FIELD OF THE INVENTION
[0001] This invention relates to electro-optic displays and the processes for the production
of electro-optic displays. More specifically, in one aspect this invention relates
to a method of manufacturing a laminated electro-optic display to provide a top plane
connection (TPC), i.e. an electrical connection between the conductors in a backplane
and the conductive layer of the front plate laminate.
BACKGROUND
[0002] The term "electro-optic", as applied to a material or a display, is used herein in
its conventional meaning in the imaging art to refer to a material having first and
second display states differing in at least one optical property, the material being
changed from its first to its second display state by application of an electric field
to the material. Although the optical property is typically color perceptible to the
human eye, it may be another optical property, such as optical transmission, reflectance,
luminescence, or, in the case of displays intended for machine reading, pseudo-color
in the sense of a change in reflectance of electromagnetic wavelengths outside the
visible range.
[0003] Several types of electro-optic displays are known. One type of electro-optic display
is a rotating bichromal member type as described, for example, in
U.S. Patents Nos. 5,808,783;
5,777,782;
5,760,761;
6,054,071 6,055,091;
6,097,531;
6,128,124;
6,137,467; and
6,147,791 (although this type of display is often referred to as a "rotating bichromal ball"
display, the term "rotating bichromal member" is preferred as more accurate since
in some of the patents mentioned above the rotating members are not spherical). Such
a display uses a large number of small bodies (typically spherical or cylindrical)
which have two or more sections with differing optical characteristics, and an internal
dipole. These bodies are suspended within liquid-filled vacuoles within a matrix,
the vacuoles being filled with liquid so that the bodies are free to rotate. The appearance
of the display is changed by applying an electric field thereto, thus rotating the
bodies to various positions and varying which of the sections of the bodies is seen
through a viewing surface.
[0004] Another type of electro-optic display uses an electrochromic medium, for example
an electrochromic medium in the form of a nanochromic film comprising an electrode
formed at least in part from a semi-conducting metal oxide and a plurality of dye
molecules capable of reversible color change attached to the electrode; see, for example
O'Regan, B., et al., Nature 1991, 353, 737; and
Wood, D., Information Display, 18(3), 24 (March 2002). See also
Bach, U., et al., Adv. Mater., 2002, 14(11), 845. Nanochromic films of this type are also described, for example, in
U.S. Patents Nos. 6,301,038;
6,870,657; and
6,950,220. This type of medium is also typically bistable.
[0006] One type of electro-optic display, which has been the subject of intense research
and development for a number of years, is the particle-based electrophoretic display,
in which a plurality of charged particles move through a fluid under the influence
of an electric field. Electrophoretic displays can have attributes of good brightness
and contrast, wide viewing angles, state bistability, and low power consumption when
compared with liquid crystal displays.
[0007] Numerous patents and applications assigned to or in the names of the Massachusetts
Institute of Technology (MIT), E Ink Corporation, E Ink California, LLC and related
companies describe various technologies used in encapsulated and microcell electrophoretic
and other electro-optic media. Encapsulated electrophoretic media comprise numerous
small capsules, each of which itself comprises an internal phase containing electrophoretically-mobile
particles in a fluid medium, and a capsule wall surrounding the internal phase. Typically,
the capsules are themselves held within a polymeric binder to form a coherent layer
positioned between two electrodes. In a microcell electrophoretic display, the charged
particles and the fluid are not encapsulated within microcapsules but instead are
retained within a plurality of cavities formed within a carrier medium, typically
a polymeric film. The technologies described in these patents and applications include:
- (a) Electrophoretic particles, fluids and fluid additives; see for example U.S. Patents Nos. 7,002,728 and 7,679,814;
- (b) Capsules, binders and encapsulation processes; see for example U.S. Patents Nos. 6,922,276 and 7,411,719;
- (c) Microcell structures, wall materials, and methods of forming microcells; see for
example United States Patents Nos. 7,072,095 and 9,279,906;
- (d) Methods for filling and sealing microcells; see for example United States Patents Nos. 7,144,942 and 7,715,088;
- (e) Films and sub-assemblies containing electro-optic materials; see for example U.S. Patents Nos. 6,982,178 and 7,839,564;
- (f) Backplanes, adhesive layers and other auxiliary layers and methods used in displays;
see for example U.S. Patents Nos. 7,116,318 and 7,535,624;
- (g) Color formation and color adjustment; see for example U.S. Patents Nos. 7,075,502 and 7,839,564;
- (h) Methods for driving displays; see for example U.S. Patents Nos. 7,012,600 and 7,453,445;
- (i) Applications of displays; see for example U.S. Patents Nos. 7,312,784 and 8,009,348; and
- (j) Non-electrophoretic displays, as described in U.S. Patents Nos. 6,241,921 and 2015/0277160; and applications of encapsulation and microcell technology other than displays;
see for example U.S. Patent Application Publications Nos. 2015/0005720 and 2016/0012710.
