SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES - Patent 3440906

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EP 3 440 906 A1

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(43)	Date of publication:
	13.02.2019 Bulletin 2019/07

(21)	Application number: 17779549.9

(22)	Date of filing: 29.03.2017

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International Patent Classification (IPC):

H05K 9/00^(2006.01)

H05K 7/20^(2006.01)

(86)	International application number:
	PCT/US2017/024682

(87)	International publication number:
	WO 2017/176521 (12.10.2017 Gazette 2017/41)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	MA MD

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Priority:

04.04.2016 US 201662317929 P

(71)	Applicant: Commscope Technologies LLC
	Hickory, NC 28602 (US)

(72)	Inventor:
	CRAIG, Kevin Hickory North Carolina 28602 (US)

(74)	Representative: Popp, Eugen
	Meissner Bolte Patentanwälte Rechtsanwälte Partnerschaft mbB Postfach 86 06 24 81633 München 81633 München (DE)

(54)	SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES