(19)
(11) EP 3 664 586 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
22.07.2020 Bulletin 2020/30

(43) Date of publication:
10.06.2020 Bulletin 2020/24

(21) Application number: 18209756.8

(22) Date of filing: 03.12.2018
(51) International Patent Classification (IPC): 
H05K 1/18(2006.01)
H05K 1/02(2006.01)
 H05K 3/00(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
2595 DA 's-Gravenhage (NL)

(72) Inventors:
  • DE KOK, Margaretha Maria
    2595 DA 's-Gravenhage (NL)
  • KUSTERS, Roel Henry Louis
    2595 DA 's-Gravenhage (NL)
  • VAN DELFT, Jan Pieter Hein
    2595 DA 's-Gravenhage (NL)
  • SCHRAM, Jeroen Franciscus Marinus
    2595 DA 's-Gravenhage (NL)
  • VAN DER WAAL, Adri
    2595 DA 's-Gravenhage (NL)
  • RUBINGH, Jan-Eric Jack Martijn
    2595 DA 's-Gravenhage (NL)
  • VAN DEN BRAND, Jeroen
    2595 DA 's-Gravenhage (NL)

(74) Representative: V.O. 
P.O. Box 87930 Carnegieplein 5
2508 DH Den Haag
2508 DH Den Haag (NL)

   


(54) DIFFERENTIAL HEATING IN THE MANUFACTURE OF A CURVED ELECTRONIC DEVICE


(57) A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11,12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L), and a surrounding area (12) of the substrate (13), outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).