[0008] Many of the aforementioned patents and applications recognize that the walls surrounding
the discrete microcapsules in an encapsulated electrophoretic medium could be replaced
by a continuous phase, thus producing a so-called polymer-dispersed electrophoretic
display, in which the electrophoretic medium comprises a plurality of discrete droplets
of an electrophoretic fluid and a continuous phase of a polymeric material, and that
the discrete droplets of electrophoretic fluid within such a polymer-dispersed electrophoretic
display may be regarded as capsules or microcapsules even though no discrete capsule
membrane is associated with each individual droplet; see for example, the aforementioned
U.S. Patent No. 6,866,760. Accordingly, for purposes of the present application, such polymer-dispersed electrophoretic
media are regarded as sub-species of encapsulated electrophoretic media.
[0009] An encapsulated electrophoretic display typically does not suffer from the clustering
and settling failure mode of traditional electrophoretic devices and provides further
advantages, such as the ability to print or coat the display on a wide variety of
flexible and rigid substrates. (Use of the word "printing" is intended to include
all forms of printing and coating, including, but without limitation: pre-metered
coatings such as patch die coating, slot or extrusion coating, slide or cascade coating,
curtain coating; roll coating such as knife over roll coating, forward and reverse
roll coating; gravure coating; dip coating; spray coating; meniscus coating; spin
coating; brush coating; air knife coating; silk screen printing processes; electrostatic
printing processes; thermal printing processes; ink jet printing processes; electrophoretic
deposition (See
U.S. Patent No. 7,339,715); and other similar techniques.) Thus, the resulting display can be flexible. Further,
because the display medium can be printed (using a variety of methods), the display
itself can be made inexpensively.
[0010] Other types of electro-optic media may also be used in the displays of the present
invention.
[0011] An electro-optic display normally comprises a layer of electro-optic material and
at least two other layers disposed on opposed sides of the electro-optic material,
one of these two layers being an electrode layer. In most such displays both the layers
are electrode layers, and one or both of the electrode layers are patterned to define
the pixels of the display. For example, one electrode layer may be patterned into
elongate row electrodes and the other into elongate column electrodes running at right
angles to the row electrodes, the pixels being defined by the intersections of the
row and column electrodes. Alternatively, and more commonly, one electrode layer has
the form of a single continuous electrode and the other electrode layer is patterned
into a matrix of pixel electrodes, each of which defines one pixel of the display.
In another type of electro-optic display, which is intended for use with a stylus,
print head or similar movable electrode separate from the display, only one of the
layers adjacent the electro-optic layer comprises an electrode, the layer on the opposed
side of the electro-optic layer typically being a protective layer intended to prevent
the movable electrode damaging the electro-optic layer.
[0012] The manufacture of a three-layer electro-optic display normally involves at least
one lamination operation. For example, in several of the aforementioned MIT and E
Ink patents and applications, there is described a process for manufacturing an encapsulated
electrophoretic display in which an encapsulated electrophoretic medium comprising
capsules in a binder is coated on to a flexible substrate comprising indium-tin-oxide
(ITO) or a similar conductive coating (which acts as one electrode of the final display)
on a plastic film, the capsules/binder coating being dried to form a coherent layer
of the electrophoretic medium firmly adhered to the substrate. Separately, a backplane,
containing an array of pixel electrodes and an appropriate arrangement of conductors
to connect the pixel electrodes to drive circuitry, is prepared. To form the final
display, the substrate having the capsule/binder layer thereon is laminated to the
backplane using a lamination adhesive. (A very similar process can be used to prepare
an electrophoretic display usable with a stylus or similar movable electrode by replacing
the backplane with a simple protective layer, such as a plastic film, over which the
stylus or other movable electrode can slide.) In one preferred form of such a process,
the backplane is itself flexible and is prepared by printing the pixel electrodes
and conductors on a plastic film or other flexible substrate. The obvious lamination
technique for mass production of displays by this process is roll lamination using
a lamination adhesive. Similar manufacturing techniques can be used with other types
of electro-optic displays. For example, a microcell electrophoretic medium or a rotating
bichromal member medium may be laminated to a backplane in substantially the same
manner as an encapsulated electrophoretic medium.
[0013] Electro-optic displays, including electrophoretic displays, can be costly; for example,
the cost of the color LCD found in a portable computer is typically a substantial
fraction of the entire cost of the computer. As the use of such displays spreads to
devices, such as cellular telephones and personal digital assistants (PDA's), much
less costly than portable computers, there is great pressure to reduce the costs of
such displays. The ability to form layers of electrophoretic media by printing techniques
on flexible substrates, as discussed above, opens up the possibility of reducing the
cost of electrophoretic components of displays by using mass production techniques
such as roll-to-roll coating using commercial equipment used for the production of
coated papers, polymeric films and similar media. However, the ability to utilize
roll-to-roll coating for the purpose of mass-production of electro-optic displays
having relatively large dimensions is limited due to the need for precise alignment
of the front plane laminate and backplane.
