TECHNICAL FIELD
[0001] The present invention relates to a high-frequency heating device equipped with a
surface wave excitation body having a periodical structure.
BACKGROUND ART
[0002] Such a conventional technique is disclosed that relates to a high-frequency heating
device configured to supply high-frequency power to a surface wave excitation body
having a periodical structure to heat a heating-target object, such as a food product
(e.g., see PTL 1).
[0003] A high-frequency heating device disclosed in PTL 1 includes a variable impedance
unit configured to change, in a temporal manner, impedance of a termination of an
interdigital tape wave guide (surface wave guide). The variable impedance unit changes
standing wave distribution in a temporal manner to move a portion configured to radiate
strong energy. A whole food product is therefore efficiently heated.
[0004] In other words, the high-frequency heating device described above changes impedance
of the termination of the interdigital tape wave guide (surface wave guide) to change
standing wave distribution in the interdigital tape wave guide (surface wave guide)
to change the impedance of the termination in a temporal manner. With changes in standing
wave distribution in a temporal manner, a whole food product is therefore heated.
[0005] However, the conventional high-frequency heating device cannot change radiation distribution
of high-frequency power in a thickness direction of the heating-target object.
Citation List
Patent Literature
[0006] PTL 1: Unexamined Japanese Patent Publication No.
61-240589
SUMMARY OF THE INVENTION
[0007] The present invention provides a high-frequency heating device capable of changing
radiation distribution of high-frequency power to a heating-target object to change
a heating state of a heating-target part.
[0008] In other words, the high-frequency heating device according to the present invention
includes a high-frequency power generation unit configured to generate high-frequency
power, a surface wave excitation body configured to propagate the high-frequency power
with a surface wave to heat a heating-target object, a high-frequency power supply
unit configured to supply the high-frequency power to the surface wave excitation
body, and a mounting stand on which the heating-target object is mounted. In accordance
with a desired degree of surface concentration of the high-frequency power around
the surface wave excitation body, the high-frequency power generation unit sets a
magnitude relationship between a frequency of the high-frequency power to be supplied
to the surface wave excitation body and an exciting frequency of the surface wave
excitation body to heat the heating-target object.
[0009] With this configuration, in accordance with a desired heating state in a thickness
direction of the heating-target object, the magnitude relationship between the frequency
of the high-frequency power to be supplied to the surface wave excitation body and
the exciting frequency of the surface wave excitation body is set. In the thickness
direction of the heating-target object, the heating-target object can therefore be
heated in the desired heating state.
BRIEF DESCRIPTION OF DRAWINGS
[0010]
FIG. 1 is a block diagram illustrating a basic configuration of a high-frequency heating
device according to an exemplary embodiment.
FIG. 2 is a block diagram illustrating a configuration of a high-frequency power supply
unit of the high-frequency heating device according to the present exemplary embodiment.
FIG. 3A is a view illustrating an example of how a heating-target object is heated
when a degree of surface concentration of an electric field is higher due to a surface
wave excitation body of the high-frequency heating device according to the present
exemplary embodiment.
FIG. 3B is a view illustrating an example of how the heating-target object is heated
when the degree of surface concentration of the electric field is lower due to the
surface wave excitation body of the high-frequency heating device according to the
present exemplary embodiment.
FIG. 4A is a graph illustrating an example of a change in the degree of surface concentration
of the electric field relative to a distance from the surface wave excitation body
when a frequency of high-frequency power is equal to an exciting frequency of the
surface wave excitation body in the high-frequency heating device according to the
present exemplary embodiment.
FIG. 4B is a graph illustrating an example of a change in the degree of surface concentration
of the electric field relative to the distance from the surface wave excitation body
when the frequency of the high-frequency power is lower than the exciting frequency
of the surface wave excitation body in the high-frequency heating device according
to the present exemplary embodiment.
FIG. 4C is a graph illustrating an example of a change in the degree of surface concentration
of the electric field relative to the distance from the surface wave excitation body
when the frequency of the high-frequency power is higher than the exciting frequency
of the surface wave excitation body in the high-frequency heating device according
to the present exemplary embodiment.
