(19)
(11) EP 3 456 143 A1

(12)

(43) Date of publication:
20.03.2019 Bulletin 2019/12

(21) Application number: 17703272.9

(22) Date of filing: 17.01.2017
(51) International Patent Classification (IPC): 
H04W 76/02(2009.01)
H04W 88/06(2009.01)
(86) International application number:
PCT/US2017/013789
(87) International publication number:
WO 2017/196412 (16.11.2017 Gazette 2017/46)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 13.05.2016 US 201662336391 P

(71) Applicant: Intel IP Corporation
Santa Clara, CA 95054 (US)

(72) Inventors:
  • PALAT, Sudeep
    Cheltenham Gloucestershire GL51 0GG (GB)
  • ZHANG, Yujian
    Beijing 100081 (CN)
  • BURBIDGE, Richard
    Shrivenham Oxfordshire SN6 8HR (GB)
  • YIU, Candy
    Portland, Oregon 97201 (US)
  • HEO, Young Hyoung
    Seoul 150-705 (KR)
  • PHUYAL, Umesh
    Beaverton, Oregon 97006 (US)

(74) Representative: HGF Limited 
1 City Walk
Leeds LS11 9DX
Leeds LS11 9DX (GB)

   


(54) RRC SIGNALING FOR DUAL CONNECTIVITY