[0014] EP 2 877 895 A1 describes a method for forming an electrical connection between the backplane and
the front electrode of an electro-optic display by: forming a front plane laminate
comprising, in order, a light-transmissive electrically-conductive layer, a layer
of electro-optic material, and a layer of lamination adhesive; forming an aperture
through all three layers of the front plane laminate; and introducing a flowable,
electrically-conductive material into the aperture, the flowable, electrically-conductive
material being in electrical contact with the light-transmissive electrically-conductive
layer and extending through the adhesive layer.
[0015] US 2013/014 1776 A1 describes a backplane for an electrophoretic display, the backplane having a plurality
of layers including a base film layer, an interconnect layer, a foil layer and a display
film layer. Figures 8-10 of the application illustrate an embodiment in which a conductive
material layer penetrates the electro-optic medium to provide electrical contact,
[0016] US 2016/0139482 A1 describes various methods for establishing contacts between a backplane and the front
electrode of an electro-optic display. Some of these methods involve forming an aperture
through the electro-optic layer and the adhesive layer which lie between the backplane
and the front electrode, and filling this aperture with a conductive material
[0017] Thus, there is a need for improved mass production techniques associated with the
manufacture of laminated electro-optic displays.
SUMMARY OF THE INVENTION
[0018] According to one embodiment of the present invention, a method of forming an electro-optic
display is provided. The method comprises forming a front plane laminate comprising,
in this order, a first substrate, a first conductive layer, a layer of electro-optic
medium, and an adhesive, the first substrate and first conductive layer being transparent.
The method further comprises coating an insulating layer and a second conductive layer
onto a second substrate comprising a plurality of conductors to provide a backplane.
The method further comprises scoring the second substrate to form a removable portion,
laminating the front plane laminate to the backplane, removing the removable portion
from the second substrate to provide an opening in the backplane, and filling the
opening with a conductive material to provide an electrical connection between the
first conductive layer and one of the plurality of conductors.
[0019] These and other aspects of the present invention will be apparent in view of the
following description.
BRIEF DESCRIPTION OF THE FIGURES
[0020] The drawing Figures depict one or more implementations in accord with the present
concepts, by way of example only, not by way of limitations. In the figures, like
reference numerals refer to the same or similar elements.
FIGURE 1 is a schematic cross-section through a front plane laminate used in a process
according to an embodiment of the present invention;
FIGURE 2A is a schematic top plan view of a substrate of a backplane used in a process
according to an embodiment of the present invention;
FIGURE 2B is a schematic top plan view of the substrate of FIGURE 2A coated with an
insulating layer;
FIGURE 2C is a schematic top plan view of the substrate of FIGURE 2B coated with a
bottom conductive layer;
FIGURE 2D is a schematic bottom plan view of the front plane laminate of FIGURE 1
having a region of exposed top conductive layer;
FIGURE 3A is a schematic bottom plan view of a backplane laminated to a front plane
laminate according to another embodiment of the present invention;
FIGURE 3B is a magnified view of the tab of the backplane of FIGURE 3A;
FIGURE 3C is a magnified view of another embodiment of a tab for a backplane;
FIGURE 3D is a magnified view of yet another embodiment of a cutout for a backplane;
FIGURE 3E is a magnified view of yet another embodiment of a cutout for a backplane.
FIGURE 4 is a schematic cross-section along axis I-I of the laminate of FIGURE 3A;
FIGURE 5 is a schematic cross-section of the laminate of FIGURE 4 after the tab has
been removed from the backplane;
FIGURE 6 is a schematic cross-section of the laminate of FIGURE 5 after a portion
of the electro-optic media has been removed;
FIGURE 7 is a schematic cross-section of the laminate of FIGURE 6 after a void has
been filled with a conductive material;
FIGURE 8 is a schematic cross-section of a laminate according to another embodiment
of the invention after a void has been filled with a conductive material; and
FIGURE 9 is a schematic cross-section of a laminate according to yet another embodiment
of the invention after a void has been filled with a conductive material.
DETAILED DESCRIPTION
[0021] In the following detailed description, numerous specific details are set forth by
way of examples in order to provide a thorough understanding of the relevant teachings.
However, it should be apparent to those skilled in the art that the present teachings
may be practiced without such details.
[0022] The various examples described in this section relate to a method for forming a display
through a non-precision lamination technique while also allowing for small, precisely
located top plane connections. Generally, according to an embodiment of the present
invention, the backplane may be provided with a hole that extends through the end
portion of a conductor that is formed in the backplane. After lamination, the top
conducting layer of the front plane laminate may be cleaned of electro-optic media
and lamination adhesive through the hole in the backplane. This exposes the top conducting
layer and allows for a conductive dispensable filler to be loaded into the hole in
order to make an electrical connection between the top conducting layer and the conductor
embedded in the backplane.
[0023] Referring to the figures generally, a laminated electro-optic display is provided
comprising a front transparent substrate; a rear substrate having a plurality of conductors;
and a plurality of layers between the front substrate and the rear substrate, the
plurality of layers comprising a layer of electro-optic media, a first conductive
layer positioned between the front substrate and the electro-optic media, and a second
conductive layer positioned between the electro-optic media and the rear substrate,
wherein the rear substrate includes a through-hole filled with a conductive material
such that at least one of the plurality of conductors is electrically connected via
the conductive material to the first conductive layer.