DESCRIPTION OF EMBODIMENT
[0011] An exemplary embodiment of the present invention will now be described herein with
reference to the accompanying drawings. Note that the present invention is not limited
to this exemplary embodiment.
(Exemplary embodiment)
[0012] High-frequency heating device 100 according to the present exemplary embodiment will
now be described herein with reference to FIG. 1.
[0013] FIG. 1 is a block diagram illustrating a basic configuration of high-frequency heating
device 100 according to the present exemplary embodiment.
[0014] As illustrated in FIG. 1, high-frequency heating device 100 includes surface wave
excitation body 103, high-frequency power supply unit 110, high-frequency power generation
unit 120, and mounting stand 101 used to mount heating-target object 102. High-frequency
heating device 100 heats heating-target object 102 mounted on mounting stand 101.
[0015] At this time, in high-frequency heating device 100, a frequency of high-frequency
power to be generated by high-frequency power generation unit 120 and an exciting
frequency of surface wave excitation body 103 are set to have a predetermined frequency
relationship. The predetermined frequency relationship is set to heat heating-target
object 102 in a desired heating state.
[0016] In high-frequency heating device 100 illustrated in FIG. 1, although such an example
of a configuration is illustrated that includes a single surface wave excitation body,
a single high-frequency power supply unit, and a single high-frequency power generation
unit, the present invention is not limited to the example. A number of surface wave
excitation bodies, a number of high-frequency power supply units, and a number of
high-frequency power generation units are not limited to the numbers described above.
[0017] High-frequency heating device 100 operates as described below.
[0018] High-frequency power generation unit 120 first generates high-frequency power. The
generated high-frequency power is supplied, via high-frequency power supply unit 110,
to surface wave excitation body 103. The supplied high-frequency power is propagated
or radiated with a surface wave around surface wave excitation body 103. Heating-target
object 102 mounted on mounting stand 101 is therefore heated.
[0019] High-frequency heating device 100 according to the present exemplary embodiment is
configured, and operates as described above.
[0020] High-frequency power generation unit 120 described above includes a high-frequency
transmitter configured to output high-frequency power at a frequency (e.g., microwave)
and a magnitude appropriate for heating heating-target object 102.
[0021] Specifically, the high-frequency transmitter includes a magnetron, an inverter power
supply circuit, a solid oscillator, and a power amplifier, for example.
[0022] The magnetron is a kind of oscillation vacuum tube configured to generate a kind
of radio wave, i.e., strong, non-coherent microwaves, and is used for purposes with
a higher output ranging from several hundred watts to several kilowatts, such as a
radar and a microwave oven. To drive the magnetron, a higher voltage of several kilovolts
is required. As an ordinary power supply for driving the magnetron, the inverter power
supply circuit is therefore used. The inverter power supply circuit includes a converter
circuit having a rectification function and an inverter circuit having a voltage raising
(or lowering) function and an output frequency conversion function. The inverter power
supply circuit is a technique widely used in lighting apparatuses and used for motor
controlling.
[0023] On the other hand, the solid oscillator includes a semiconductor oscillation circuit
equipped with a feedback circuit including high-frequency electronic components, such
as transistors, capacitors, inductors, and resistors. The solid oscillator is a technique
widely used in oscillators for purposes with a low-power output, such as communication
devices.
[0024] Solid oscillators include oscillators having a high-frequency power output of approximately
50 watts, which are used in recent years, as well as include ordinary oscillators
having a high-frequency power output ranging from several ten milliwatts to several
hundred milliwatts. Such solid oscillators are not therefore appropriate for heating
requiring a power output of several hundred watts. The solid oscillator is often used
together with a power amplifier including, for example, transistors configured to
amplify high-frequency power being output.
[0025] High-frequency power supply unit 110 corresponds to a power coupling unit configured
to supply high-frequency power generated by high-frequency power generation unit 120
to surface wave excitation body 103. A configuration of high-frequency power supply
unit 110 will be described later.
