CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of
U.S. Provisional Application No. 62/747,175, filed October 18, 2018,
U.S. Provisional Application No. 62/769,026, filed November 19, 2018, and also claims the benefit of Chinese Patent Application No.
201910433205.1, filed May 23, 2019.
BACKGROUND
Technical Field
[0002] Embodiments of the present disclosure relate to an electronic device, and in particular
they relate to an electronic device with a sensing function, a tiled electronic apparatus
having the same, and an operating method of the same.
Description of the Related Art
[0003] Light-emitting diodes (LEDs) have been widely used in various electronic devices.
However, the application of electronic devices still cannot meet demands.
SUMMARY
[0004] In accordance with some embodiments of the present disclosure, an electronic device
is provided. The electronic device includes a substrate and the electronic device
also includes a light-emitting element, a sensing element and a black matrix disposed
on the substrate. The sensing element is disposed adjacent to the light-emitting element.
The black matrix has a plurality of openings and a light-shielding portion. The electronic
device further includes a driving element disposed adjacent to and electrically connected
to the light-emitting element. The sensing element includes a first thin-film transistor
(TFT), and the driving element includes a second thin-film transistor. In a normal
direction of the substrate, one of the openings is disposed corresponding to the sensing
element, and the light-shielding portion is disposed corresponding to the driving
element.
[0005] In accordance with some embodiments of the present disclosure, a tiled electronic
apparatus is provided. The tiled electronic apparatus includes a plurality of electronic
devices. One of the electronic devices has a display region and includes a substrate,
a plurality of light-emitting elements and a plurality of sensing elements. The plurality
of light-emitting elements is disposed on the substrate and disposed in the display
region. The plurality of sensing elements is disposed in the display region and disposed
adjacent to the plurality of light-emitting elements.
[0006] In accordance with some embodiments of the present disclosure, an operating method
of an electronic device is provided. The electronic device includes a first sensing
element and a second sensing element. The operating method of the electronic device
includes emitting a first signal using an emitter. The operating method of the electronic
device also includes receiving the first signal by the first sensing element and executing
a first action by the electronic device. The operating method of the electronic device
further includes emitting a second signal using the emitter. The operating method
of the electronic device includes receiving the second signal by the second sensing
element and executing a second action by the electronic device. The first signal is
different from the second signal, and the first action is different from the second
action.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Aspects of the embodiments of the present disclosure can be understood from the following
detailed description when read with the accompanying figures. It should be noted that,
in accordance with the standard practice in the industry, various features are not
drawn to scale. In fact, the dimensions of the various features may be arbitrarily
increased or reduced for clarity of discussion.
FIG. 1 is a partial cross-sectional view illustrating an electronic device according
to one embodiment of the present disclosure.
FIG. 2 is a partial cross-sectional view illustrating an electronic device according
to another embodiment of the present disclosure.
FIG. 3 is a partial cross-sectional view illustrating an electronic device according
to one embodiment of the present disclosure.
FIG. 4 is a partial cross-sectional view illustrating an electronic device according
to another embodiment of the present disclosure.
FIG. 5 is a schematic diagram illustrating the duty cycle of the light-emitting element
according to one embodiment of the present disclosure.
FIG. 6 is a partial cross-sectional view illustrating an electronic device according
to one embodiment of the present disclosure.
FIG. 7 is a partial top view illustrating an electronic device according to another
embodiment of the present disclosure.
FIG. 8 is a partial cross-sectional view illustrating an electronic device according
to another embodiment of the present disclosure.
FIG. 9 is a partial cross-sectional view illustrating an electronic device according
to another embodiment of the present disclosure.
FIG. 10 is a partial cross-sectional view illustrating the sensing element according
to one embodiment of the present disclosure.
FIG. 11 is a partial cross-sectional view illustrating the sensing element according
to another embodiment of the present disclosure.
FIG. 12 is a partial cross-sectional view illustrating the sensing element according
to still another embodiment of the present disclosure.
FIG. 13 is a partial cross-sectional view illustrating an electronic device according
to one embodiment of the present disclosure.
FIG. 14 is a partial cross-sectional view illustrating an electronic device according
to another embodiment of the present disclosure.
FIG. 15 is a partial cross-sectional view illustrating a tiled electronic apparatus
according to one embodiment of the present disclosure.
FIG. 16 is a block diagram of an operating method of an electronic device.
DETAILED DESCRIPTION
[0008] The following disclosure provides many different embodiments, or examples, for implementing
different features of the subject matter provided. Specific examples of components
and arrangements are described below to simplify the present disclosure. These are,
of course, merely examples and are not intended to be limiting. For example, a first
feature is formed on a second feature in the description that follows may include
embodiments in which the first feature and second feature are formed in direct contact,
and may also include embodiments in which additional features may be formed between
the first feature and second feature, so that the first feature and second feature
may not be in direct contact. In addition, the present disclosure may repeat reference
numerals and/or letters in the various examples. This repetition is for the purpose
of simplicity and clarity and does not in itself dictate a relationship between the
various embodiments and/or configurations discussed.
[0009] Furthermore, spatially relative terms, such as "beneath," "below," "lower," "on,"
"above," "upper" and the like, may be used herein for ease of description to describe
one element or feature's relationship to other elements or features as illustrated
in the figures. The spatially relative terms are intended to encompass different orientations
of the device in use or operation in addition to the orientation depicted in the figures.
The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations)
and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0010] In the present disclosure, the terms "about," "approximately" and "substantially"
typically mean +/-20% of the stated value, more typically +/-10% of the stated value,
more typically +/-5% of the stated value, more typically +/-3% of the stated value,
more typically +/-2% of the stated value, more typically +/-1% of the stated value
and even more typically +/-0.5% of the stated value. The stated value of the present
disclosure is an approximate value. That is, when there is no specific description
of the terms "about," "approximately" and "substantially", the stated value includes
the meaning of "about," "approximately" or "substantially".
[0011] Some variations of the embodiments are described. Throughout the various views and
illustrative embodiments, like reference numbers are used to designate like elements.
It should be understood that additional operations can be provided before, during,
and after the method, and some of the operations described can be replaced or eliminated
for other embodiments of the method.
[0012] It should be noted that the "electronic device" described in the embodiments may
be a display device, a sensing device, an antenna device, a tiled device, a flexible
device, any other applicable device, or a combination thereof, but the present disclosure
is not limited thereto.
[0013] FIG. 1 is a partial cross-sectional view illustrating an electronic device 100 according
to one embodiment of the present disclosure. It should be noted that not all components
of the electronic device 100 are shown in FIG. 1, for the sake of brevity.
[0014] Referring to FIG. 1, the electronic device 100 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. In this embodiment, the light-emitting
element 20, the sensing element 30 and the black matrix 40 are all disposed on the
substrate 10. The sensing element 31 is disposed adjacent to the light-emitting element
20, and the black matrix 41 may cover the top surface 10T of the substrate 10. In
some embodiments, the black matrix 41 does not overlap the light-emitting element
20 in the normal direction N of the substrate 10. In some embodiments, the black matrix
41 does not overlap the sensing element 31 in the normal direction N of the substrate
10. However, the present disclosure is not limited thereto.
[0015] In some embodiments, the substrate 10 may be a rigid substrate or a flexible substrate,
and the substrate 10 may be a single-layer structure or a multi-layer structure. For
example, the substrate 10 may include a printed circuit board (PCB), and the material
of the substrate 10 may include glass, quartz, sapphire or any other applicable rigid
material, or polyimide (PI), polyethylene terephthalate (PET or PETE), poly(methyl
methacrylate) (PMMA) or any other applicable flexible material or a combination thereof.
