| (19) |
 |
|
(11) |
EP 3 460 082 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
15.05.2019 Bulletin 2019/20 |
| (43) |
Date of publication A2: |
|
27.03.2019 Bulletin 2019/13 |
| (22) |
Date of filing: 21.09.2018 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL
NO PL PT RO RS SE SI SK SM TR |
|
Designated Extension States: |
|
BA ME |
|
Designated Validation States: |
|
KH MA MD TN |
| (30) |
Priority: |
22.09.2017 JP 2017182751
|
| (71) |
Applicant: JX Nippon Mining & Metals Corporation |
|
Tokyo 100-8164 (JP) |
|
| (72) |
Inventor: |
|
- HORIE, Hiroyasu
Hitachi-shi, Ibaraki 317-0056 (JP)
|
| (74) |
Representative: Mewburn Ellis LLP |
|
City Tower
40 Basinghall Street
London EC2V 5DE
London EC2V 5DE (GB) |
|
| |
|
| (54) |
TITANIUM COPPER FOR ELECTRONIC COMPONENTS |
(57) The present invention is intended to improve bending workability of titanium copper
for electronic components, and to provide a titanium copper for electronic components,
which has excellent bending workability even when subjected to beating process, and
to provide a method for manufacturing the same. One embodiment of the present invention
is a titanium copper, comprising 2.0 to 4.5 mass% of Ti, and at least one element
selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn,
Mg, and Si in total of 0 to 0.5 mass% as a third element(s), and the rest consisting
of copper and inevitable impurities, wherein a work-hardening exponent is 0.05 to
0.25, and an X-ray diffraction integrated intensity I {200} from the {200} crystal
face on the surface of the titanium copper and an X-ray diffraction integrated intensity
I
0 {200} of a pure copper standard powder satisfy the following relation: 0.15 ≦ I {200}
/ I
0 {200} ≦ 0.70.