[0026] Surface wave excitation body 103 includes a metallic periodical structure with impedance
elements made of metallic plates arranged periodically, and dielectric plates, for
example. For the metallic periodical structure, a stub type surface wave excitation
body or an interdigital type surface wave excitation body is used, for example. The
stub type surface wave excitation body is formed by disposing, on a metallic flat
plate, as illustrated in FIG. 1, a plurality of metallic flat plates at constant intervals
in a vertical direction toward a heating-target object. The interdigital type surface
wave excitation body is formed by punching a metallic flat plate in an interdigital
shape. The dielectric plate may be an alumina plate or a Bakelite plate.
[0027] At this time, an exciting frequency of surface wave excitation body 103 is determined
based on a material used, a physical structural size, and other factors. For example,
when the stub type surface wave excitation body is used, by changing heights of a
plurality of metallic flat plates arranged on the metallic flat plate, or by changing
the intervals of the metallic flat plates, the exciting frequency of surface wave
excitation body 103 can be changed. In general, the exciting frequency of surface
wave excitation body 103 increases when the heights of the metallic flat plates are
lowered, or when the intervals of the metallic flat plates are narrowed. By adjusting
the heights or the intervals of the metallic flat plates, surface wave excitation
body 103 having a desired exciting frequency can therefore be formed.
[0028] Surface wave excitation body 103 allows high-frequency power supplied from high-frequency
power generation unit 120 via high-frequency power supply unit 110 to concentrate
around its surface, and propagates the high-frequency power with a surface wave. Further,
surface wave excitation body 103 can radiate the high-frequency power to a space in
high-frequency heating device 100, for example. Heating-target object 102 mounted
on mounting stand 101 adjacent to surface wave excitation body 103 is therefore heated
by the high-frequency power propagated, with a surface wave, from around the surface
of surface wave excitation body 103, or the high-frequency power radiated from surface
wave excitation body 103.
[0029] Next, the configuration of high-frequency power supply unit 110 according to the
present exemplary embodiment will now be described herein with reference to FIG. 2.
[0030] FIG. 2 is a block diagram illustrating an example of the configuration of high-frequency
power supply unit 110.
[0031] As illustrated in FIG. 2, high-frequency power supply unit 110 is disposed to introduce
high-frequency power to be generated by high-frequency power generation unit 120,
via rectangular wave guide 130, to high-frequency power supply unit 110.
[0032] Rectangular wave guide 130 is a hollow wave guide mainly used to transmit electromagnetic
waves, such as microwaves. The hollow wave guide is an ordinary wave guide made from
a metallic tube having a rectangular cross section (e.g., rectangle). An electromagnetic
wave forms an electromagnetic field in accordance with a shape, a size, a wavelength,
or a frequency of rectangular wave guide 130, and propagates inside rectangular wave
guide 130.
[0033] The high-frequency power propagated from high-frequency power generation unit 120
is supplied, via rectangular wave guide 130 and tapered rectangular wave guide 131,
to surface wave excitation body 103. Tapered rectangular wave guide 131 is configured
to suppress reflection of a microwave being propagated at a joint to reduce a loss.
[0034] In other words, as illustrated by a broken line in FIG. 2, high-frequency power supply
unit 110 includes a part of rectangular wave guide 130, tapered rectangular wave guide
131, and a part of surface wave excitation body 103.
[0035] High-frequency power generated by the high-frequency power generation unit 120 is
therefore introduced, via rectangular wave guide 130, to high-frequency power supply
unit 110, and then efficiently supplied, via tapered rectangular wave guide 131, to
surface wave excitation body 103.
[0036] At this time, high-frequency heating device 100 according to the present exemplary
embodiment sets, as desired, a predetermined frequency relationship between the frequency
of the high-frequency power to be generated by high-frequency power generation unit
120 and the exciting frequency of surface wave excitation body 103. As will be described
later, heating-target object 102 is therefore heated in a desired heating state.
