[0001] The present invention relates to a platinum composite comprising intermetallic platinum
particles, and to a process of manufacturing said platinum composite.
[0002] More particularly, the platinum composite is used to manufacture luxury goods.
[0003] Platinum itself has a plain silver color and, in consequence, is not considered to
be particularly appealing for use in the jewellery trade. Furthermore, certain intermetallic
platinum compounds, particularly those with aluminum, do have colors different from
that of the constituent metals.
[0004] Some attention has been given to intermetallic compounds, that provide color. One
can cite the document
EP-0 421 731 concerning intermetallic compounds of platinum and aluminum.
[0005] However, such intermetallic compounds do not present optimized mechanical properties,
so that they are easily brittle and difficult to shape.
[0006] The present invention seeks to provide a platinum composite, more particularly obtained
from an intermetallic platinum compound, having optimized mechanical properties, while
being easy to shape.
[0007] To this end, an object of the present invention is a platinum composite comprising
intermetallic platinum particles and a platinum matrix, the intermetallic platinum
particles including preferably platinum (Pt) and at least one metallic element different
from platinum (Pt).
[0008] The present invention advantageously provides a platinum composite with an optimized
hardness, so that improving its shaping, especially to manufacture luxury good.
[0009] The platinum composite of the present invention can also provide aesthetically appealing
colors, and render it attractive and appealing for use as luxury good as such or as
component parts of luxury good.
[0010] Furthermore, the present invention advantageously can also provide a platinum composite
with an improved toughness, while being easy to shape.
[0011] The platinum composite of the invention comprises a platinum matrix and intermetallic
platinum particles.
[0012] More particularly, the platinum matrix can be positioned at the interface between
the intermetallic platinum particles in the platinum composite.
[0013] The presence of the platinum matrix and the intermetallic platinum particles together
in the platinum composite aims at forming at least two different crystallographic
phases in the platinum composite.
[0014] More particularly, the platinum composite comprises at least one platinum phase of
platinum matrix, and at least one intermetallic phase of intermetallic platinum particles.
[0015] The platinum composite can comprise at least 70.0% by weight of platinum (Pt), and
preferably at least 80.0% by weight of platinum (Pt), over the total weight of the
platinum composite.
[0016] The platinum composite can comprise at least 85.0% by weight of platinum (Pt), and
more preferably at least 90.0% by weight of platinum (Pt), over the total weight of
the platinum composite.
[0017] In the present description, the amount of platinum (Pt) expressed in % (percentage)
by weight over the total weight of the platinum composite can also be expressed in
‰ (per mille) by weight over the total weight of the platinum composite. For example,
85.0% by weight of platinum (Pt) over the total weight of the platinum composite can
be written as 850 ‰ by weight over the total weight of the platinum composite.
[0018] The amount of platinum (Pt) in the platinum composite can be easily determined by
X-ray fluorescence (XRF).
[0019] When the platinum composite comprises at least 85.0% by weight of platinum (Pt) over
the total weight of the platinum composite, the platinum composite can be advantageously
hallmarked, by technic well-known in the art.
[0020] In the present invention, the expression "intermetallic" means a compound exhibiting
metallic bonding, with a defined stoichiometry and an ordered crystal structure.
[0021] In other words, an intermetallic compound consists of the periodic alternation of
atoms, and more particularly metallic atoms.
[0022] In a particular embodiment, the intermetallic platinum compound can have a crystal
system of face-centered cubic type. In such crystal system, the fluorite crystallographic
structure type (CaF
2) is preferred.
[0023] The intermetallic platinum particles of the platinum composite can be obtained or
made from an intermetallic platinum compound including platinum (Pt) and at least
one metallic element different from platinum (Pt), the intermetallic platinum compound
being in the form of particles.
[0024] The metallic element can be selected among alkali metal, alkaline earth metal, transition
metal, post-transition metal, and a combination thereof.
[0025] For example, the alkali metal can be lithium (Li); the alkaline earth metal can be
magnesium (Mg); the transition metal can be copper (Cu); the post-transition metal
can be aluminum (Al), gallium (Ga), indium (In), tin (Sn).
[0026] The metallic element which can be used to obtained the intermetallic platinum compound
can have a purity of at least 99.00 % by weight, and more preferably of at least 99.50
% by weight, over the total weight of metallic element. In a particular embodiment,
the intermetallic platinum compound can further include at least one metalloid element,
such as for example antimony (Sb).
[0027] The preferred intermetallic platinum compound used in the present invention can be
selected among: PtAl
2, PtAl
2Cu, Pt
2Al
3, PtAl, PtLi
2Al, PtLi
2ln, PtLi
2Sn, PtMgSn, PtLiAl
2, PtLiGa
2, PtMgSb, and any mixture thereof.
[0028] The most preferred intermetallic platinum compounds are PtAl
2 or PtAl
2Cu. In a particular embodiment, the primitive cell of PtAl
2Cu is at least 0,5 % higher than the primitive cell of PtAl
2, and more preferably is around 0,8 % higher than the primitive cell of PtAl
2.
[0029] The intermetallic platinum particles of the present invention can be of micrometric
size, or in other words can be microparticles.
[0030] The intermetallic platinum particles are typically of micrometric (10
-6 meter) size in at least one of their dimensions.
[0031] The dimension of one intermetallic platinum particle, or in other words the dimension
of one elementary intermetallic platinum particle, is determined in using the equivalent
circular diameter in which a circumscribed circle of the particle is a circle which
passes through all the vertices of the particle.
[0032] The dimension of one intermetallic platinum particle can be determined conventionally
by methods that are well known to the person skilled in the art, such as by analyzing
images taken using a microscope, in particular a scanning electron microscope (SEM).
[0033] The dimension of one or several intermetallic platinum particle(s) of the invention
can be at most 300 micrometers (µm), more preferably at most of 100 µm, more preferably
at most of 50 µm, and even more preferably at most of 10 µm.
[0034] The dimension of one or several intermetallic platinum particle(s) of the invention
can be at least of 0.1 µm, more preferably at least of 0.5 µm, and even more preferably
at least of 1 µm.
[0035] The intermetallic platinum particles, comprised in the platinum composite, include
more than 50% by weight of microparticles, and more preferably more than 80% by weight
of microparticles, over the total weight of intermetallic platinum particles.
[0036] In the platinum composite of the present invention, the amount of intermetallic platinum
particles can be expressed as follows.
[0037] The platinum composite can comprise at most 90.0 % by weight of intermetallic platinum
particles, and more preferably at most 80.0 % by weight of intermetallic platinum
particles, over the total weight of the platinum com posite.
[0038] The platinum composite can comprise at least 10.0 % by weight of intermetallic platinum
particles, and more preferably at least 20.0 % by weight of intermetallic platinum
particles, over the total weight of the platinum com posite.
[0039] The amount of intermetallic platinum particles in the platinum composite can be easily
determined by Scanning Electron Microscopy (SEM).
[0040] The platinum matrix of the invention can be composed of platinum (Pt).
[0041] More particularly, the platinum matrix is not an intermetallic platinum compound,
so that the platinum matrix is different from the intermetallic platinum particles
of the invention.
[0042] In the present invention, the platinum matrix can be continuous or not, at the entire
scale of the platinum composite.
[0043] The platinum matrix can comprise more than 50.0 % by weight of platinum (Pt), more
preferably at least 80.0 % by weight of platinum (Pt), more preferably at least 90.0
% of platinum (Pt), and even more preferably at least 98.0 % by weight of platinum
(Pt), over the total weight of the platinum matrix. More preferably, the platinum
matrix only comprises platinum (Pt).
[0044] In the platinum composite of the present invention, the amount of platinum matrix
can be expressed as follows.
[0045] The platinum composite can comprise at most 90.0 % by weight of platinum matrix,
more preferably at most 80.0 % by weight of platinum matrix, and even more preferably
at most 65.0 % by weight of platinum matrix, over the total weight of the platinum
composite.
[0046] The platinum composite can comprise at least 10.0 % by weight of platinum matrix,
and more preferably at least 20.0 % by weight of platinum matrix, over the total weight
of the platinum composite.
[0047] The amount of platinum matrix in the platinum composite can be easily determined
by Scanning Electron Microscopy (SEM).
[0048] When the platinum composite comprises an amount of intermetallic platinum particles
superior to the amount of platinum matrix, it can be said that the platinum matrix
is dispersed in the intermetallic platinum particles.
[0049] When the platinum composite comprises an amount of platinum matrix superior to the
amount of intermetallic platinum particles, it can be said that the intermetallic
platinum particles is dispersed in the platinum matrix.
[0050] In the present invention, the intermetallic platinum particles are more particularly
made from an intermetallic platinum compound which comprises platinum (Pt) and one
or several metallic element(s).
[0051] Another object of the present invention is a process of manufacturing a platinum
composite, more particularly a process of manufacturing the platinum composite of
the present invention.
[0052] The platinum composite is more preferably obtained from a composition comprising
platinum (Pt) particles and an intermetallic platinum compound.
[0053] The platinum (Pt) particles of the invention can be composed of platinum (Pt) with
a purity of at least 99.00 % by weight, and more preferably of at least 99.50 % by
weight, over the total weight of platinum particles.
[0054] The platinum (Pt) particles can be mixed with the intermetallic platinum compound,
in order to obtain the platinum composite.
[0055] The platinum particles can be of micrometric size, or in other words can be microparticles.
[0056] The platinum particles are typically of micrometric (10
-6 meter) size in at least one of their dimensions.
[0057] The dimension of one platinum particle, or in other words the dimension of one elementary
platinum particle, is determined in using the equivalent circular diameter in which
a circumscribed circle of the particle is a circle which passes through all the vertices
of the particle.
[0058] The dimension of one platinum particle can be determined conventionally by methods
that are well known to the person skilled in the art, such as by analyzing images
taken using a microscope, in particular a scanning electron microscope (SEM).
[0059] The dimension of one or several platinum particle(s) of the invention can be at most
of 300 micrometers (µm), more preferably at most of 100 µm, more preferably at most
of 50 µm, and even more preferably at most of 10 µm.
[0060] The dimension of one or several platinum particle(s) of the invention can be at least
of 0.1 µm, more preferably at least of 0.5 µm, and even more preferably at least of
1 µm.
[0061] The platinum particles include more than 50% by weight of microparticles, and more
preferably more than 80% by weight of microparticles, over the total weight of platinum
particles.
[0062] The intermetallic platinum compound can be the one described in the present invention.
[0063] The intermetallic platinum compound can comprise more than 50.0 % by weight of platinum
(Pt), and more preferably at least 60.0 % by weight of platinum (Pt), over the total
weight of the intermetallic platinum compound.
[0064] The intermetallic platinum compound can comprise less than 95.0 % by weight of platinum
(Pt), more preferably less than 85.0 % by weight of platinum (Pt), and even more preferably
less than 80.0 % by weight of platinum (Pt), over the total weight of the intermetallic
platinum compound.
[0065] The intermetallic platinum compound used to obtain the platinum composite can be
in the form of particles, and more preferably in the form of microparticles, as described
in the present invention.
[0066] The colors of the above-mentioned intermetallic platinum compounds are listed in
the below table 1 :
Table 1
PtAl2 |
Yellow |
PtAl2Cu |
Orange or pink |
Pt2Al3 |
Blue |
PtAl |
Grey |
PtLi2Al |
Bright-yellow |
PtLi2ln |
Brass-yellow |
PtLi2Sn |
Yellow |
PtMgSn |
Reddish-brown |
PtLiAl2 |
Copper-red |
PtLiGa2 |
Brown-pink |
PtMgSb |
Violet |
[0067] The intermetallic platinum compound can preferably be in the form of particles or
powder, mixed with the platinum (Pt) particles, in order to obtain the platinum composite.
[0068] The particles of intermetallic platinum compound, and more preferably the microparticles
of intermetallic platinum compound, can be those described in the present invention.
[0069] The process of manufacturing a platinum composite can comprise the following steps:
- i. mixing an intermetallic platinum compound and platinum (Pt) particles, the intermetallic
platinum compound comprising more preferably platinum (Pt) and at least one metallic
element different from platinum (Pt), and
- ii. sintering the mixture obtained in step i.