[0024] Various embodiments of the present invention also include a method of forming an
electro-optic display. The method comprises forming a front plane laminate comprising,
in this order, a first substrate, a first conductive layer, a layer of electro-optic
media, and an adhesive, the first substrate and first conductive layer being transparent;
coating an insulating layer and a second conductive layer onto a second substrate
comprising a plurality of conductors to provide a backplane; scoring the second substrate
to provide a removable portion; laminating the front plane laminate to the backplane;
removing the portion from the second substrate to provide an opening in the backplane;
and filling the opening with a conductive material to provide an electrical connection
between the first conductive layer and one of the plurality of conductors.
[0025] The portion in the second substrate in the above described method may be cut in proximity
to the one conductor. The scoring step may also occurs either prior to or after coating
the second substrate with the insulating layer and the second conductive layer. The
removing step may expose the electro-optic media and adhesive within the opening,
so that at least some of the electro-optic media and adhesive within the opening after
the laminating step to expose the first conductive layer may be cleaned away and/or
removed. The portion of the second substrate may be cut into the form of a flap. Furthermore,
the second conductive layer may be applied to two opposing surfaces of the second
substrate.
[0026] Reference now is made in detail to the examples illustrated in the accompanying drawings
and discussed below.
[0027] In Figure 1, a schematic cross-section of a front plane laminate ("FPL") 100 is provided.
The FPL 100 is similar to those described in aforementioned
U.S. Patent No. 6,982,178. The FPL 100 may comprise, in order, a light-transmissive electrically-conductive
layer; a layer of a solid electro-optic medium in electrical contact with the electrically-conductive
layer; an adhesive layer; and a release sheet. Typically, the light-transmissive electrically-conductive
layer 104 is applied to a light-transmissive substrate 102, which is preferably flexible,
in the sense that the substrate can be manually wrapped around a drum 10 inches (254
mm) in diameter, for example, without permanent deformation. The term "light-transmissive"
is used herein throughout the specification and claims to mean that the layer thus
designated transmits sufficient light to enable an observer, looking through that
layer, to observe the change in display states of the electro-optic medium, which
will normally be viewed through the electrically-conductive layer and adjacent substrate
(if present); in cases where the electro-optic medium displays a change in reflectivity
at non-visible wavelengths, the term "light-transmissive" should of course be interpreted
to refer to transmission of the relevant non-visible wavelengths. The substrate 102
may be manufactured from glass or a polymeric film, for example, and may have a thickness
in the range of about 1 to about 25 mil (25 to 634 µm), preferably about 2 to about
10 mil (51 to 254 µm). The top conductive layer 104 may comprise a thin metal or metal
oxide layer of, for example, ITO, or may be a conductive polymer, such as PEDOT.
[0028] A coating of electro-optic medium 106 is applied over the top conductive layer 104,
such that the electro-optic medium 106 is in electrical contact with the top conductive
layer 104. The electro-optic medium 106 may, preferably, be in the form of an opposite
charge dual particle encapsulated electrophoretic medium of the type described in
U.S. Patent Application 2002/0185378. The medium may comprise dispersion media encapsulated within a binder. The dispersion
media may contain a hydrocarbon-based liquid in which are suspended negatively charged
white particles and positively charged black particles. Upon application of an electrical
field across the electro-optic medium 106, the white particles may move to the positive
electrode and the black particles may move to the negative electrode, for example,
so that the electro-optic medium 106 appears, to an observer viewing the display through
the substrate 102, white or black depending upon whether the top conductive layer
104 is positive or negative relative to the backplane at any point within the final
display. The electro-optic medium 106 may alternatively comprise a plurality of colored
particles in addition to black and/or white particles, for example, each color having
a respective charge polarity and strength.
[0029] A layer of lamination adhesive 108 may be coated over the electro-optic medium layer
106, and a release layer 110 may be applied over the adhesive layer 108. The release
layer 110 may be a PET film, for example, that is approximately 7 mil in thickness,
which may be provided with any appropriate release coating, for example a silicone
coating. The presence of this lamination adhesive layer affects the electro-optic
characteristics of the displays. In particular, the electrical conductivity of the
lamination adhesive layer affects both the low temperature performance and the resolution
of the display. The low temperature performance of the display may be improved by
increasing the conductivity of the lamination adhesive layer, for example by doping
the layer with tetrabutylammonium hexafluorophosphate or other materials as described
in
U.S. Patent Nos. 7,012,735 and
7,173,752. The FPL may optionally include a thin second conductive layer, preferably of aluminum,
between the release sheet 110 and the laminate adhesive 108 that may be removed with
the release sheet 110. The second conductive layer may be used for testing of the
electro-optic medium.
