(19)
(11) EP 3 456 851 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.04.2019 Bulletin 2019/16

(43) Date of publication A2:
20.03.2019 Bulletin 2019/12

(21) Application number: 18180043.4

(22) Date of filing: 27.06.2018
(51) International Patent Classification (IPC): 
C22C 23/00(2006.01)
C22C 23/04(2006.01)
 C22C 23/02(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 15.09.2017 US 201762558876 P
29.09.2017 KR 20170128223

(71) Applicant: LG Electronics Inc.
Yeongdeungpo-gu Seoul 07336 (KR)

(72) Inventors:
  • Chang Sung, Myeon
    06772 Seoul (KR)
  • Kim, Joongnyon
    06772 Seoul (KR)
  • Park, Sunghyun
    06772 Seoul (KR)
  • Bazhenov, Vyacheslav E.
    119049 Moskva (RU)
  • Koltygin, Andrey V.
    119049 Moskva (RU)

(74) Representative: Vossius & Partner Patentanwälte Rechtsanwälte mbB 
Siebertstrasse 3
81675 München
81675 München (DE)

   


(54) HIGH THERMAL CONDUCTIVE MAGNESIUM ALLOY AND HEAT SINK USING THE SAME


(57) A magnesium (Mg) alloy having lightweight and excellent thermal conductivity, and a heat sink including the magnesium (Mg) alloy are provided. The magnesium (Mg) alloy may include one or more alloy additive elements selected from the group consisting of silicon (Si), calcium (Ca), tin (Sn), yttrium (Y), iron (Fe), nickel (Ni), copper (Cu), cerium (Ce), cesium (Cs), antimony (Sb), cobalt (Co), thorium (Th), and silver (Ag). Some of the alloy additive elements may be dissolved in the magnesium alloy to form a solid solution. The alloy additive elements that form the solid solution at room temperature may account for 2 wt% or less, based on the total weight (100 wt%) of the magnesium alloy, and the alloy additive elements that do not form the solid solution may be in crystalline phases.







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