[0070] In a preferred embodiment, the process aims at manufacturing the platinum composite
according to the invention.
[0071] The step i can be performed by well-known technics in the art, especially to mix
microparticles. For example, the intermetallic platinum compound, preferably under
the form of particles, and the platinum particles can be mixed together in using an
ultrasonic bath with the addition of one solvent, such as acetone. The mixing time
can be done during a sufficient time to obtained a homogenized mixture. For example,
the mixture time can be from 1 to 20 minutes.
[0072] The step i is a mixing step of a composition comprising the intermetallic platinum
compound and the platinum (Pt) particles.
[0073] The composition can comprise more than 50.0% by weight of platinum (Pt), more preferably
at least 70.0% by weight of platinum (Pt), and even more preferably at least 80.0%
by weight of platinum (Pt), over the total weight of the composition.
[0074] The composition can comprise at least 85.0% by weight of platinum (Pt), and more
preferably at least 90.0% by weight of platinum (Pt), over the total weight of the
composition.
[0075] In step i of the present invention, the amount of intermetallic platinum compound
can be expressed as follows.
[0076] The composition can comprise at most 90.0 % by weight of intermetallic platinum compound,
more preferably at most 80.0 % by weight of intermetallic platinum particles, and
even more preferably at most 70.0 % by weight of intermetallic platinum particles,
over the total weight of the composition.
[0077] The composition can comprise at least 10.0 % by weight of intermetallic platinum
particles, and more preferably at least 20.0 % by weight of intermetallic platinum
particles, over the total weight of the composition.
[0078] In step i of the present invention, the amount of platinum (Pt) particles can be
expressed as follows.
[0079] The composition can comprise at most 80.0 % by weight of platinum (Pt) particles,
and more preferably at most 65.0 % by weight of platinum (Pt) particles, over the
total weight of the composition.
[0080] The composition can comprise at least 10.0 % by weight of platinum (Pt) particles,
and more preferably at least 20.0 % by weight of platinum (Pt) particles, over the
total weight of the composition.
[0081] In a preferred embodiment, the platinum particles are not an intermetallic platinum
compound, so that the platinum particles are different from the intermetallic platinum
compound of the invention.
[0082] The step ii can be done in using a plasma sintering furnace or in using another equipment
well-known in the art.
[0083] In the sintering step ii, different parameters can vary, such as the sintering temperature,
the sintering dwell time, and/or the sintering pressure.
[0084] In a particular embodiment, the sintering step ii can include one or several of the
following parameters:
- the sintering temperature can be from 450 to 850 °C, and/or
- the sintering dwell time can be from 1 to 10 minutes (min), and more preferably from
2 to 7 minutes, and/or
- the sintering pressure can be from 200 to 400 MPa.
[0085] With a sintering temperature less than 450°C and/or a sintering pressure less than
200 MPa, the platinum composite can present mechanical properties which are not optimized,
especially in terms of brittleness and/or weak densification.
[0086] With a sintering temperature more than 850°C and/or a sintering pressure more than
400 MPa, the platinum composite can present a loss of color.
[0087] Before step i, the intermetallic platinum compound can be milled by technic well-known
in the art to form particles or powder, as described in the present invention.
[0088] The intermetallic platinum compound used in the process of manufacturing a platinum
composite, can be manufactured before step i.
[0089] The process of manufacturing an intermetallic platinum compound is well known in
the art. For example, the intermetallic platinum compound used in the present invention
can be the one described in
EP-0 421 731.
[0090] More particularly, the process of manufacturing an intermetallic platinum compound
can comprise the following step:
- a.mixing at least two different metallic powders including platinum and at least one
metallic element different from platinum, more preferably the mixing step being a
dry mixing;
- b. melting the mixture obtained in step a, and more preferably arc melting the mixture
obtained in step a,
to obtain said intermetallic platinum compound, more preferably in the form of solid
element(s), such as for example in the form of ingot(s).
[0091] The step b can be done using an arc melter, more preferably under an argon atmosphere.
