(19)
(11) EP 3 449 023 A1

(12)

(43) Date of publication:
06.03.2019 Bulletin 2019/10

(21) Application number: 17793110.2

(22) Date of filing: 02.05.2017
(51) International Patent Classification (IPC): 
C22C 13/00(2006.01)
C22C 30/02(2006.01)
C22C 30/06(2006.01)
C22C 13/02(2006.01)
C22C 30/04(2006.01)
(86) International application number:
PCT/US2017/030547
(87) International publication number:
WO 2017/192517 (09.11.2017 Gazette 2017/45)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 06.05.2016 IN 201611015846

(71) Applicant: Alpha Assembly Solutions Inc.
Waterbury CT 06702 (US)

(72) Inventors:
  • RIBAS, Morgana, De Avila
    Shettyhalli Bangalore 560015 (IN)
  • TELU, Suresh
    Ramamurthy Nagar Bangalore 560016 (IN)
  • CHOUDHURY, Pritha
    Bangalore 560094 (IN)
  • K.N., Anilkumar
    Doddaballapur Bangalore 561203 (IN)
  • SARKAR, Siuli
    Kaval Byrasandra Bangalore 560032 (IN)

(74) Representative: Jenkins, Peter David 
Page White & Farrer Bedford House John Street
London WC1N 2BF
London WC1N 2BF (GB)

   


(54) HIGH RELIABILITY LEAD-FREE SOLDER ALLOY