[0037] High-frequency heating device 100 according to the present exemplary embodiment is
configured as described above to heat heating-target object 102, for example.
[0038] Next, how high-frequency heating device 100 described above heats heating-target
object 102 will be described with reference to FIGS. 3A and 3B.
[0039] FIGS. 3A and 3B schematically illustrate, when heating-target object 102 is mounted
on mounting stand 101, how heating-target object 102 is heated under field intensity
distribution of high-frequency power supplied around the surface of surface wave excitation
body 103.
[0040] In other words, FIG. 3A illustrates field intensity distribution 141 formed around
the surface of surface wave excitation body 103 when a frequency of high-frequency
power generated by high-frequency power generation unit 120 and an exciting frequency
of surface wave excitation body 103 are set to increase a degree of surface concentration
of the high-frequency power.
[0041] FIG. 3B illustrates field intensity distribution 142 formed around the surface of
surface wave excitation body 103 when the frequency of high-frequency power and the
exciting frequency are set to lower the degree of surface concentration of the high-frequency
power.
[0042] In FIGS. 3A and 3B, intensity of electric fields in field intensity distributions
141 and 142 is represented with shading of a color. In this case, the darker the color,
the stronger the electric field.
[0043] In FIG. 3A, the relationship between the frequency of high-frequency power and the
exciting frequency of surface wave excitation body 103 is set to increase a degree
of surface concentration of the high-frequency power around surface wave excitation
body 103. Intensity of an electric field around the surface of surface wave excitation
body 103 therefore becomes stronger. A surface and an internal portion, adjacent to
surface wave excitation body 103, of heating-target object 102 are therefore locally
and strongly heated. The larger a distance from surface wave excitation body 103,
the weaker the field intensity. A degree of heating in heating-target object 102 therefore
lowers.
[0044] On the other hand, in FIG. 3B, the relationship between the frequency of high-frequency
power and the exciting frequency of surface wave excitation body 103 is set to lower
the degree of surface concentration of the high-frequency power around surface wave
excitation body 103. In this case, although the field intensity weakens around the
surface of surface wave excitation body 103, a degree of lowering in field intensity
is smaller even in an area away from surface wave excitation body 103. The surface,
adjacent to surface wave excitation body 103, of heating-target object 102 would therefore
be less likely to be locally and strongly heated. In other words, whole heating-target
object 102 is relatively evenly heated.
[0045] As described above, high-frequency heating device 100 heats heating-target object
102 based on the relationship between the frequency of high-frequency power and the
exciting frequency of surface wave excitation body 103.
[0046] A relationship between a distance from the surface of surface wave excitation body
103 and field intensity will now be described herein based on the magnitude relationship
between the frequency of high-frequency power and the exciting frequency of surface
wave excitation body 103, as described above, with reference to FIGS. 3A and 3B and
using FIGS. 4A to 4C.
[0047] FIGS. 4A to 4C schematically illustrate examples of changes in a degree of surface
concentration of high-frequency power (electric field) formed around the surface of
surface wave excitation body 103, based on the relationship between frequency fp of
high-frequency power to be supplied to surface wave excitation body 103 and exciting
frequency fc of surface wave excitation body 103.
[0048] Specifically, FIGS. 4A to 4C illustrate, in graphs, changes in field intensity relative
to the distance from the surface of surface wave excitation body 103, based on the
relationship between frequency fp of high-frequency power to be supplied to surface
wave excitation body 103 and exciting frequency fc of surface wave excitation body
103. At this time, horizontal axes in FIGS. 4A to 4C illustrate a distance from the
surface of the surface wave excitation body, while vertical axes illustrate field
intensity. In the drawings, the greater the inclination of the graph, the more the
concentration of an electric field formed on the surface of surface wave excitation
body 103.
