(19)
(11) EP 3 679 599 A1

(12)

(43) Date of publication:
15.07.2020 Bulletin 2020/29

(21) Application number: 18853638.7

(22) Date of filing: 10.09.2018
(51) International Patent Classification (IPC): 
H01L 21/822(2006.01)
H01G 4/232(2006.01)
H01L 21/8224(2006.01)
H01G 4/38(2006.01)
(86) International application number:
PCT/US2018/050142
(87) International publication number:
WO 2019/051346 (14.03.2019 Gazette 2019/11)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 08.09.2017 US 201715699654
06.11.2017 US 201715804515
22.12.2017 US 201715852799

(71) Applicant: Kemet Electronics Corporation
Fort Lauderdale, FL 33301 (US)

(72) Inventors:
  • BURK, James, A.
    Simpsonville SC 29681 (US)
  • BULTITUDE, John
    Simpsonville SC 29681 (US)
  • MILLER, Galen, W.
    Simpsonville SC 29681 (US)
  • MCCONNELL, John, E.
    Blountville TN 37617 (US)

(74) Representative: Goodman, Simon John Nye 
Reddie & Grose LLP The White Chapel Building 10 Whitechapel High Street
London E1 8QS
London E1 8QS (GB)

   


(54) HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES