(19)
(11) EP 3 440 704 A1

(12)

(43) Date of publication:
13.02.2019 Bulletin 2019/07

(21) Application number: 17779582.0

(22) Date of filing: 03.04.2017
(51) International Patent Classification (IPC): 
H01L 29/66(2006.01)
H01L 21/336(2006.01)
H01L 27/088(2006.01)
(86) International application number:
PCT/US2017/025685
(87) International publication number:
WO 2017/176612 (12.10.2017 Gazette 2017/41)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 08.04.2016 US 201615094985

(71) Applicant: Cambridge Electronics, Inc.
Cambridge, MA 02142 (US)

(72) Inventors:
  • XIA, Ling
    Belmont MA 02478 (US)
  • AZIZE, Mohamed
    Medford MA 02155 (US)
  • LU, Bin
    Watertown MA 02472 (US)

(74) Representative: FRKelly 
27 Clyde Road
Dublin D04 F838
Dublin D04 F838 (IE)

   


(54) SEMICONDUCTOR STRUCTURE AND ETCH TECHNIQUE FOR MONOLITHIC INTEGRATION OF III-N TRANSISTORS