[0049] In FIG. 4A, graph 151 illustrates a degree of field intensity relative to a distance
from the surface of surface wave excitation body 103 when frequency fp of high-frequency
power to be supplied to surface wave excitation body 103 is approximately equal to
exciting frequency fc of surface wave excitation body 103, and, in FIG. 4B, graph
152 illustrates a degree of field intensity when frequency fp of high-frequency power
is lower than exciting frequency fc. Further, in FIG. 4C, graph 153 illustrates a
degree of field intensity when frequency fp of high-frequency power is higher than
exciting frequency fc.
[0050] First, as illustrated in FIG. 4A, when frequency fp of high-frequency power and exciting
frequency fc are set approximately identical to each other, graph 151 illustrating
the degree of field intensity relative to the distance from the surface of surface
wave excitation body 103 has a greatest inclination. In other words, an electric field
concentrates around the surface of surface wave excitation body 103, as approximate
to FIG. 3A. The surface of heating-target object 102 is therefore locally heated.
The relationship between frequency fp and exciting frequency fc, described above,
is therefore appropriate for intentionally burning the surface of heating-target object
102.
[0051] As illustrated in FIG. 4B, when frequency fp of high-frequency power is set lower
than exciting frequency fc, graph 152 has a gentle inclination, compared with the
inclination of graph 151 in FIG. 4A. In other words, a degree of concentration of
an electric field on the surface of surface wave excitation body 103 lowers, and the
high-frequency power reaches farther from the surface of surface wave excitation body
103. Although the field intensity around the surface of surface wave excitation body
103 is therefore relatively greater, the field intensity does not suddenly drop even
at a position away from the surface of surface wave excitation body 103. In other
words, the high-frequency power reaches to a position slightly away from the surface
of surface wave excitation body 103. The relationship between frequency fp and exciting
frequency fc, described above, is therefore appropriate for heating heating-target
object 102 without allowing heating-target object 102 to get burned.
[0052] As illustrated in FIG. 4C, when frequency fp of high-frequency power is set higher
than exciting frequency fc, graph 153 has almost no inclination, achieving flat field
intensity distribution. In other words, an electric field does not concentrate around
the surface of surface wave excitation body 103, but is widely distributed in a whole
area. This means that the high-frequency power to be supplied to surface wave excitation
body 103 is not propagated with a surface wave to surface wave excitation body 103,
but is radiated into a space. The relationship between frequency fp and exciting frequency
fc, described above, is therefore appropriate for relatively evenly heating whole
heating-target object 102.
[0053] As described above, in accordance with a degree, corresponding to a heating state
desired by a user, of surface concentration of high-frequency power around the surface
of surface wave excitation body 103, high-frequency heating device 100 according to
the present exemplary embodiment sets the magnitude relationship between frequency
fp of high-frequency power to be supplied to surface wave excitation body 103 and
exciting frequency fc of surface wave excitation body 103. How high-frequency power
is propagated with a surface wave to surface wave excitation body 103 can therefore
be changed. Accordingly, field intensity distribution around the surface of surface
wave excitation body 103 changes. As a result, heating-target object 102 can be heated
in a heating state desired by a user.
[0054] In other words, the relationship between frequency fp and exciting frequency fc is
set to allow frequency fp of high-frequency power to be supplied to surface wave excitation
body 103 to be equal to or lower than exciting frequency fc of surface wave excitation
body 103. In this case, the high-frequency power supplied to surface wave excitation
body 103 is propagated with a surface wave to surface wave excitation body 103. That
is, the high-frequency power is propagated under an operation in a "surface wave mode".
At this time, by adjusting how frequency fp of high-frequency power is lowered relative
to exciting frequency fc of surface wave excitation body 103 (by adjusting a difference),
a degree of surface concentration of high-frequency power to be propagated with a
surface wave to surface wave excitation body 103 can be adjusted. Therefore, in accordance
with a heating state desired by a user in the thickness direction of a heating-target
object, heating-target object 102 can be appropriately heated.
[0055] On the other hand, the relationship between frequency fp and exciting frequency fc
is set to allow frequency fp of high-frequency power to be supplied to surface wave
excitation body 103 to be higher than exciting frequency fc of surface wave excitation
body 103. In this case, the high-frequency power supplied to surface wave excitation
body 103 is not propagated with a surface wave to surface wave excitation body 103,
but is radiated into a space. That is, the high-frequency power is radiated under
an operation in a "radiation mode". Whole heating-target object 102 can therefore
be relatively evenly heated.