[0031] Referring now to Figures 2A to 2C, a schematic of a direct-drive backplane 200 is
illustrated. The backplane 200, similar to the FPL 100, may include a plurality of
layers that may be flexible. The underlying substrate may be formed from an ablatable
polymeric material, such as a polyimide, for example. The substrate may also include
other optional layers such as a reflective/moisture barrier. Any method known by those
of skill in the art may be used to fabricate a backplane for use in the lamination
processes and laminated displays of the present invention, such as
U.S. Patent 7,223,672.
[0032] There are three main categories of backplanes: an active matrix, a passive matrix,
and a direct drive backplane. Any type of backplane may be used in the various embodiments
of the present invention in order to provide a top plane connection within the perimeter
of the laminate.
[0033] For an active matrix backplane, an array of thin film transistors (TFT) are formed
on the surface of a substrate and each transistor acts as a switch for a pixel. The
TFT is addressed by a set of narrow multiplexed electrodes (gate lines and source
lines). A pixel is addressed by applying voltage to a gate line that switches the
TFT on and allows a charge from the source line to flow on to the rear electrode.
This sets up a voltage across the pixel and turns it on.
[0034] Passive-matrix backplanes use a simple grid to supply the charge to a particular
pixel on the display. The grids are formed on top and bottom substrates. One substrate
forms the "columns" and the other substrate forms the "rows". The wiring of the column
or rows is made from a transparent conductive material, usually indium-tin oxide (ITO).
The rows or columns are connected to integrated circuits that control when a charge
is sent down a particular column or row.
[0035] In the direct-drive backplane 200, the bottom substrate 202 may include an electrical
connector 204 located on an edge of the substrate 202 from which a plurality of conductors
206, 207, 208 extends. Any method known by those of skill in the art may be used to
trace the conductors 206, 207, 208 onto the surface of the substrate 202, such as
plating methods. Among the plurality of conductors, one of the conductors 206 is used
to form the top plane connection with the top conductive layer of the FPL. According
to various embodiments of the invention, the conductor 206 used to form the top plane
connection may include a cut-out 214, which will be described in greater detail below.
[0036] The substrate 202 of the direct drive backplane 200 will then be coated with an insulating
layer 210, as illustrated in Figure 2B. The insulating layer 210 is preferably made
from a dielectric material, such as silicon nitride, an insulating polymer, or cross-linkable
monomer or oligomer. The insulating layer 210 is applied to cover a majority of the
conductive material, while leaving the end portions of the conductors 206, 207, 208
exposed. A segmented conductive layer 212a, 212b is then applied over the conductors
207, 208 that will not form part of the top plane connection, as illustrated in Figure
2C. The segmented conductive layers 212a, 212b are applied such that each segment
is electrically connected to a respective conductor 207, 208, which may be achieved
by leaving an area of insulating material 210 between the segments 212a, 212b. The
conductive layer is also applied in a manner that will avoid an electrical connection
with conductor 206, which will form part of the top plane connection. For example,
the conductive layer 212b may be applied such that a boundary of insulating layer
210 will remain between the conductor 206 and the conductive layer 212b, as illustrated
in Figure 2C.
[0037] Assembly of an electro-optic display using FPL 100 may be effected by removing the
release sheet 110 and contacting the adhesive layer 108 with the backplane 200 under
conditions effective to cause the adhesive layer 108 to adhere to the backplane 200,
thereby securing the adhesive layer 108, layer of electro-optic medium 106 and electrically-conductive
top layer 104 to the backplane 200, and then cut into pieces of any size needed for
use with specific backplanes. However, referring to Figures 2C and 2D, the backplane
200 and FPL 100 must be laminated, such that the end of the conductor 206 is electrically
connected only to a specific area of the top conductive layer 104 that is exposed
through the adhesive layer 108, as illustrated in Figure 2D. Previously, this has
been achieved by either cutting away or cleaning the FPL to expose the specific section
of the top conductive layer that will contact the corresponding conductor in the backplane.
If the section in the FPL is cut and cleaned prior to lamination to the backplane,
the FPL must be precisely aligned to the backplane. This is especially difficult with
large displays, in particular when fabricating prototypes or custom displays without
alignment jigs. Alignment jigs are impractical for one-off, displays and may even
be impossible for some odd shaped displays. If the section in the FPL is made after
lamination, the cleaning process is likely to damage the top and/or backplane conductive
layer.
[0038] The process according to various embodiments of the present invention overcomes the
disadvantages in previous lamination techniques by utilizing a cut-out 214 that is
scored within the perimeter of an end portion of a conductor that forms a part of
the top plane connection. To produce a display module according to an embodiment of
the present invention, the FPL must first be laminated to a backplane having a cut-out.