In some embodiments, the material of the substrate 10 may include liquid-crystal polymer
(LCP), polycarbonate (PC), polypropylene (PP), other plastic or polymeric materials
or a combination thereof, but the present disclosure is not limited thereto.
[0016] In some embodiments, the substrate 10 may include an elementary semiconductor (e.g.,
silicon or germanium), a compound semiconductor (e.g., silicon carbide (SiC), gallium
arsenic (GaAs), indium arsenide (InAs), or indium phosphide (InP)), an alloy semiconductor
(e.g., silicon germanium (SiGe), silicon germanium carbide (SiGeC), gallium arsenic
phosphide (GaAsP), or gallium indium phosphide (GaInP)), any other applicable semiconductor,
or a combination thereof. In some embodiments, the substrate 10 may be a semiconductor-on-insulator
(SOI) substrate. The SOI substrate may include a bottom substrate, an insulating layer
disposed on the bottom substrate, and a semiconductor layer disposed on the insulating
layer. In some embodiments, the substrate 10 may include a semiconductor wafer (e.g.,
a silicon wafer, or any other applicable semiconductor wafer). However, the present
disclosure is not limited thereto.
[0017] In some embodiments, the substrate 10 may include various p-type doped regions and/or
n-type doped regions formed by a process such as an ion implantation process and/or
a diffusion process. For example, the doped regions may be configured to form a transistor,
a photodiode, and/or a light-emitting diode, but the present disclosure is not limited
thereto.
[0018] In some embodiments, the substrate 10 may include various isolation features to separate
various device regions in the substrate 10. For example, the isolation features may
include a shallow trench isolation (STI) feature, but the present disclosure is not
limited thereto. In some embodiments, the formation of the STI feature may include
etching a trench in the substrate 10 and filling in the trench with insulating materials
(e.g., silicon oxide, silicon nitride, or silicon oxynitride). The filled trench may
have a multi-layer structure, such as an oxide layer and silicon nitride filled in
the trench. A chemical mechanical polishing (CMP) process may be performed to polish
back excessive insulating materials and planarize the top surface of the isolation
features.
[0019] In some embodiments, the substrate 10 may include various conductive features (e.g.,
conductive lines or vias). For example, the conductive features may be made of aluminum
(Al), copper (Cu), tungsten (W), an alloy thereof, any other applicable conductive
material, or a combination thereof.
[0020] The light-emitting element 20 is disposed on the substrate 10. In some embodiments,
the light-emitting element 20 may include lamps, bulbs, light-emitting diodes (LEDs),
quantum dots (QDs), fluorescent material, phosphor material, any other applicable
luminescent material, or a combination thereof, but the present disclosure is not
limited thereto. In some embodiments, examples of light-emitting diodes may include
an organic light-emitting diode (OLED), a quantum dots light-emitting diode (QLED
or QDLED), a micro light-emitting diode, a mini light-emitting diode, or a combination
thereof, but the present disclosure is not limited thereto.
[0021] In some embodiments, the light-emitting element 20 may include, for example, electrodes,
semiconductor layers, multiple quantum wells or wavelength conversion layers, and
so on, but the present disclosure is not limited thereto. For example, the light-emitting
element 20 may include a first light-emitting chip 21 (e.g., blue light-emitting chip),
a second light-emitting chip 23 (e.g., green light-emitting chip), a third light-emitting
chip 25 (e.g., red light-emitting chip), and the first light-emitting chip 21, the
second light-emitting chip 23 and the third light-emitting chip 25 may be formed in
a package structure 27. For example, the light-emitting element 20 (at least one of
the first light-emitting chip 21, the second light-emitting chip 23 and the third
light-emitting chip 25) is encapsulated by a package material to form the package
structure 27, but the present disclosure is not limited thereto. It should be noted
that the number and the type of the light-emitting chips included in the light-emitting
element 20 are not limited to those shown in FIG. 1. For example, in some embodiments,
the light-emitting element 20 may also include a fourth light-emitting chip 21 (e.g.,
white light-emitting chip, green light-emitting chip, yellow light-emitting chip,
and so on).
[0022] The sensing element 31 is disposed on the substrate 10. In this embodiment, the sensing
element 31 is disposed adjacent to the first light-emitting chip 21, the second light-emitting
chip 23 and/or the third light-emitting chip 25, and is also formed in the package
structure 27. For example, the light-emitting element 20 (at least one of the first
light-emitting chip 21, the second light-emitting chip 23 and the third light-emitting
chip 25) and the sensing element 31 are encapsulated by a package material to form
the package structure 27, but the present disclosure is not limited thereto. The sensing
element 31 may be a light-sensing element, such as a photodiode and/or any other applicable
element, which may convert the received light signal into a current signal.
[0023] As shown in FIG. 1, the sensing element 31 is used to sense ambient light L entering
(the package structure 27 of) the electronic device 100. When a user touches or approaches
the surface of (the package structure 27 of) the electronic device 100 with a finger
or another part of the body, the light intensity is weakened due to the influence
of the user's finger (or another part of the body) on the ambient light L, so the
sensing element 31 may sense a change of light intensity entering the electronic device
100, thereby determining that the user is touching or approaching the position of
(the package structure 27 of) the electronic device 100 with the finger or another
part of the body, or further executing a specific action in response. Therefore, the
electronic device 100 may be used to display information or further serve an interactive
function similar to that in the touch display device, which will be described in detail
later.
[0024] In some embodiments, the user does not have to touch or approach the electronic device
100 with a finger or another part of the body, and an emitter (not shown) may be used
to emit light, which has a wavelength that can be received by the sensing element
31, to the electronic device 100, so the sensing element 31 may sense the light emitted
by the emitter and entering the electronic device 100, thereby determining the position
of the light emitted by the emitter pointing to the electronic device 100, or further
executing a specific action in response to serve an interactive function. For example,
the emitter may be an infrared (IR) pen or a LASER (light amplification by stimulated
emission of radiation) pen, and the sensing element 31 may sense infrared ray or LASER
ray, but the present disclosure is not limited thereto.
[0025] In some embodiments, the electronic device 100 may further include a display unit,
a logic board (e.g., timing controller (T-con)) (not shown), a system board (not shown)
and a display control board (not shown). In some embodiments, the substrate 10, the
light-emitting element 20, the sensing element 31 and the black matrix 41 may be disposed
in the display unit. In some embodiments, the logic board may be electrically connected
to the display unit and the system board. When the sensing element receives a signal,
the signal may be transmitted to the logic board; the logic board may process the
signal sensed by the sensing component 31 (e.g., identifying the location) and transmit
the processing result to the system board. In some embodiments, the display control
board may be electrically connected to the system board and the display unit. For
example, when the system board receives the processing result from the logic board,
the system board determines an instruction corresponding to the processing result
according to the processing result of the logic board (for example, executing a specific
action), and transmits the instruction to the display control board; then, the display
control board controls the display unit to execute the corresponding action according
to the received instruction. However, the present disclosure is not limited thereto.