[0056] In the exemplary embodiment described above, although the example of the configuration
is described to allow high-frequency power generation unit 120 of high-frequency heating
device 100 to generate high-frequency power at frequency fp being fixed, the present
invention is not limited to the example. For example, high-frequency power generation
unit 120 may include a variable frequency high-frequency transmitter configured to
generate high-frequency power at a frequency to be set.
[0057] The variable frequency high-frequency oscillator can be achieved by using a variable
voltage element (e.g., varactor diode) as an element determining a resonance frequency
of a resonant circuit configuring the semiconductor oscillation circuit described
above. The variable frequency high-frequency oscillator is generally referred to as
a voltage controlled oscillator (VCO). Since a technique of a VCO is already known,
its detailed description is omitted. In this case, a controller is provided to the
high-frequency oscillator to supply voltage information corresponding to a frequency
to the VCO. A frequency of the high-frequency oscillator can therefore be changed.
[0058] The variable frequency high-frequency oscillator may be a phase locked loop (PLL)
oscillator including a reference signal generator and a phase comparator. Since a
technique of the PLL oscillator is already known, its detailed description is omitted.
In this case, a controller is provided to the PLL oscillator to supply an information
signal corresponding to a frequency to the phase comparator. A frequency of the PLL
oscillator can therefore be changed.
[0059] With the single high-frequency power generation unit, high-frequency power at a plurality
of frequencies can therefore be generated. The magnitude relationship between frequency
fp of high-frequency power to be supplied to surface wave excitation body 103 and
exciting frequency fc of surface wave excitation body 103, described above, can therefore
be easily and freely set. That is, the magnitude relationship between frequency fp
of high-frequency power to be supplied to surface wave excitation body 103 and exciting
frequency fc of surface wave excitation body 103 can be freely changed. Therefore,
with a simple configuration, a heating state in the thickness direction of heating-target
object 102 can be changed as desired by a user to heat heating-target object 102.
[0060] In high-frequency heating device 100 according to the present exemplary embodiment,
surface wave excitation body 103 may be a variable exciting frequency surface wave
excitation body configured to change an exciting frequency.
[0061] Specifically, when the surface wave excitation body is formed with the stub type
surface wave excitation body described above, dielectric bodies are inserted under
a mechanical control into gaps between the metallic flat plates arranged at constant
intervals on the metallic flat plate. The exciting frequency of the surface wave excitation
body can therefore be changed.
[0062] In this case, a dielectric constant of the dielectric body may be changed under electrical
control, instead of the mechanical control, to change the exciting frequency of the
surface wave excitation body. The exciting frequency of the surface wave excitation
body can therefore be relatively greatly changed. The heating state in the thickness
direction of the heating-target object can therefore be greatly changed. A range of
the heating state can therefore be expanded as desired by a user to variously heat
the heating-target object.
[0063] Although, in the exemplary embodiment described above, purposes of the high-frequency
heating device have not been specifically described, a basic configuration similar
to an ordinary cooking microwave oven may be applied, for example.
[0064] That is, the microwave oven at least includes a heating chamber, a high-frequency
power generation unit, a wave guide, a surface wave excitation body configuring a
heating unit, a door, and a door choking groove, for example. The heating chamber
is formed into an approximately rectangular parallelepiped shape (including a rectangular
parallelepiped shape), and is to be internally mounted with a heating-target object.
The high-frequency power generation unit includes a magnetron, for example, to supply
high-frequency power to the heating chamber. The high-frequency power generation unit
is provided below the housing or beside the housing. The wave guide supplies microwaves
generated by the high-frequency power generation unit to the heating chamber. The
surface wave excitation body is provided below, behind, or above the heating chamber
to propagate high-frequency power to heat a heating-target object. The door is provided
on a front of the housing for opening and closing of the heating chamber. The door
choking groove is provided around the door to prevent electromagnetic waves, such
as microwaves, from leaking.
