(19)
(11) EP 3 437 129 A1

(12)

(43) Date of publication:
06.02.2019 Bulletin 2019/06

(21) Application number: 16897295.8

(22) Date of filing: 30.03.2016
(51) International Patent Classification (IPC): 
H01L 23/48(2006.01)
H01L 23/485(2006.01)
H01L 23/498(2006.01)
H01L 23/488(2006.01)
(86) International application number:
PCT/US2016/024827
(87) International publication number:
WO 2017/171738 (05.10.2017 Gazette 2017/40)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(71) Applicant: INTEL Corporation
Santa Clara, CA 95054 (US)

(72) Inventors:
  • STARKSTON, Robert
    Phoenix, Arizona 85048 (US)
  • SANKMAN, Robert L.
    Phoenix, Arizona 85044 (US)
  • MOKLER, Scott M.
    Hillsboro, Oregon 97124 (US)
  • STAMEY, Richard Christopher
    Portland, Oregon 97229 (US)
  • ALUR, Amruthavalli Pallavi
    Tempe, Arizona 85284 (US)

(74) Representative: 2SPL Patentanwälte PartG mbB 
Postfach 15 17 23
80050 München
80050 München (DE)

   


(54) HYBRID MICROELECTRONIC SUBSTRATES