(19)
(11) EP 3 523 825 A2

(12)

(88) Date of publication A3:
26.07.2018

(43) Date of publication:
14.08.2019 Bulletin 2019/33

(21) Application number: 17859869.4

(22) Date of filing: 19.09.2017
(51) International Patent Classification (IPC): 
H01L 27/06(2006.01)
H01L 27/11551(2017.01)
H01L 27/11(2006.01)
H01L 21/8238(2006.01)
H01L 27/108(2006.01)
(86) International application number:
PCT/US2017/052359
(87) International publication number:
WO 2018/071143 (19.04.2018 Gazette 2018/16)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 10.10.2016 US 201662406376 P
11.12.2016 US 201662432575 P
30.12.2016 US 201662440720 P
11.02.2017 US 201762457838 P
20.02.2017 US 201762460989 P
16.03.2017 US 201762471963 P
02.04.2017 US 201762480529 P
12.04.2017 US 201762484398 P
23.04.2017 US 201762488821 P
08.06.2017 US 201762517152 P
08.07.2017 US 201762530173 P
21.07.2017 US 201762535265 P
24.08.2017 US 201762549952 P

(71) Applicant: Monolithic 3D Inc.
San Jose, California 95124 (US)

(72) Inventors:
  • OR-BACH, Zvi
    San Jose, California 95124 (US)
  • HAN, Jin-Woo
    San Jose, California 96124 (US)
  • CRONQUIST, Brian
    San Jose, California 95123 (US)
  • LUSKY, Eli
    5200200 Ramat-Gan (IL)

(74) Representative: Romano, Giuseppe et al
Società Italiana Brevetti S.p.A Piazza di Pietra, 39
00186 Roma
00186 Roma (IT)

   


(54) 3D SEMICONDUCTOR DEVICE AND STRUCTURE