[0065] Although the high-frequency heating device according to the present invention has
been described based on the exemplary embodiment, the present invention is not limited
to the exemplary embodiment. Without departing from the gist of the present invention,
any modifications conceivable by those skilled in the art to the exemplary embodiment,
as well as any forms configured by combining components in different exemplary embodiments
are also included within the scope of the present invention.
[0066] As described above, the high-frequency heating device according to the present invention
includes the high-frequency power generation unit configured to generate high-frequency
power, the surface wave excitation body configured to propagate the high-frequency
power with a surface wave to heat a heating-target object, the high-frequency power
supply unit configured to supply the high-frequency power to the surface wave excitation
body, and the mounting stand on which the heating-target object is mounted. In accordance
with a desired degree of surface concentration of the high-frequency power around
the surface wave excitation body, the high-frequency power generation unit sets a
magnitude relationship between a frequency of the high-frequency power to be supplied
to the surface wave excitation body and an exciting frequency of the surface wave
excitation body to heat the heating-target object.
[0067] With this configuration, in the thickness direction of the heating-target object,
in accordance with a heating state desired by a user, the magnitude relationship between
the frequency of the high-frequency power to be supplied to the surface wave excitation
body and the exciting frequency of the surface wave excitation body is set. In the
thickness direction of the heating-target object, the heating-target object can therefore
be heated in the desired heating state.
[0068] In the high-frequency heating device according to the present invention, the frequency
of the high-frequency power to be supplied to the surface wave excitation body may
be set equal to or lower than the exciting frequency of the surface wave excitation
body.
[0069] With this configuration, the high-frequency power supplied to the surface wave excitation
body is propagated with a surface wave around the surface of the surface wave excitation
body under an operation in the "surface wave mode". A side, adjacent to the surface
wave excitation body, of the heating-target object can therefore be locally heated.
[0070] In the high-frequency heating device according to the present invention, the frequency
of the high-frequency power to be supplied to the surface wave excitation body may
be set higher than the exciting frequency of the surface wave excitation body.
[0071] With this configuration, the high-frequency power supplied to the surface wave excitation
body is not propagated with a surface wave around the surface of the surface wave
excitation body, but is radiated into a space under an operation in the "radiation
mode". The whole heating-target object can therefore be evenly heated.
[0072] In the high-frequency heating device according to the present invention, the high-frequency
power generation unit may be a variable high-frequency oscillator configured to generate
the high-frequency power at a variable frequency.
[0073] With this configuration, a frequency of high-frequency power to be supplied to the
surface wave excitation body can be changed. A frequency of high-frequency power relative
to an exciting frequency of the surface wave excitation body can therefore be set
as desired. As a result, field intensity distribution to be formed on the surface
wave excitation body can be adjusted as desired. In the thickness direction of a heating-target
object, the heating-target object can therefore be heated in various heating states.
[0074] In the high-frequency heating device according to the present invention, a surface
wave excitation body may be a variable surface wave excitation body configured to
change an exciting frequency.
[0075] With this configuration, an exciting frequency of the surface wave excitation body
can be changed relative to a frequency of high-frequency power to be supplied to the
surface wave excitation body. In the thickness direction of a heating-target object,
the heating-target object can therefore be heated in various heating states.
INDUSTRIAL APPLICABILITY
[0076] Under demanded heating in a desired heating state in a thickness direction of a heating-target
object in cooking appliances including microwave heater, the present invention is
useful for the cooking appliances including the microwave heaters.
REFERENCE MARKS IN THE DRAWINGS
[0077]
- 100
- high-frequency heating device
- 101
- mounting stand
- 102
- heating-target object
- 103
- surface wave excitation body
- 110
- high-frequency power supply unit
- 120
- high-frequency power generation unit
- 130
- rectangular wave guide
- 131
- tapered rectangular wave guide
- 141, 142
- field intensity distribution