(19)
(11) EP 3 669 398 A1

(12)

(43) Date of publication:
24.06.2020 Bulletin 2020/26

(21) Application number: 18910814.5

(22) Date of filing: 20.11.2018
(51) International Patent Classification (IPC): 
H01L 27/11551(2017.01)
H01L 27/11578(2017.01)
H01L 23/00(2006.01)
 H01L 27/11524(2017.01)
H01L 27/1157(2017.01)
H01L 23/522(2006.01)
(86) International application number:
PCT/US2018/062107
(87) International publication number:
WO 2019/182657 (26.09.2019 Gazette 2019/39)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 22.03.2018 US 201815928340
22.03.2018 US 201815928407

(71) Applicant: SanDisk Technologies LLC
Addison, Texas 75001 (US)

(72) Inventors:
  • MUSHIGA, Mitsuteru
    San Jose, CA 95119 (US)
  • NISHIDA, Akio
    San Jose, CA 95119 (US)
  • SUGIURA, Kenji
    San Jose, CA 95119 (US)
  • OTOI, Hisakazu
    San Jose, CA 95119 (US)
  • NISHIKAWA, Masatoshi
    San Jose, CA 95119 (US)

(74) Representative: Dehns 
St. Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BONDED CHIP ASSEMBLY WITH THROUGH-SUBSTRATE VIA STRUCTURES AND METHOD OF MAKING THE SAME