Other applicable operating methods may be used in the electronic device in the embodiments
of the present disclosure.
[0026] In some embodiments, the black matrix 41 is disposed on the substrate 10. In this
embodiment, the black matrix 41 may cover a portion of the top surface 10T of the
substrate 10. For example, as shown in FIG. 1, the black matrix 41 may have a plurality
of openings 411 and a light-shielding portion 412. The openings 411 may be disposed
corresponding to the package structure 27, and the light-shielding portion 412 does
not overlap the package structure 27 in the normal direction N of the substrate 10,
but the present disclosure is not limited thereto. In some embodiments, the light-shielding
portion 412 may be in contact with the package structure 27, but the present disclosure
is not limited thereto. In some embodiments, a gap may be between the light-shielding
portion 412 and the package structure 27, but the present disclosure is not limited
thereto. Since the substrate 10 may include other routing, the routing may reflect
the ambient light L and affect the sensing element 31 sensing the light entering the
electronic device 100. Therefore, the accuracy of the sensing element 31 may be improved
by providing the light-shielding portion 412.
[0027] In some embodiments, the material of the black matrix 41 may include photoresist
(e.g., black photoresist, or other applicable photoresist which is not transparent),
ink (e.g., black ink, or other applicable ink which is not transparent), molding compound
(e.g., black molding compound, or other applicable molding compound which is not transparent),
solder mask (e.g., black solder mask, or other applicable solder mask which is not
transparent), epoxy polymer, any other applicable material, or a combination thereof,
but the present disclosure is not limited thereto. In some embodiments, the material
of the black matrix 41 may include a light curing material, a thermal curing material,
or a combination thereof, but the present disclosure is not limited thereto. In some
embodiments, the black matrix 41 may be formed by an etching process, a coating process,
or a deposition process.
[0028] FIG. 2 is a partial cross-sectional view illustrating an electronic device 102 according
to another embodiment of the present disclosure. Similarly, not all components of
the electronic device 102 are shown in FIG. 2, for the sake of brevity.
[0029] Referring to FIG. 2, the electronic device 102 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. In this embodiment, the light-emitting
element 20, the sensing element 31 and the black matrix 41 are all disposed on the
substrate 10. The sensing element 31 is disposed adjacent to the light-emitting element
20, and the black matrix 41 may cover the top surface 10T of the substrate 10. In
some embodiments, the black matrix 41 does not overlap the light-emitting element
20 in the normal direction N of the substrate 10. In some embodiments, the black matrix
41 does not overlap the sensing element 31 in the normal direction N of the substrate
10.
[0030] In this embodiments, the light-emitting element 20 may include a first light-emitting
chip 21, a second light-emitting chip 23, a third light-emitting chip 25, and the
first light-emitting chip 21, the second light-emitting chip 23 and the third light-emitting
chip 25 may be formed in a package structure 27'. The difference from the electronic
device 100 shown in FIG. 1 is that the sensing element 31 of the electronic device
102 is formed between the package structures 27', not formed in the package structures
27'. Moreover, as shown in FIG. 2, the black matrix 41 may have a plurality of openings
411 and a light-shielding portion 412. The openings 411 may be disposed corresponding
to the package structure 27' and the sensing element 31, and the light-shielding portion
412 does not overlap the package structure 27' and the sensing element 31 in the normal
direction N of the substrate 10, but the present disclosure is not limited thereto.
In some embodiments, the light-shielding portion 412 may be in contact with the package
structure 27' and/or the sensing element 31, but the present disclosure is not limited
thereto. In some embodiments, a gap may be between the light-shielding portion 412
and the package structure 27' and/or the sensing element 31, but the present disclosure
is not limited thereto.
[0031] Similarly, the sensing element 31 may be used to sense ambient light L entering the
electronic device 102. When a user touches or approaches the surface of the electronic
device 102 with a finger or another part of the body, the light intensity is weakened
due to the influence of the user's finger (or another part of the body) on the ambient
light L, so the sensing element 31 may sense a change of light intensity entering
the electronic device 102, thereby determining that the user is touching or approaching
the position of the electronic device 102 with the finger or another part of the body,
or further executing a specific action in response. Moreover, when an emitter (e.g.,
IR pen, LASER pen, and so on) emits light, which has a wavelength that can be received
by the sensing element 31, to the electronic device 102, the sensing element 31 may
sense the light emitted by the emitter and entering the electronic device 102, thereby
determining the position of the light emitted by the emitter pointing to the electronic
device 102, or further executing a specific action in response to serve an interactive
function. Thus, the electronic device 102 may be used to display information or to
serve an interactive function.
[0032] FIG. 3 is a partial cross-sectional view illustrating an electronic device 104 according
to one embodiment of the present disclosure. Similarly, not all components of the
electronic device 104 are shown in FIG. 3, for the sake of brevity.
[0033] Referring to FIG. 3, the electronic device 104 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. In this embodiment, the electronic
device 104 further includes a cover layer 51 and an adhesion layer 61.
[0034] As shown in FIG. 3, the light-emitting element 20 is disposed on the substrate 10,
and the light-emitting element 20 may include a first light-emitting chip 21, a second
light-emitting chip 23 and a third light-emitting chip 25; the sensing element 31
is disposed adjacent to the first light-emitting chip 21, the second light-emitting
chip 23 and/or the third light-emitting chip 25, and the first light-emitting chip
21, the second light-emitting chip 23, the third light-emitting chip 25 and the sensing
element 31 may be formed in a package structure 27.
[0035] The cover layer 51 may be disposed on the light-emitting element 20. That is, the
cover layer 51 may be disposed corresponding to the substrate 10. In some embodiments,
the cover layer 51 may be a rigid substrate or a flexible substrate, and the cover
layer 51 may be a single-layer structure or a multi-layer structure. For example,
the material of the cover layer 51 may include glass, quartz, sapphire or any other
applicable rigid material, or polyimide (PI), polyethylene terephthalate (PET or PETE),
poly(methyl methacrylate) (PMMA) or any other applicable flexible material or a combination
thereof, but the present disclosure is not limited thereto. In some embodiments, the
material of the cover layer 51 may include liquid-crystal polymer (LCP), polycarbonate
(PC), polypropylene (PP), other plastic or polymeric materials or a combination thereof,
but the present disclosure is not limited thereto.
[0036] In some embodiments, the cover layer 51 may have, for example, a function of water-proof
or dust-proof, and so on, which may reduce the risk of the electronic device 104 being
damaged or reducing the accuracy of the sensing element 31 by the user's touch for
a long time, and further may protect the electronic device 104 or extend the life
of the electronic device 104.
[0037] In some embodiments, the cover layer 51 may be a resistive or capacitive touch screen.