The FPL can be cut larger than the final display size and could even be a continuous
sheet as in a roll-to-roll process. This allows for coarse tolerances in alignment
of the FPL and backplane, which is especially helpful for large displays. Once laminated,
the display can be cut to its final size, potentially using alignment marks or pins
on the backplane to allow for precisely aligning the cut to the backplane. As illustrated
in Figures 3A to 3C, the cut-out 214 in the rear surface of the backplane 200 may
form a tab or flap, so that the cut-out 214 may be easily removed post-lamination
of the backplane to the FPL. The cut-out may be provided in a variety of shapes, such
as rectangular, circular, etc., and any method know to those of skill in the art for
scoring a backplane material may be used, such as laser-cutting, for example. If the
backplane is made of glass, laser-cutting may be used, as well as other methods, such
as cutting or drilling with a diamond saw or drill, for example. If a diamond saw
is utilized, a rectangular-shaped tab may be made from two substantially parallel
cuts originating at the edge of the backplane, such as the tab 214 illustrated in
Figure 3E. Alternatively, the cuts may converge to form a tapered tab, similar to
a triangular or trapezoidal shape, for example. In a less preferred embodiment, a
hole may be drilled into the backplane and covered with a removable cover, such as
a sticker, having an area at least as large as the opening. The removable cover would
serve as the removable tab.
[0039] In other embodiment of the present invention, the cut-out 214 may be a segmented
circle and a slot 215 may be incorporated about the center of the segmented circle
214. The slot 215 may be dimensioned to receive a tool, such as a flat-head screwdriver,
for example, and the thin strips of material separating the segments of the circle
214 may be sufficiently thin, such that rotation of the cut-out 214 with a tool will
cause the thin strips of material to break and allow removal of the cut-out 214 from
the substrate 202. The cut-out 214 may be divided into any number of segments, preferably
at least two, and the slot 215 may be any shape that is able to mate with a tool.
For example, the slot 215 may be in the form of a cross to accommodate a Philips screwdriver
or a hexagon to accommodate an Allen wrench.
[0040] The lamination of the FPL to the backplane may advantageously be carried out by vacuum
lamination. Vacuum lamination is effective in expelling air from between the two materials
being laminated, thus avoiding unwanted air bubbles in the final display; such air
bubbles may introduce undesirable artifacts in the images produced on the display.
However, vacuum lamination of the two parts of an electro-optic display in this manner
imposes stringent requirements upon the lamination adhesive used, especially in the
case of a display using an encapsulated electrophoretic medium. The lamination adhesive
should have sufficient adhesive strength to bind the electro-optic layer to the backplane,
and in the case of an encapsulated electrophoretic medium, the adhesive should also
have sufficient adhesive strength to mechanically hold the capsules together. The
adhesive is preferably chemically compatible with all the other materials in the display.
If the electro-optic display is to be of a flexible type, the adhesive should have
sufficient flexibility not to introduce defects into the display when the display
is flexed. The lamination adhesive should have adequate flow properties at the lamination
temperature to ensure high quality lamination. Furthermore, the lamination temperature
is preferably as low as possible. An example of a useful lamination adhesive that
may be incorporated in the various embodiments of the present invention an aqueous
polyurethane dispersion known as a "TMXDI/PPO" dispersion, as described in
U.S. Patent Application Publication No. 2005/0107564.
[0041] Referring now to Figures 4 to 7, a process for making a top plane connection according
to one embodiment of the present invention will now be described. Figures 4 to 7 are
a partial schematic cross-section along axis I-I of Figure 3A. As illustrated in Figure
4, the cut-out 214 in the substrate 202 of the backplane was incorporated prior to
formation of the conductor 206.
[0042] As a result of the plating operation to form the conductor 206, the material of the
conductor 206 fills the space between the cut-out 214 and the substrate 202. Therefore,
it is preferred to form the cut-out 214 prior to forming the conductors 206, as best
shown in Figure 7, in order to increase the surface contact area of the portion of
the conductor that will form the top plane connector. It is also preferred to provide
a cut-out 214 in the form of a tab, for example, rather than a through-hole in the
substrate 202 to provide a backing for the FPL during the lamination process and reduce
the likelihood of forming a divot or deformation in the surface of the FPL over the
area of the through-hole.
[0043] After the lamination step, the cut-out 214 may be removed, as illustrated in Figure
5. Because the adhesive layer 108 is laminated to the substrate 202, removal of the
cut-out 214 will also result in removal in the section of the adhesive layer 108.
Therefore, removal of the cut-out 214 will accomplish a substantial portion of the
cleaning required to expose the top conductive layer 104. In order to expose the top
conductive layer 104, a solvent may be used in a manual or automated cleaning process
to expose a portion of the electro-optic medium 106 within the boundary of the through-hole,
as illustrated in Figure 6. The solvent should be selected that will dissolve the
electro-optic layer without damaging the top conductive layer. The size of the cut-out
should be selected, such that sufficient space is provided following its removal to
allow for ease and efficiency of cleaning and to maximize the surface area for electrical
contact with the overlying conductor.
[0044] Once the top conductive layer 104 is exposed, a conductive material 216 may be filled
in the open space to electrically connect the conductor 206 to the top conductive
layer 104, thus forming the top plane connection. The conductive material may be any
conductive filler known to those of skill in the art, such as a silver or carbon filled
epoxy. In a final step, an insulating barrier (not shown) may be applied over any
conductive filler by laminating or dispensing a thin layer of insulating material
over an area that is at least as large as the area of the conductive filler on the
exposed side of the backplane.
[0045] In another embodiment of the present invention, a double-sided backplane may be incorporated
into the laminate. A double-sided backplane differs from the backplane illustrated
in Figures 4 to 7 in that the material used to the form the conductor for the top
plane connection may be printed on both sides of the backplane substrate. As illustrated
in the example of Figure 8, the material used to form the conductor 206 has been printed
on both sides of the substrate 202, such that the conductor 206 will cover generally
the entirety of the through-hole formed after removal of the cut-out. The remaining
steps of the top plane connection process will be the same as those described above.
By using a double-sided backplane, the surface area of the conductor is larger relative
to the embodiment illustrated in Figures 4 to 7. This allows for more connection surface
area between the conductor in the backplane and the conductive fill material which
will be dispensed into the plated through-hole via.
[0046] A double sided backplane, similar to a single sided backplane, may be produced by
known PCB or flex-PCB techniques as well as by screen printing. The extra screen printing
step, where conductor material is applied to the bottom side of the substrate around
the cut-out would add extra area for making the top plane connection thereby improving
the overall display reliability.
[0047] Another embodiment comprising a double sided backplane is illustrated in Figure 9.
For certain configurations of screen printed backplanes, for example, the through-hole
created by removing the cut-out to form the top plane connection may not be ideally
sized, such that it may simultaneously be used as a conductive via. The embodiment
illustrated in Figure 9 instead provides two separate pathways through the substrate
202, one conductive via 220 for the conductor 206, which is screen printed on both
sides of the substrate 202 and covered with an insulating layer 210, as well as one
through-hole filled with conductive material 216 to from the top plane connection
between the conductor 206 and the top conductive layer 104. In this embodiment, the
laminate may include a plurality of vias to ensure connectivity between the screen
printed conductors on either side of the backplane substrate and the conductive layer
on the walls of the through-hole for the top plane connection is not necessary.
[0048] Thus, the various embodiments of the present invention simplify the production of
custom large area displays where alignment jigs and other equipment are not available
for precision aligned lamination. It also makes possible the use of roll-to-roll production
of displays using continuous rolls of FPL and backplane. The electrical connection
between the top conductive layer and the backplane will be robust and reliable due
to the relatively large area of exposed top conductive layer. For architectural applications
of electro-optic displays that require large and sometimes unique coverage areas,
small volume orders can be made with high yield, especially in applications in which
the TPC cannot be hidden behind a bezel or frame and must be small. The small TPC
provided using the process according various embodiments of the invention may be highly
desirable in such applications.
1. A method of forming an electro-optic display comprising:
forming a front plane laminate (100) comprising, in this order, a first substrate
(102), a first conductive layer (104), a layer of electro-optic medium (106), and
an adhesive (108), the first substrate (102) and first conductive layer (104) being
transparent; and
coating an insulating layer (210) and a second conductive layer (212b) onto a second
substrate (202) comprising a plurality of conductors (204, 206, 207, 208) to provide
a backplane (200);
the method being characterized by:
scoring the second substrate (202) to form a removable portion (214);
laminating the front plane laminate (100) to the backplane (200);
removing the removable portion (214) from the second substrate (202) to provide an
opening in the backplane (200); and
filling the opening with a conductive material (216) to provide an electrical connection
between the first conductive layer (104) and one (206) of the plurality of conductors
(204, 206, 207, 208).
2. The method of claim 1, wherein the removable portion (214) in the second substrate
(202) is scored in proximity to the one conductor (206).
3. The method of claim 1, wherein the scoring step occurs prior to coating the second
substrate (202) with the insulating layer (210) and the second conductive layer (212b).
4. The method of claim 1, wherein the removing step exposes at least one of the electro-optic
medium (106) and the adhesive (108) within the opening.
5. The method of claim 4 further comprising removing at least some of the electro-optic
medium (106) and adhesive (108) within the opening after the laminating step to expose
the first conductive layer (104).
6. The method of claim 1, wherein the removable portion (214) of the second substrate
(202) is in the form of a flap.
7. The method of claim 1, wherein the second conductive layer (212b) is applied to two
opposing surfaces of the second substrate (202).
8. The method of claim 1, wherein the removable portion (214) is removed prior to the
laminating step.
9. The method of claim 8, wherein the one conductor (206) is plated onto the surface
of the opening prior to coating the second substrate (202) with the insulating layer
(210) and the second conductive layer (212b).
