<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.5.1//EN" "ep-patent-document-v1-5-1.dtd">
<!-- This XML data has been generated under the supervision of the European Patent Office -->
<ep-patent-document id="EP17858395B8W1" file="EP17858395W1B8.xml" lang="en" country="EP" doc-number="3495794" kind="B8" correction-code="W1" date-publ="20210721" status="c" dtd-version="ep-patent-document-v1-5-1">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSK..HRIS..MTNORS..SM..................</B001EP><B005EP>J</B005EP><B007EP>BDM Ver 1.7.2 (20 November 2019) -  2999001/0</B007EP></eptags></B000><B100><B110>3495794</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20210721</date></B140><B150><B151>W1</B151><B153>54 72</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>17858395.1</B210><B220><date>20171003</date></B220><B240><B241><date>20190225</date></B241></B240><B250>ja</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>2016199486</B310><B320><date>20161007</date></B320><B330><ctry>JP</ctry></B330><B310>2017086966</B310><B320><date>20170426</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>20210721</date><bnum>202129</bnum></B405><B430><date>20190612</date><bnum>201924</bnum></B430><B450><date>20210602</date><bnum>202122</bnum></B450><B452EP><date>20210208</date></B452EP><B480><date>20210721</date><bnum>202129</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>G01L   5/16        20200101AFI20200226BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>G01L   1/22        20060101ALI20200226BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>SENSORCHIP, BIEGEELEMENT UND KRAFTSENSOR</B542><B541>en</B541><B542>SENSOR CHIP, FLEXURE ELEMENT, AND FORCE SENSOR DEVICE</B542><B541>fr</B541><B542>PUCE DE CAPTEUR, ÉLÉMENT DE FLEXION ET DISPOSITIF DE DÉTECTION DE FORCE</B542></B540><B560><B561><text>EP-A2- 1 327 870</text></B561><B561><text>EP-A2- 1 852 688</text></B561><B561><text>JP-A- 2001 331 271</text></B561><B561><text>JP-A- 2007 298 471</text></B561><B561><text>JP-A- 2013 002 942</text></B561><B561><text>US-A- 4 849 730</text></B561><B561><text>US-A- 5 526 700</text></B561><B565EP><date>20200303</date></B565EP></B560></B500><B700><B720><B721><snm>YAMAGUCHI, Shinya</snm><adr><str>c/o MITSUMI ELECTRIC CO., LTD.
2-11-2 Tsurumaki</str><city>Tama-shi
Tokyo 206-8567</city><ctry>JP</ctry></adr></B721></B720><B730><B731><snm>Minebea Mitsumi Inc.</snm><iid>101663689</iid><irf>B75144EP D39303</irf><adr><str>4106-73 Oaza Miyota 
Miyota-machi</str><city>Kitasaku-gun, Nagano 389-0293</city><ctry>JP</ctry></adr></B731></B730><B740><B741><snm>Regimbeau</snm><iid>101326519</iid><adr><str>20, rue de Chazelles</str><city>75847 Paris Cedex 17</city><ctry>FR</ctry></adr></B741></B740></B700><B800><B840><ctry>AL</ctry><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>RS</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>JP2017035973</anum></dnum><date>20171003</date></B861><B862>ja</B862></B860><B870><B871><dnum><pnum>WO2018066557</pnum></dnum><date>20180412</date><bnum>201815</bnum></B871></B870></B800></SDOBI>
</ep-patent-document>