[0092] In a preferred embodiment, the step b can be performed at least twice, in order to
obtain said intermetallic platinum compound with an enhanced homogeneity.
[0093] The intermetallic platinum compound of the present invention, obtained from steps
a and b, or obtained from another process well-known in the art, can undergo a treatment
process before step i, which can include a thermic treatment and/or a mechanic treatment.
[0094] More particularly, the process of treating of the intermetallic platinum compound
can comprise at least one of the following steps, before step i, and after step b
when step b exists:
c. annealing the intermetallic platinum compound, as thermic treatment, and/or
d. milling the intermetallic platinum compound, as mechanic treatment.
[0095] In a preferred embodiment, the process of treating of the intermetallic platinum
compound can comprise the following steps, before step i, and after step b when step
b exists:
c. annealing the intermetallic platinum compound, and
d. milling the intermetallic platinum compound obtained in step c.
[0096] In the present invention, the step c can be performed in using a furnace, and more
preferabley a muffle furnace. The temperature in step c can be from 800 to 1200°C,
and more preferably around 1000°C.
[0097] The step d can be done using a mortar and pestle and/or a planetary ball mill. This
step can allow to obtain particles of intermetallic platinum compound as described
in the present invention.
[0098] In a particular embodiment, when the intermetallic platinum compound is manufactured
according to the steps a and b as described in the present invention, the step c is
done after step b.
[0099] Another object of the present invention is a platinum composite obtained from the
process of manufacturing a platinum composite as described in the present invention.
[0100] Another object of the present invention is an item obtained from the platinum composite.
[0101] The item can comprise or consist of the platinum composite according to the present
invention. Accordingly, this platinum composite can be used in order to manufacture
luxury goods, such as for example a time-piece and/or a jewel. The time-piece and/or
the jewel can have a part or a component comprising the platinum composite according
to the present invention.
[0102] The item according to the present invention can be a jewel, a leather good, or a
clothing accessory. It may also be a watch, a writing accessory, or a decorative item.
[0103] For instance, the item can be any of the followings: ring; ear ring; necklace; bracelet;
pendant; watch such as case, bezel, caseback, crown, bracelet links, clasp, buckle,
automatic movement rotor; buckle (e.g. belt or purse); tie bar; cuff links; money
clip; hair pin; pen; paper knife.
[0104] The present invention will become more fully understood from the examples given herein
below and from the accompanying drawing, which are given by way of illustration only,
and thus, which are not limits of the present invention, and wherein:
Figure 1 represents a SEM picture of a platinum composite according to the invention.
Examples:
1. Process of manufacturing an intermetallic platinum compound
[0105] Different intermetallic platinum compounds have been prepared and are gathered in
the Table 2 as below.
[0106] The amounts in Table 2 are expressed in percentage by weight (wt%) over the total
weight of the intermetallic platinum compound.
[0107] The right column of Table 2 presents the color of each intermetallic platinum compound.
Table 2
|
Platinum (Pt) powder |
Aluminum (Al) powder |
Copper (Cu) powder |
Color |
Intermetallic platinum compound 1 |
77.0 wt% |
23.0 wt% |
0 wt% |
Yellow |
Intermetallic platinum compound 2 |
61.6 wt% |
18.4 wt% |
20.0 wt% |
Pink |
[0108] The origin of the different powders mentioned in table 2 is as follows:
- Platinum powder is commercialized by Impala Platinum Ltd, with a purity of 99,95 %
and a particle diameter size around 84 µm (equivalent circular diameter);
- Aluminum powder is a commercialized aluminum powder with a purity of 99,00 % and a
particle diameter size from 10 to 100 µm (equivalent circular diameter); and
- Copper powder is a commercialized copper powder with a purity of 99,00 % and a particle
diameter size from 10 to 100 µm (equivalent circular diameter).
[0109] The intermetallic platinum compounds 1 and 2 of Table 2 are obtained as follows.
[0110] In a first step (step a), the platinum powder, the aluminum powder, and optionally
the copper powder, are dry mixed in using a spatula in a petri dish.
