(19)
(11) EP 3 443 760 A1

(12)

(43) Date of publication:
20.02.2019 Bulletin 2019/08

(21) Application number: 17783125.2

(22) Date of filing: 13.04.2017
(51) International Patent Classification (IPC): 
H04R 19/04(2006.01)
H04R 19/00(2006.01)
B81B 7/00(2006.01)
H04R 1/06(2006.01)
(86) International application number:
PCT/US2017/027397
(87) International publication number:
WO 2017/180858 (19.10.2017 Gazette 2017/42)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 14.04.2016 US 201615099096

(71) Applicants:
  • Robert Bosch GmbH
    70442 Stuttgart (DE)
  • Akustica Inc.
    Pittsburgh, PA 15203 (US)

(72) Inventor:
  • SAXENA, Kuldeep
    Sewickley, PA 15143 (US)

(74) Representative: Isarpatent 
Patent- und Rechtsanwälte Behnisch Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31
80801 München
80801 München (DE)

   


(54) MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE