BUILD MATERIAL HOPPER FOR 3D PRINTING SYSTEMS AND METHOD

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EP 3 642 015 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	01.03.2023 Bulletin 2023/09

(45)	Mention of the grant of the patent:
	25.01.2023 Bulletin 2023/04

(21)	Application number: 17929163.8

(22)	Date of filing: 18.10.2017

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International Patent Classification (IPC):

B29C 64/329^(2017.01)
B65D 88/28^(2006.01)
B65B 1/16^(2006.01)

B33Y 40/00^(2015.01)
B29C 31/02^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	B29C 31/02; B33Y 40/00; B29C 64/329; B29C 64/255; B65B 69/00

(86)	International application number:
	PCT/US2017/057221

(87)	International publication number:
	WO 2019/078856 (25.04.2019 Gazette 2019/17)

(54)	BUILD MATERIAL HOPPER FOR 3D PRINTING SYSTEMS AND METHOD BAUMATERIALBEHÄLTER FÜR 3D-DRUCK-SYSTEME UND METHOD TRÉMIE DE MATÉRIAU DE CONSTRUCTION POUR SYSTÈMES D'IMPRESSION 3D ET MÉTHODE

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(43)	Date of publication of application:
	29.04.2020 Bulletin 2020/18

(73)	Proprietor: Hewlett-Packard Development Company, L.P.
	Spring, TX 77389 (US)

(72)	Inventors:
	LAMBRIGHT, Terry Corvallis, Oregon 97330-4239 (US) SMITH, Kelly B Corvallis, Oregon 97330-4239 (US)

(74)	Representative: HGF
	HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)

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References cited: :

EP-A2- 1 162 140
US-A- 4 620 795
US-A1- 2005 074 550
US-A1- 2009 068 376
US-B2- 8 185 229

WO-A1-2004/035435
US-A- 5 437 820
US-A1- 2005 074 550
US-A1- 2016 311 167

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).