For example, when the cover layer 51 is a capacitive touch screen, the cover layer
51 may include a base layer, an upper transparent electrode layer disposed on the
top surface of the base layer and/or a lower transparent electrode layer disposed
on the bottom surface of the base layer, or a scratch-resistant layer may be disposed
on the upper transparent electrode layer, but the present disclosure is not limited
thereto. In some embodiments, the electronic device 104 may include any suitable touch
structure to serve the touch function, and the touch structure may be disposed on
any surface of the electronic device 104, but the present disclosure is not limited
thereto.
[0038] The adhesion layer 61 may be disposed between the substrate 10 and the cover layer
51, and cover the package structure 27 (i.e., cover the light-emitting element 20
and the sensing element 31). In some embodiments, the material of the adhesion layer
61 may include silicone polymer, transparent photoresist, polyimide, epoxy resin,
any other applicable material, or a combination thereof, but the present disclosure
is not limited thereto. In some embodiments, the material of the adhesion layer 61
may include a light curing material, a thermal curing material or a combination thereof.
For example, a spin-on coating process, a slit coating process or an inkjet printing
process may be performed to coat the material of the adhesion layer 61 on the substrate
10 and the package structure 27, but the present disclosure is not limited thereto.
[0039] The black matrix 41 is disposed on the cover layer 51. In particular, the black matrix
41 may be disposed on the bottom surface 51B of the cover layer 51 facing the top
surface 10T of the substrate 10 as shown in FIG. 3. In some embodiments, the black
matrix 41 may have a plurality of openings 411 and a light-shielding portion 412.
The openings 411 may be disposed corresponding to the package structure 27, and the
light-shielding portion 412 does not overlap the package structure 27 in the normal
direction N of the substrate 10, but the present disclosure is not limited thereto.
[0040] In some embodiments, the electronic device 104 may further include a radiating element
53, and the radiating element 53 may be disposed on the sidewall 51S of the cover
layer 51. The radiating element 53 may be used to emit light having the wavelength
that can be received by the sensing element 31. For example, the radiating element
53 may be used to emit light having the wavelength in the range of invisible light,
such as infrared light (wavelength at about 760 nm to 1 mm) or ultraviolet light (wavelength
at about 10 nm to 400 nm), but the present disclosure is not limited thereto.
[0041] The light emitted by the radiating element 53 may form a total reflection in the
cover layer 51. When a user touches the top surface 51T of the cover layer 51 with
a finger or another part of the body, the (partial) light emitted by the radiating
element 53 may be reflected and directed toward the sensing element 31, thereby determining
that the user is touching the position of the cover layer 51 with the finger or another
part of the body, or further executing a specific action in response.
[0042] In some embodiments, the suitable material of the cover layer 51 may be selected
depending on the wavelength of the light emitted by the radiating element 53 and the
extent to which the material absorbs for the above wavelength. For example, when the
wavelength of light emitted by the radiating element 53 is shorter (higher energy),
the material having less light absorption of short wavelengths (e.g., sapphire, or
the like) may be selected to form the cover layer 51; when the wavelength of light
emitted by the radiating element 53 is longer (lower energy), the material having
less light absorption of long wavelengths (e.g., plastic material, polymer, or the
like) may be selected to form the cover layer 51, but the present disclosure is not
limited thereto.
[0043] FIG. 4 is a partial cross-sectional view illustrating an electronic device 106 according
to another embodiment of the present disclosure. Similarly, not all components of
the electronic device 106 are shown in FIG. 4, for the sake of brevity.
[0044] Referring to FIG. 4, the electronic device 106 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. In this embodiment, the electronic
device 106 further includes a cover layer 51 and an adhesion layer 61. The light-emitting
element 20 is disposed on the substrate 10, the cover layer 51 is disposed on the
light-emitting element 20 (i.e., the cover layer 51 may be disposed corresponding
to the substrate 10), and the adhesion layer 61 is disposed between the substrate
10 and the cover layer 51 and covers the light-emitting element 20 and the sensing
element 31.
[0045] As shown in FIG. 4, the light-emitting element 20 may include a first light-emitting
chip 21, a second light-emitting chip 23 and a third light-emitting chip 25, and the
first light-emitting chip 21, the second light-emitting chip 23 and the third light-emitting
chip 25 may be formed in a package structure 27'. The difference from the electronic
device 104 shown in FIG. 3 is that the sensing element 31 of the electronic device
106 is formed between the package structures 27', not formed in the package structure
27'.
[0046] The black matrix 41 is disposed on the cover layer 51. In particular, the black matrix
41 may be disposed on the bottom surface 51B of the cover layer 51 facing the top
surface 10T of the substrate 10 as shown in FIG. 4. In some embodiments, the black
matrix 41 may have a plurality of openings 411 and a light-shielding portion 412.
The openings 411 may be disposed corresponding to the package structure 27' and the
sensing element 31, and the light-shielding portion 412 does not overlap the package
structure 27' and the sensing element 31 in the normal direction N of the substrate
10, but the present disclosure is not limited thereto.
[0047] Similarly, the electronic device 106 may further include a radiating element 53,
and the radiating element 53 may be disposed on the sidewall 51S of the cover layer
51. The radiating element 53 may be used to emit light having the wavelength that
can be received by the sensing element 31. For example, the radiating element 53 may
be used to emit light having the wavelength in the range of invisible light, such
as infrared light (wavelength at about 760 nm to 1 mm) or ultraviolet light (wavelength
at about 10 nm to 400 nm), but the present disclosure is not limited thereto.
[0048] In the foregoing embodiments, the sensing component 31 includes a photo sensing function
that may be used to sense the change of light received by the electronic devices 100,
102, 104, 106, thereby determining relevant position information or further executing
a specific action in response. In some embodiments, the sensing element 31 may be
used to sense the intensity of the ambient light, thereby causing the light-emitting
element 20 to adjust the intensity of light emitted by the light-emitting element
20 according to the intensity of the sensed ambient light (e.g., executing light compensation).
Alternatively, the sensing element 31 may also be used to sense the intensity change
of the light emitted by the light-emitting element 20 (or the degree of light attenuation
of the light-emitting element 20), thereby adjusting the current intensity passing
through the light-emitting element 20. For example, adjusting the current intensity
passing through the first light-emitting chip 21, the second light-emitting chip 23
or the third light-emitting chip 25 to maintain good display quality, but the present
disclosure is not limited thereto.
[0049] In some embodiments, the sensing element 31 may also include a thermal sensing function
that may be used to sense temperature changes of the light-emitting element 20 or
the entire electronic device 100, 102, 104 or 106, and to make corresponding processing.
For example, when the temperature of the light-emitting element 20 or the entire electronic
device 100, 102, 104 or 106 is too high, the sensing element 31 may sense this phenomenon
and cause the electronic device 100, 102, 104 or 106 to execute corresponding processing.
For example, the cooling system inside the electronic device is activated or the current
passing through the light-emitting element 20 is adjusted, but the present disclosure
is not limited thereto.
[0050] In addition, in the foregoing embodiments, the electronic devices 100, 102, 104,
and 106 all include the sensing component 31, but the present disclosure is not limited
thereto. In some embodiments, the light-emitting element 20 itself may function as
a sensing element without the need to provide additional sensing elements.