10. An electro-optic display made according to the method of claim 1.
1. Verfahren zur Bildung einer elektrooptischen Anzeige, umfassend:
Bilden eines Frontebenenlaminats (100), das in dieser Reihenfolge ein erstes Substrat
(102), eine erste leitfähige Schicht (104), eine Schicht aus elektrooptischem Medium
(106) und einen Klebstoff (108) umfasst, wobei das erste Substrat (102) und die erste
leitfähige Schicht (104) transparent sind; und
Beschichten eines zweiten Substrats (202), das eine Vielzahl von Leitern (204, 206,
207, 208) umfasst, mit einer Isolierschicht (210) und einer zweiten leitfähigen Schicht
(212b), um eine Rückwand (Backplane) (200) bereitzustellen;
wobei das Verfahren gekennzeichnet ist durch:
Ritzen des zweiten Substrats (202), um einen entfernbaren Anteil (214) zu bilden;
Laminieren des Frontebenenlaminats (100) auf die Backplane (200);
Entfernen des entfernbaren Anteils (214) von dem zweiten Substrat (202), um eine Öffnung
in der Backplane (200) bereitzustellen; und
Füllen der Öffnung mit einem leitfähigen Material (216), um eine elektrische Verbindung
zwischen der ersten leitfähigen Schicht (104) und einem (206) von der Vielzahl der
Leiter (204, 206, 207, 208) bereitzustellen.
2. Verfahren nach Anspruch 1, wobei der entfernbare Anteil (214) in dem zweiten Substrat
(202) in der Nähe des einen Leiters (206) geritzt wird.
3. Verfahren nach Anspruch 1, wobei der Ritzschritt vor dem Beschichten des zweiten Substrats
(202) mit der Isolierschicht (210) und der zweiten leitfähigen Schicht (212b) stattfindet.
4. Verfahren nach Anspruch 1, wobei der Entfernungsschritt mindestens eines von dem elektrooptischen
Medium (106) und dem Klebstoff (108) innerhalb der Öffnung exponiert.
5. Verfahren nach Anspruch 4, des Weiteren umfassend Entfernen von mindestens einem Teil
des elektrooptischen Mediums (106) und des Klebstoffs (108) innerhalb der Öffnung
nach dem Laminierungsschritt, um die erste leitfähige Schicht (104) zu exponieren.
6. Verfahren nach Anspruch 1, wobei der entfernbare Anteil (214) des zweiten Substrats
(202) in Form einer Lasche vorliegt.
7. Verfahren nach Anspruch 1, wobei die zweite leitfähige Schicht (212b) auf zwei gegenüber
liegende Oberflächen des zweiten Substrats (202) appliziert wird.
8. Verfahren nach Anspruch 1, wobei der entfernbare Anteil (214) vor dem Laminierungsschritt
entfernt wird.
9. Verfahren nach Anspruch 8, wobei der eine Leiter (206) auf die Oberfläche der Öffnung
plattiert wird, bevor das zweite Substrat (202) mit der Isolierschicht (210) und der
zweiten leitfähigen Schicht (212b) beschichtet wird.
10. Elektrooptische Anzeige, die gemäß dem Verfahren nach Anspruch 1 gefertigt ist.
1. Procédé de formation d'un affichage électro-optique comprenant :
la formation d'un stratifié de plan avant (100) comprenant, dans cet ordre, un premier
substrat (102), une première couche conductrice (104), une couche de milieu électro-optique
(106), et un adhésif (108), le premier substrat (102) et la première couche conductrice
(104) étant transparents ; et
le revêtement d'une couche isolante (210) et d'une seconde couche conductrice (212b)
sur un second substrat (202) comprenant une pluralité de conducteurs (204, 206, 207,
208) pour fournir un plan arrière (200) ;
le procédé étant caractérisé par :
le découpage du second substrat (202) pour former une partie amovible (214) ;
la stratification du stratifié de plan avant (100) sur le plan arrière (200) ;
le retrait de la partie amovible (214) du second substrat (202) pour ménager une ouverture
dans le plan arrière (200) ; et
le remplissage de l'ouverture avec un matériau conducteur (216) pour fournir une connexion
électrique entre la première couche conductrice (104) et un conducteur (206) de la
pluralité de conducteurs (204, 206, 207, 208).
2. Procédé selon la revendication 1, dans lequel la partie amovible (214) dans le second
substrat (202) est découpée à proximité du conducteur (206).
3. Procédé selon la revendication 1, dans lequel l'étape de découpage a lieu avant le
revêtement du second substrat (202) avec la couche isolante (210) et la seconde couche
conductrice (212b).
4. Procédé selon la revendication 1, dans lequel l'étape de retrait fait apparaître le
milieu électro-optique (106) et/ou l'adhésif (108) à l'intérieur de l'ouverture.
5. Procédé selon la revendication 4 consistant en outre à retirer au moins une partie
du milieu électro-optique (106) et de l'adhésif (108) à l'intérieur de l'ouverture
après l'étape de stratification pour faire apparaître la première couche conductrice
(104).
6. Procédé selon la revendication 1, dans lequel la partie amovible (214) du second substrat
(202) a la forme d'un rabat.
7. Procédé selon la revendication 1, dans lequel la seconde couche conductrice (212b)
est appliquée à deux surfaces opposées du second substrat (202).
8. Procédé selon la revendication 1, dans lequel la partie amovible (214) est retirée
avant l'étape de stratification.
9. Procédé selon la revendication 8, dans lequel le conducteur (206) est plaqué sur la
surface de l'ouverture avant de revêtir le second substrat (202) avec la couche isolante
(210) et la seconde couche conductrice (212b).
10. Affichage électro-optique fabriqué selon le procédé selon la revendication 1.