
6. Method according to any one of the preceding claims wherein only sodium formate and/or
formic acid and/or chromium(III) formate is used as a source of formate-ions, and
no potassium formate.
7. Method according to any one of the preceding claims wherein the formate/Cr3+ molar ratio is at most 2.5:1.
8. Method according to any one of the preceding claims wherein the plating electrolyte
contains at most 250 mM Cr3+-ions.
9. Method according to any one of the preceding claims wherein the plating electrolyte
contains at most 225 mM of Cr3+-ions, and/or at least 100 mM of Cr3+-ions, preferably at least 125 mM of Cr3+-ions.
10. Method according to any one of the preceding claims wherein the plating electrolyte
contains at least 75 mM and/or at most 600 mM of formate-ions.
11. Method according to any one of the preceding claims wherein the plating electrolyte
contains at least 210 mM and/or at most 845 mM of sulphate-ions.
12. Use of the electrolyte solution produced according to any one of claims 1 to 11 to
produce a steel substrate coated with a plating layer comprising chromium metal, chromium
carbide and chromium oxide and optionally also comprising chromium sulphate
13. Use according to claim 12 wherein the steel substrate is selected from:
- cold-rolled full-hard blackplate, single or double reduced;
- cold-rolled and recrystallisation annealed blackplate;
- cold-rolled and recovery annealed blackplate,
- tinplate, as deposited or flow-melted;
- tinplate, diffusion annealed with an iron-tin alloy consisting of at least 80% of
FeSn (50 at.% iron and 50 at.% tin);
14. Use according to claim 13 wherein the steel substrate is further coated on one or
both sides by a film lamination step or a direct extrusion step, with an organic coating
consisting of a thermoplastic single layer, or a thermoplastic multi-layer polymer,
preferably wherein the thermoplastic polymer coating is a polymer coating system comprising
one or more layers comprising thermoplastic resins such as polyesters or polyolefins,
acrylic resins, polyamides, polyvinyl chloride, fluorocarbon resins, polycarbonates,
styrene type resins, ABS resins, chlorinated polyethers, ionomers, urethane resins
and functionalised polymers; and/or copolymers thereof; and or blends thereof.