[0051] FIG. 5 is a schematic diagram illustrating the duty cycle of the light-emitting element
20 according to one embodiment of the present disclosure. As shown in FIG. 5, in the
period P1, the light emitting element 20 emits light normally; in the period P2, the
light-emitting element 20 may function as a sensing element (e.g., the light-emitting
element 20 may stop emitting light) for sensing the position of the user touching
or approaching the electronic device 100, 102, 104 or 106 with a finger or another
part of the body, or sensing the position of the light having the wavelength that
may be received by the sensing element 31 and emitted by the emitter toward the electronic
device 100, 102, 104 or 106.
[0052] In some embodiments, the period P1 and the period P2 may be alternately presented
as shown in FIG. 5, and the frequency of the period P1 (i.e., the number of times
of illumination of the light-emitting element 20 per unit time) may be 60 Hz, but
the present disclosure is not limited thereto. In other embodiments, the frequency
of the period P1 may be 120 Hz or 240 Hz. When the frequency of the period P1 is high
enough, the viewer may be prevented from interfering with the information displayed
on the electronic device 100, 102, 104 or 106, and the viewing quality may be maintained.
[0053] Similarly, the frequency of the period P2 (i.e., the number of times the light-emitting
element 20 is used as the sensing element per unit time) may be 60 Hz, but the present
disclosure is not limited thereto. In other embodiments, the frequency of the period
P2 may be 120 Hz or 240 Hz. When the frequency of the period P2 is high enough, the
accuracy of the sensing may be further improved.
[0054] Moreover, although the number of occurrences of the period P1 and the number of occurrences
of the period P2 are the same in FIG. 5, that is, the ratio of occurrence of the period
P1 to occurrence of the period P2 is 1:1, the present disclosure is not limited thereto.
In some embodiments, the number of occurrences of the period P1 and the number of
occurrences of the period P2 may be different. For example, the ratio of the occurrence
of the period P1 to the occurrence of the period P2 may be 1:2 or 1:3, depending on
actual needs. In detail, the light-emitting element 20 may function as a sensing element
during the period P2. In some embodiments, during the period in which the light-emitting
element 20 does not emit light (e.g., between two adjacent periods PI), a plurality
of periods P2 may be included, and the frequency of the period P2 may be larger than
the frequency of the period P1, but the present disclosure is not limited thereto.
[0055] Furthermore, although the foregoing embodiment has been described with the light-emitting
element 20 as the sensing element for at least part of the period of time during which
no light is emitted, the present disclosure is not limited thereto. In some embodiments,
during the period P2, the light-emitting element 20 may emit another light signal
as a sensing signal, such as a light (e.g., invisible light) having the wavelength
that can be received by the light-emitting element 20 or other additionally provided
sensing elements (e.g., sensing element 31), for sensing the position of the user
touching or approaching the electronic device 100, 102, 104 or 106 with a finger or
another part of the body.
[0056] For example, during the period P2, the light-emitting element 20 emits a sensing
signal. When a user touches or approaches the electronic device 100, 102, 104 or 106
with a finger or another part of the body, the sensing signal may be reflected back
to the light-emitting element 20 or other additionally provided sensing elements (e.g.,
sensing element 31), thereby detecting the position of the user's finger, or another
part of the body, that is touching or approaching the electronic device 100, 102,
104 or 106.
[0057] FIG. 6 is a partial cross-sectional view illustrating an electronic device 108 according
to one embodiment of the present disclosure. Similarly, not all components of the
electronic device 108 are shown in FIG. 6, for the sake of brevity.
[0058] Referring to FIG. 6, the electronic device 108 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. In this embodiment, the light-emitting
element 20, the sensing element 31 and the black matrix 41 are all disposed on the
substrate 10, and the sensing element 31 is disposed adjacent to the light-emitting
element 20.
[0059] As shown in FIG. 6, the light-emitting element 20 may include a first light-emitting
chip 21, a second light-emitting chip 23 and a third light-emitting chip 25, and the
first light-emitting chip 21, the second light-emitting chip 23 and the third light-emitting
chip 25 may be formed in a package structure 27', and the sensing element 31 of the
electronic device 108 may be formed between the package structures 27', not formed
in the package structure 27'. The difference from the electronic device 102 shown
in FIG. 2 is that the electronic device 108 may further include a radiating element
55 that may be disposed outside the package structure 27' and disposed adjacent to
the sensing element 31. For example, the radiating element 55 may be formed between
the package structures 27'.
[0060] The radiating element 55 may be used to emit light having the wavelength that can
be received by the sensing element 31. For example, the radiating element 55 may be
used to emit light having the wavelength in the range of invisible light, such as
infrared light (wavelength at about 760 nm to 1 mm) or ultraviolet light (wavelength
at about 10 nm to 400 nm), but the present disclosure is not limited thereto.
[0061] When a user touches or approaches the electronic device 108 with a finger or another
part of the body, the (partial) light emitted by the radiating element 55 may be reflected
and directed toward the sensing element 31, thereby allowing the sensing element 31
to sense the position of the user's finger or another part of the body that is touching
or approaching the electronic device 108.
[0062] In some embodiments, the sensing element 31 may detect different signals at different
times. For example, during the emission of the light from the radiating element 55,
the sensing element 31 may detect the light emitted by the radiating element 55 being
reflected by the user's finger or another part of the body, thereby detecting the
position of the user's finger or another part of the body that is touching or approaching
the electronic device 108; during other periods, the sensing element 31 may detect
ambient light or light emitted by the light-emitting element 20 to, for example, adjust
the current passing through the light-emitting element 20, but the present disclosure
is not limited thereto.
[0063] In this embodiment, the black matrix 41 may have a plurality of openings 411 and
a light-shielding portion 412. The openings 411 may be, for example, disposed corresponding
to the light-emitting element 20, the sensing element 31 and the radiating element
55, and the light-shielding portion 412 may cover a portion of the top surface 10T
of the substrate 10. For example, the black matrix 41 does not overlap the light-emitting
element 20, the sensing element 31 and the radiating element 55 in the normal direction
N of the substrate 10, but the present disclosure is not limited thereto. In some
embodiments, the light-shielding portion 412 may be in contact with the package structure
27', the sensing element 31 and/or the radiating element 55, but the present disclosure
is not limited thereto. In some embodiments, a gap may be between the light-shielding
portion 412 and the package structure 27', the sensing element 31 and/or the radiating
element 55, but the present disclosure is not limited thereto.
[0064] FIG. 7 is a partial top view illustrating an electronic device 110 according to another
embodiment of the present disclosure. Similarly, not all components of the electronic
device 110 are shown in FIG. 7, for the sake of brevity.
[0065] Referring to FIG. 7, the electronic device 110 includes a substrate 10, a light-emitting
element 20, a sensing element 31, a black matrix 41 and a radiating element 55. In
this embodiment, the light-emitting element 20, the sensing element 31, the black
matrix 41 and a radiating element 55 are all disposed on the substrate 10.