[0111] In a second step (step b), the mixture obtained in step a is melted in using an arc
melter (under argon atmosphere, with a potential of 24 V and a current of 320-380
A), to form ingots of intermetallic platinum compound (i.e. intermetallic platinum
ingots). Then, the ingots are re-melted two times in order to enhance homogeneity.
[0112] Thus in step b, the obtained intermetallic platinum compound 1 is PtAl
2, and the obtained intermetallic platinum compound 2 is PtAl
2Cu.
2. Process of treating the intermetallic platinum compound
[0113] After forming the intermetallic platinum compound in step b as above, in a third
step (step c) the intermetallic platinum ingots are annealed at a temperature of 1000°C
for 30 minutes.
[0114] More particularly, the intermetallic platinum ingots are sealed in a quartz glass
tube under 0.2 atm of argon gas and placed in a furnace. The temperature of the furnace
raises to 1000°C at a heating rate of 5°C/min, and the ingots are kept at 1000°C for
30 minutes, and then quenched in water.
[0115] In a fourth step (step d), the annealed ingots are milled into fine particles to
form a powder, in using a Fritsch Pulverisette 6 planetary mono Ball mill device (milling
conditions: hexane as solvent; milling speed of 300 rpm; duration: 3 hours). The obtained
intermetallic platinum powder are microparticles with a diameter size (i.e. equivalent
circular diameter) from 1 to 10 µm, and more particularly around 3 µm.
3. Process of manufacturing a platinum composite
[0116] In a fifth step (step i), platinum (Pt) particles (powder) are used, this platinum
powder being commercialized by Impala Platinum Ltd, with a purity of 99,95% and a
particle diameter size around 84 µm (i.e. equivalent circular diameter).
[0117] The Table 3 as below gathers the amount of the platinum (Pt) particles, the intermetallic
platinum compound 1 and the intermetallic platinum compound 2 used in the manufacturing
of the Components 1 to 6.
[0118] Component 1 and Component 4 are obtained from the powders of intermetallic platinum
compounds prepared in steps a to d, without the addition of platinum particles.
[0119] Component 2, Component 3, Component 5, and Component 6 are obtained from the powders
of intermetallic platinum compounds prepared in steps a to d, with the addition of
the platinum particles.
[0120] The amounts in Table 3 are expressed in gram (g) over 2 grams of component. The total
weight of platinum (Pt) in the component is expressed in percentage by weight (wt%)
over the total weight of the component.
Table 3
|
Platinum (Pt) particles |
Intermetallic platinum compound 1 (PtAl2) |
Intermetallic platinum compound 2 (PtAl2Cu) |
Total weight of platinum in the component |
Component 1 |
0 g |
2.000 g |
0 g |
77.0 wt% |
Component 2 |
0.260 g |
1.740 g |
0 g |
80.0 wt% |
Component 3 |
0.696 g |
1.304 g |
0 g |
85.0 wt% |
Component 4 |
0 g |
0 g |
2.000 g |
61.6 wt% |
Component 5 |
0.958 g |
0 g |
1.042 g |
80.0 wt% |
Component 6 |
1.218 g |
0 g |
0.782 g |
85.0 wt% |
[0121] Component 2, 3, 5 and 6 (i.e. platinum composite according to the invention) are
obtained in mixing together the powder of platinum (Pt) and the powder of intermetallic
platinum compound, listed in Table 3.
[0122] The mixing is done for 10 minutes, in using an ultrasonic bath with the addition
of acetone as solvent. Then, the mixture is dried to evaporate the solvent at a temperature
of 30°C.
[0123] In a sixth step (step ii), the mixture obtained in step i is then sintered using
a furnace with the following commercialized reference: FCT System HP-D5 spark plasma
sintering furnace. The sintering is performed under vacuum, with an absolute gas pressure
of 1 hPa, and with a pulse time (i.e. duration of the electric discharge through the
sample) of 10 ms with a pause of 5 ms.
[0124] The Components 1 and 4 are also sintered under the same conditions as Components
2, 3, 5 and 6.
[0125] The temperature and pressure of the sintering step are gathered in the following
Table 4. The sintering dwell time vary between 2 and 7 minutes, the sintering dwell
time being the amount of time during which the pressure and temperature are applied.
