(19)
(11) EP 3 439 050 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
27.02.2019 Bulletin 2019/09

(43) Date of publication A2:
06.02.2019 Bulletin 2019/06

(21) Application number: 18185956.2

(22) Date of filing: 27.07.2018
(51) International Patent Classification (IPC): 
H01L 33/48(2010.01)
H01L 33/36(2010.01)
 H01L 33/62(2010.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 02.08.2017 KR 20170097970
24.08.2017 KR 20170107566

(71) Applicant: LG INNOTEK CO. LTD
Jung-gu Seoul 04637 (KR)

(72) Inventors:
  • LEE, Tae Sung
    04637 Seoul (KR)
  • KIM, Won Jung
    04637 Seoul (KR)
  • SONG, June O
    04637 Seoul (KR)
  • LIM, Chang Man
    04637 Seoul (KR)

(74) Representative: Zardi, Marco 
M. Zardi & Co. SA Via Pioda 6
6900 Lugano
6900 Lugano (CH)

   


(54) LIGHT EMITTING DEVICE PACKAGE


(57) A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.







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