[0066] In this embodiment, the light-emitting element 20 may include a first light-emitting
chip 21, a second light-emitting chip 23 and a third light-emitting chip 25, and the
first light-emitting chip 21, the second light-emitting chip 23 and the third light-emitting
chip 25 may be formed in a package structure 27'. As shown in FIG. 7, the black matrix
41 may have a plurality of openings 411 and a light-shielding portion 412. The openings
411 may be, for example, disposed corresponding to the light-emitting element 20 (the
package structure 27'), the sensing element 31 and the radiating element 55, and the
light-shielding portion 412 may cover a portion of the top surface of the substrate
10. For example, the black matrix 41 does not overlap the light-emitting element 20,
the sensing element 31 and the radiating element 55 in the normal direction N of the
substrate 10 (i.e., the top view shown in Figure 7).
[0067] In some embodiments, a plurality of sensing elements 31 and a plurality of radiating
elements 55 may be alternately arranged around a plurality of package structures 27'
(e.g., disposed between the plurality of package structures 27'), but the present
disclosure is not limited thereto. The number and the arrangement of the sensing element
31 and the radiating element 55 may be adjusted depending on actual needs.
[0068] FIG. 8 is a partial cross-sectional view illustrating an electronic device 112 according
to another embodiment of the present disclosure. Similarly, not all components of
the electronic device 112 are shown in FIG. 8, for the sake of brevity.
[0069] Referring to FIG. 8, the electronic device 112 includes a substrate 10, a light-emitting
element 20, a sensing element 31, a black matrix 41, a cover layer 51 and an adhesion
layer 61. The light-emitting element 20 and the sensing element 31 are disposed on
the top surface 10T of the substrate 10, the cover layer 51 is disposed on the light-emitting
element 20 and disposed corresponding to the substrate 10, the black matrix 41 is
disposed on the cover layer 51, and the adhesion layer 61 is disposed between the
substrate 10 and the cover layer 51 and covers the light-emitting element 20 and the
sensing element 31.
[0070] As shown in FIG. 8, the light-emitting element 20 may include a first light-emitting
chip 21, a second light-emitting chip 23 and a third light-emitting chip 25, and the
sensing element 31 is disposed adjacent to the light-emitting element 20. The difference
from the foregoing embodiments is that the first light-emitting chip 21, the second
light-emitting chip 23 and the third light-emitting chip 25 are not formed in a package
structure, but are directly disposed on the substrate 10 in the form of chip on board
(COB). In the example where the electronic device 112 is a display device, the chips
of the light-emitting elements 20 may be arranged in this manner to increase the resolution
of the electronic device 112.
[0071] It should be noted that the form of chip on board (COB) may also be applied to the
electronic device 100 shown in FIG. 1, the electronic device 102 shown in FIG. 2,
the electronic device 104 shown in FIG. 3, the electronic device 106 shown in FIG.
4, the electronic device 108 shown in FIG. 6, the electronic device 110 shown in FIG.
7 or other electronic devices not shown in the embodiments of the present disclosure,
which are not described herein.
[0072] FIG. 9 is a partial cross-sectional view illustrating an electronic device 114 according
to another embodiment of the present disclosure. Similarly, not all components of
the electronic device 114 are shown in FIG. 9, for the sake of brevity.
[0073] Referring to FIG. 9, the electronic device 114 includes a substrate 10, a light-emitting
element 20, a sensing element 31 and a black matrix 41. The light-emitting element
20, the sensing element 31 and the black matrix 41 are all disposed on the substrate
10. In some embodiments, the electronic device 114 may include an active driving circuit
or a passive driving circuit, but the present disclosure is not limited thereto. In
some embodiments, the active driving circuit or the passive driving circuit may be,
for example, used to drive the light-emitting element 20, but the present disclosure
is not limited thereto. The active driving circuit may include a driving element 37,
and the driving element 37 is disposed adjacent to the light-emitting element 20 and
electrically connected to the light-emitting element 20 for driving the light-emitting
element 20 (e.g., driving the light-emitting element 20 to emit light or other signals).
[0074] In some embodiments, the black matrix 41 may have a plurality of openings 411 and
a light-shielding portion 412. In the normal direction N of the substrate 10, the
openings 411 may be disposed corresponding to the sensing element 31 and the light-emitting
element 20, and the light-shielding portion 412 is disposed on a portion of the top
surface 10T of the substrate 10. For example, the light-shielding portion 412 may
be disposed corresponding to the driving element 37. It should be noted that the light-shielding
portion 412 may also shield a portion of the sensing elements 31 (e.g., the source
317 and the drain 319 of the sensing element 31 shown in FIG. 10).
[0075] As shown in FIG. 9, in this embodiment, the sensing element 31 and the driving element
37 includes thin-film transistors (TFTs). FIG. 10 is a partial cross-sectional view
illustrating the sensing element 31 according to one embodiment of the present disclosure.
As shown in FIG. 10, the sensing element 31 may be a bottom-gate thin-film transistor
(TFT), which includes a gate 311, a gate insulating layer 313, a semiconductor layer
315, a source 317, and a drain 319. The gate 311 is disposed on the substrate 10;
the gate insulating layer 313 is disposed on the gate 311, and a portion of the gate
insulating layer 313 may cover the top surface 10T of the substrate 10; the semiconductor
layer 315 is disposed on the gate insulating layer 313; the source 317 and the drain
319 are disposed on the semiconductor layer 315 and are respectively disposed on opposite
sides of the semiconductor layer 315 (i.e., the source 317 and the drain 319 do not
completely cover the semiconductor layer 315), but the present disclosure is not limited
thereto.
[0076] In some embodiments, the material of the semiconductor layer 315 may include low
temperature poly-silicon (LTPS), indium gallium zinc oxide (IGZO), amorphous silicon
(a-Si), any other applicable material or a combination thereof, but the present disclosure
is not limited thereto.
[0077] Similarly, the sensing element 31 may be used to sense ambient light L entering the
electronic device 114. When a user touches or approaches the surface of the electronic
device 114 with a finger or another part of the body, the light intensity is weakened
due to the influence of the user's finger (or another part of the body) on the ambient
light L, so the sensing element 31 may sense a change of light intensity entering
the electronic device 114, thereby determining that the user is touching or approaching
the position of the electronic device 114 with the finger or another part of the body,
and in some embodiments, further executing a specific action in response. Moreover,
when an emitter (e.g., IR pen, LASER pen, and so on) emits light, which has a wavelength
that can be received by the sensing element 31, to the electronic device 114, the
sensing element 31 may sense the light emitted by the emitter and entering the electronic
device 114, thereby determining the position of the light emitted by the emitter pointing
to the electronic device 114, and in some embodiments, further executing a specific
action in response to serve an interactive function. Thus, the electronic device 114
may be used to display information or to serve an interactive function.
