III-V CHIP PREPARATION AND INTEGRATION IN SILICON PHOTONICS - Patent 3455911

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EP 3 455 911 A1

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(43)	Date of publication:
	20.03.2019 Bulletin 2019/12

(21)	Application number: 17796852.6

(22)	Date of filing: 11.05.2017

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International Patent Classification (IPC):

H01S 5/02^(2006.01)

(86)	International application number:
	PCT/US2017/032189

(87)	International publication number:
	WO 2017/197132 (16.11.2017 Gazette 2017/46)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	MA MD

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Priority:

11.05.2016 US 201662334895 P

(71)	Applicant: Skorpios Technologies, Inc.
	Albuquerque, NM 87109 (US)

(72)	Inventor:
	LAMBERT, Damien Albuequerque, New Mexico 87109 (US)

(74)	Representative: Diehl & Partner GbR
	Patentanwälte Erika-Mann-Strasse 9 80636 München 80636 München (DE)

(54)	III-V CHIP PREPARATION AND INTEGRATION IN SILICON PHOTONICS