Table 4
|
Temperature (°C) |
Pressure (MPa) |
Component 1 |
850 |
200 |
Component 2 |
450 |
250 |
Component 3 |
850 |
200 |
Component 4 |
650 |
250 |
Component 5 |
450 |
250 |
Component 6 |
500 |
200 |
Determination method of the particle size
[0126] The particle size (i.e. equivalent circular diameter) of the Components 1 to 6 has
been determined by the following method.
[0127] To illustrate one of the obtained platinum composite, Figure 1 represents a SEM picture
of the Component 6 obtained with a temperature of 500°C and a pressure of 200 MPa,
during 2 minutes (sintering step).
[0128] Figure 1 shows intermetallic platinum particles (1) together with the platinum matrix
(2) as solid phase between the interfaces of the intermetallic platinum particles.
[0129] The size of the intermetallic platinum particles in the components 1 to 6 are from
1 to 10 µm.
Determination method of the color
[0130] In order to evaluate the color of the Components 1 to 6, the CI ELAB coordinates,
which are well known as color space specified by the International Commission on Illumination
(known in French with the acronym CIE), are used.
[0131] The three coordinates of CI ELAB represent the lightness of the color (L* = 0 yields
black and L* = 100 indicates diffuse white), its position between red/magenta and
green (a*, negative values indicate green while positive values indicate magenta)
and its position between yellow and blue (b*, negative values indicate blue and positive
values indicate yellow).
[0132] For example, L* a* b coordinates of the "Traditional" 5N gold alloy (Composition
: Au 750w‰ + Ag 45w‰ + Cu 205w‰ ) is as follows: L* = 86.3; a* = 8.8; b* = 18.5.
[0133] To compare two different colors, or to characterize the evolution of a sample, the
expression "ΔE*" can be used. ΔE corresponds to the distance between two colors placed
in the CIELAB color space which is calculated with the formula of the Euclidian distance.
[0135] The illuminant used to evaluate the platinum composite color is the CIE D65 standard
illuminant, with a viewing angle of 10°.
[0136] The CIELAB coordinates of the Components 1 to 6 are gathered in the following Table
5.
Table 5
|
CI ELAB corrdinates with CIE standard illuminant D65 |
L* |
a* |
b* |
Component 1 |
77.98±0.32 |
5.57±0.1 |
24.01±0.51 |
Component 2 |
77.02±0.29 |
2.60±0.05 |
9.94±0.28 |
Component 3 |
65.52±0.36 |
3.11±0.06 |
9.31±0.12 |
Component 4 |
77.70±0.19 |
8.79±0.04 |
10.84±0.16 |
Component 5 |
79.98±0.24 |
4.74±0.05 |
8.35±0.06 |
Component 6 |
74.92±0.41 |
1.02±0.06 |
6.13±0.19 |
[0137] According to the results of Table 5, the Components 2, 3, 5 and 6 according to the
present invention provide aesthetically appealing colors, and render it attractive
and appealing for use as luxury good as such or as component parts of luxury good.
Determination method of the hardness
[0138] The hardness of the Components 1, 2, 4 and 5 have been determined using a Vickers
micro-hardness tester on polished samples. The samples have been indented linearly
on the surfaces at five different positions and the average have been recorded. The
indentation load was 2 kg with an indentation time of 10 seconds.
[0139] In the present invention, the hardness of the platinum composite, comprising intermetallic
platinum particles and a platinum matrix, can advantageously be lower than the hardness
of said intermetallic platinum particles as such. More particularly, the hardness
of the platinum composite according to the present invention can be of at least 200
Hv.
[0140] The hardness of the Components 1, 2, 4 and 5 are gathered in the following Table
6.
Table 6
|
Hardness (Hv) |
Component 1 |
488 ± 5 |
Component 2 |
297 ± 13 |
Component 4 |
355 ± 30 |
Component 5 |
294 ± 27 |
[0141] The hardness of Component 2 is lower than the hardness of Component 1, and the hardness
of Component 5 is lower than the hardness of Component 4. Hence, the present invention
advantageously provides a platinum composite with an optimized hardness, in comparison
to intermetallic platinum compound as such, so that improving its shaping.