[0078] In some embodiments, the driving element 37 may have a structure similar to the sensing
element 31, but the material of the semiconductor layer in the driving element 37
may be the same as or different from the material of the semiconductor layer in the
sensing element 31. Referring to FIG. 9 and FIG, 10, in the normal direction N of
the substrate 10, the opening 411 of the black matrix 41 is disposed corresponding
to (the semiconductor layer 315 of) the sensing element 31 (i.e., the opening 411
of the black matrix 41 partially overlaps (the semiconductor layer 315 of) the sensing
element 31); the light-shielding portion 412 of the black matrix 41 is disposed corresponding
to the driving element 37 (i.e., light-shielding portion 412 of the black matrix 41
partially overlaps the driving element 37), but the present disclosure is not limited
thereto. The opening 411 of the black matrix 41 allows (the semiconductor layer 315
of) the sensing element 31 to sense a signal (e.g., ambient light L or light emitted
by the emitter), thereby determining relevant information or further executing a specific
action in response.
[0079] As shown in FIG. 9, in some embodiments, the electronic device 114 may further include
a sensing element switch 39, and the sensing element switch 39 may be disposed adjacent
to the sensing element 31. For example, the sensing element switch 39 includes a thin
film transistor (TFT), and the sensing element switch 39 may have a structure similar
to the sensing element 31 or the driving element 37; the light-shielding portion 412
of the black matrix 41 is disposed corresponding to the sensing element switch 39,
that is, the black matrix 41 overlaps the sensing element switch 39 in the normal
direction N of the substrate 10, but the present disclosure is not limited thereto.
[0080] FIG. 11 is a partial cross-sectional view illustrating the sensing element 31' according
to another embodiment of the present disclosure. The sensing element 31' shown in
FIG. 11 may be used to replace the sensing element 31 shown in FIG. 10 and disposed
in the electronic device 114 of FIG. 9. Similarly, the driving element 37 and the
sensing element switch 39 shown in FIG. 9 may have the structure similar to the sensing
element 31' shown in FIG. 11 or may have any other applicable structure, but the present
disclosure is not limited thereto. In some embodiments, the material of the semiconductor
layer in the driving element 37 and the material of the semiconductor layer in the
sensing element switch 39 may be the same as or different from the material of the
semiconductor layer in the sensing element 31'. As shown in FIG. 11, the sensing element
31' may be a top-gate thin-film transistor (TFT), which includes a gate 311, a gate
insulating layer 313, a semiconductor layer 315, a source 317, and a drain 319. In
this embodiment, the sensing element 31' may further include a reflective layer 312
and an insulating layer 318. It should be noted that the thin film transistor structures
shown in FIG. 10 and FIG. 11 are merely examples, and the present disclosure is not
limited thereto.
[0081] As shown in FIG. 11, in this embodiment, the reflective layer 312 is disposed on
(the top surface 10T of) the substrate 10; the semiconductor layer 315, the source
317 and the drain 319 are disposed on the reflective layer 312; the gate insulating
layer 313 is disposed on the semiconductor layer 315; the gate 311 is disposed on
the gate insulating layer 313; the insulating layer 318 partially overlaps the gate
311, and a portion of the insulating layer 318 is in contact with the gate insulating
layer 313, but the present disclosure is not limited thereto. In another embodiment
(not shown), the semiconductor layer 315 may be disposed on the substrate 10; the
gate insulating layer 313 may be disposed on the semiconductor layer 315; the gate
311 may be disposed on the gate insulating layer 313; the insulating layer 318 may
partially overlap the gate 311; the source 317 and the drain 319 are in contact with
the semiconductor layer 315 and are disposed on both sides of the gate 311 and on
the insulating layer 318.
[0082] FIG. 12 is a partial cross-sectional view illustrating the sensing element 32 according
to still another embodiment of the present disclosure. The sensing element 32 shown
in FIG. 12 may be used to replace the sensing element 31 shown in FIG. 10 and disposed
in the electronic device 114 of FIG. 9. As shown in FIG. 12, the sensing element 32
may be a PIN diode, which includes a P layer 321 composed of a P-type semiconductor
material, an N layer 323 composed of an N-type semiconductor material and an I layer
325 composed of a low-doped semiconductor material, and the I layer 325 is disposed
between the P layer 321 and the N layer 323, but the present disclosure is not limited
thereto.
[0083] It should be noted that the sensing elements (31, 31', 32) are disposed on (the top
surface 10T of) the substrate 10 in the foregoing embodiment, but the present disclosure
is not limited thereto. FIG. 13 is a partial cross-sectional view illustrating an
electronic device 116 according to one embodiment of the present disclosure; FIG.
14 is a partial cross-sectional view illustrating an electronic device 116 according
to another embodiment of the present disclosure. Similarly, not all components of
the electronic device 116 and the electronic device 118 are shown in FIG. 13 and FIG.
14, for the sake of brevity.
[0084] As shown in FIG. 13, in some embodiments, the black matrix 41 of the electronic device
116 may be disposed on the top surface 51T of the cover layer 51, the sensing element
31 may be disposed on the bottom surface 51B of the cover layer 51, and at least a
portion of the sensing element 31 may be disposed corresponding to the opening 411
of the black matrix 41. Alternatively, as shown in FIG. 14, in some embodiments, the
black matrix 41 and the sensing element 31 of the electronic device 118 may be disposed
on the bottom surface 51B of the cover layer 51, and the black matrix 41 at least
partially covers the sensing element 31, but the present disclosure is not limited
thereto. As long as it does not affect the way sensing element 31 is sensed, it may
be applied to the embodiments of the present disclosure, and no further description
is provided here.
[0085] FIG. 15 is a partial cross-sectional view illustrating a tiled electronic apparatus
1 according to one embodiment of the present disclosure. Similarly, not all components
of the tiled electronic apparatus 1 are shown in FIG. 15, for the sake of brevity.
[0086] In some embodiments, the tiled electronic apparatus 1 may include a plurality of
electronic devices 150. For example, the electronic device 150 may have a structure
similar to the electronic device 100, 102, 104, 106, 108, 110, 112, 114, 116 or 118
in the foregoing embodiments. The following is an example in which each of the electronic
devices 150 has a structure similar to the structure of the electronic device 114,
whose partial cross-section may be referred to FIG. 9, but the present disclosure
is not limited thereto.
[0087] In this embodiment, each electronic device 150 includes a substrate 10, a plurality
of light-emitting elements 20, and a plurality of sensing elements 31. As shown in
FIG. 15, the electronic device 150 has a display region 152, and the plurality of
light-emitting elements 20 is disposed in the display region 152. The plurality of
light-emitting elements 20 is disposed on the substrate 10, and the plurality of sensing
elements 31 may be, for example, disposed adjacent to the plurality of light-emitting
elements 20. For example, the sensing elements 31 may be disposed between the light-emitting
elements 20.
[0088] In some embodiment, the sensing element 31 includes a thin-film transistor (TFT)
structure as shown in FIG. 10 (or FIG. 11). In some embodiments, the electronic device
150 may further include a plurality of driving elements 37 (referring to FIG. 9),
and the driving elements 37 may be disposed adjacent to the light emitting elements
20 and/or the sensing elements 31. In some embodiments, the drive element 37 is similar
to the sense element 31 that includes a thin film transistor (TFT) structure, and
the driving element 37 is electrically connected to the light-emitting element 20
for driving the light-emitting element 20 (e.g., driving the light-emitting element
20 to emit light or other signals). In some embodiments, the driving element 37 may
be disposed between the light-emitting elements 20, or the driving element 37 may
be partially disposed under the light-emitting element 20. That is, the driving element
37 and the light-emitting element 20 may partially overlap in the normal direction
N of the substrate 10, but the present disclosure is not limited thereto.
[0089] In some embodiments, the electronic device 150 may further include a plurality of
radiating element 55 each disposed outside the light-emitting element 20 and disposed
adjacent to the sensing element 31. For example, the radiating elements 55 may be
formed between the light-emitting elements 20 and/or alternately arranged with the
sensing elements 31, but the present disclosure is not limited thereto.
[0090] In some embodiments, the electronic device 150 may further include a black matrix
41, and the black matrix 41 may have a plurality of openings 411 and a light-shielding
portion 412. As shown in FIG. 15, in the normal direction N of the substrate 10 (i.e.,
the top view shown in Figure 15), the openings 411 may be disposed corresponding to
the light-emitting element 20, the sensing element 31 and the radiating element 55.
The light-shielding portion 412 of the black matrix 41 may cover a portion of the
top surface of the substrate 10. For example, the light-shielding portion 412 does
not overlap the light-emitting element 20, the sensing element 31 and the radiating
element 55 in the normal direction N of the substrate 10. For example, the light-shielding
portion 412 of the black matrix 41 may be disposed corresponding to the driving elements
37.
[0091] Since the opening 411 of the black matrix 41 may be disposed corresponding to the
sensing element 31 (and the emitting element 55), when a user touches or approaches
the surface of the tiled electronic apparatus 1 with a finger or another part of the
body, the sensing element 31 may sense a change in light intensity entering the tiled
electronic apparatus 1, thereby allowing the sensing element 31 to sense the position
of the user's finger or another part of the body that is touching or approaching the
tiled electronic apparatus 1, and in some embodiments, further executing a specific
action in response. Moreover, when an emitter (e.g., IR pen, LASER pen, and so on)
emits light, which has a wavelength that can be received by the sensing element 31,
to the tiled electronic apparatus 1, the sensing element 31 may sense the light emitted
by the emitter and entering the tiled electronic apparatus 1, thereby determining
the position of the light emitted by the emitter pointing to the tiled electronic
apparatus 1, and in some embodiments, further executing a specific action in response
to serve an interactive function. Thus, the tiled electronic apparatus 1 may be used
to display information or to serve an interactive function.
[0092] In some embodiments, the electronic device 150 may further include a cover layer
(not shown in FIG. 15, which may refer to the cover layer 51 shown in FIG. 3, FIG.
4 or FIG. 8), and the cover layer may be disposed on the light-emitting element 20.
In some embodiments, the sensing element 31 may also be disposed on the cover layer,
but the present disclosure is not limited thereto.
[0093] FIG. 16 is a block diagram of an operating method of an electronic device. It should
be noted that some steps in FIG. 16 may be omitted, for the sake of brevity. In this
embodiment, the electronic device may include, for example, the electronic device
100 shown in FIG. 1, the electronic device 102 shown in FIG. 2, the electronic device
104 shown in FIG. 3, the electronic device 106 shown in FIG. 4, the electronic device
108 shown in FIG. 6, the electronic device 110 shown in FIG. 7, the electronic device
112 shown in FIG. 8, the electronic device 114 shown in FIG. 9, the electronic device
116 shown in FIG. 13, the electronic device 118 shown in FIG. 14 or the tiled electronic
apparatus 1 shown in FIG. 15.
[0094] In addition, in this embodiment, the electronic device may include a first sensing
element and a second sensing element, and the first sensing element and the second
sensing element may include, for example, the sensing element 31 or the sensing element
31', but the present disclosure is not limited thereto. In some embodiments, the first
sensing element and the second sensing element may be the same, or the first sensing
element and the second sensing element may be different. Hereinafter, the first sensing
element and the second sensing element are described as the sensing element 31 or
the sensing element 31' for an example. That is, the first sensing element and the
second sensing element include thin-film transistors (TFTs), but the present disclosure
is not limited thereto.
[0095] In step S1, an emitter emits a first signal. The emitter is, for example, an IR pen
or LASER pen, and the first signal may be the light emitted by the emitter (e.g.,
infrared or LASER light), but the present disclosure is not limited thereto.
[0096] In step S3, the first sensing element receives the first signal, and the electronic
device executes a first action (e.g., responding to the first signal). In some embodiments,
the first action is to enable the electronic device to display a first display screen,
and the first display screen may display the pointing position of the first signal,
that is, the position of the light emitted by the emitter on the electronic device,
but the present disclosure is not limited thereto.
[0097] In step S5, the emitter emits a second signal. In some embodiments, the second signal
is different from the first signal. For example, the first signal and the second signal
may have different frequencies, the first signal and the second signal may have different
light source intensities, or the first signal and the second signal have different
wavelengths, but the present disclosure is not limited thereto.
[0098] In step S7, the second sensing element receives the second signal, and the electronic
device executes a second action (e.g., responding to the second signal). In this embodiment,
the second action is different from the first action. For example, the second action
is to enable the electronic device to display a second display screen, and the second
display screen is different from the first display screen. In some embodiments, the
second display screen may include an instruction menu, but the present disclosure
is not limited thereto.
[0099] It should be noted that the first sensing element and the second sensing element
described herein may be the same sensing element at the same position, or may be two
sensing elements at different positions.
[0100] Through the foregoing steps S1 to S7, the user may simply implement the function
of the mouse on the electronic device through the emitter. That is, the electronic
device or the tiled electronic apparatus having the sensing function according to
the embodiments of the present disclosure may be used to display information or to
serve an interactive function.
[0101] The foregoing outlines features of several embodiments so that those skilled in the
art may better understand the aspects of the present disclosure. Those skilled in
the art should appreciate that they may readily use the present disclosure as a basis
for designing or modifying other processes and structures for carrying out the same
purposes and/or achieving the same advantages of the embodiments introduced herein.
Those skilled in the art should also realize that such equivalent constructions do
not depart from the spirit and scope of the present disclosure, and that they may
make various changes, substitutions, and alterations herein without departing from
the spirit and scope of the present disclosure. Therefore, the scope of protection
should be determined through the claims. In addition, although some embodiments of
the present disclosure are disclosed above, they are not intended to limit the scope
of the present disclosure.
[0102] Reference throughout this specification to features, advantages, or similar language
does not imply that all of the features and advantages that may be realized with the
present disclosure should be or are in any single embodiment of the disclosure. Rather,
language referring to the features and advantages is understood to mean that a specific
feature, advantage, or characteristic described in connection with an embodiment is
included in at least one embodiment of the present disclosure. Thus, discussions of
the features and advantages, and similar language, throughout this specification may,
but do not necessarily, refer to the same embodiment.
[0103] Furthermore, the described features, advantages, and characteristics of the disclosure
may be combined in any suitable manner in one or more embodiments. One skilled in
the relevant art will recognize, in light of the description herein, that the disclosure
can be practiced without one or more of the specific features or advantages of a particular
embodiment. In other instances, additional features and advantages may be recognized
in certain embodiments that may not be present in all embodiments of the disclosure.