[0001] This invention relates to the manufacture of a multilayer card body. In particular,
the invention relates to the manufacture of card bodies for portable data carriers
in the credit card or chip card format. Further, the invention relates to a card body,
manufactured according to the method. Besides, the invention relates to a separating
tool for separating card bodies from a multilayer laminated sheet. Furthermore, the
invention relates to an apparatus for manufacturing a card body.
[0002] Card-shaped portable data carriers in the credit card format are widespread. They
are used in particular as payment cards or identification cards or, in smaller formats,
as authentication cards or memory cards. Most of the cards are equipped with a magnetic
strip and/or a microprocessor as well as a data interface for reading devices which
enable data-processing tasks to be carried out with the help of the card.
[0003] By a common manufacturing method, the cards are thus constructed from a plurality
of layers which are interconnected by lamination. The layers typically consist of
polymers. Commonly used polymers are in particular PVC, polycarbonate or polymers
based on polyester. It is also known to manufacture cards from paper.
[0004] After laminating a number of at least two superposed layers into a laminated sheet,
the cards are cut, milled or punched out in a punching process. The cards produced
in this way have relatively weak mechanical properties as the side surface of the
cards is frequently pre-damaged by the punching process. Usually delamination of the
layers starts in the corners of the cards. That is why commonly, after punching the
cards out of the laminated sheet, a delamination test like a peel strength test is
carried out to determine if the layers at the side surface are pre-damaged or not.
After determining a pre-damage, the none laminated card material has to return to
the beginning of the manufacturing process and an adhesive is used for sealing the
card.
[0005] The object of the invention is to provide an improved method for manufacturing a
card having good mechanical properties and preferably offering an increased lifespan
and durability of the card. Further, it is to provide a corresponding card.
[0006] This object is achieved by a method for manufacturing a multilayer card body, a multilayer
card body manufactured by the method, a separating tool and an apparatus for manufacturing
a multilayer card body having the features of the independent claims. In the dependent
claims, advantageous embodiments and modifications are given.
[0007] According to one aspect of the invention, a method for manufacturing a multilayer
card body, in particular for a portable data carrier, is provided. The method has
the following steps:
- laminating together at least the first layer and the second layer to form a laminated
sheet,
- separating the multilayer card body from the laminated sheet, the multilayer card
body having a top surface, a bottom surface and a side surface, and
- sealing the side surface of the multilayer card body during the separating step or
as a step following the separating step, wherein no test for determining delamination
of the layers at the side surface is performed prior to the sealing step.
[0008] With the method according to the invention, a procedure to seal the side surface
of the card body is presented which increases the mechanical properties of the product
and the method could be integrated into the production flow which enables a faster
procedure as known in the state of the art. Further, returning the card to the beginning
of the manufacturing process as is done in the state of the art is omitted.
[0009] The manufactured cards can readily satisfy in particular the requirements set by
ISO 7810 and are advantageously suited for chip cards. Preferably, a cover layer of
polymers, preferably of PVC, is applied to at least one outer side of the card body
structure, and such cover layer or layers may be sealed together with the afore-mentioned
first and second layers.
[0010] Preferably, an adhesive, in particular an adhesive lacquer, is applied to at least
one side of at least one of the first and second layers for the step of lamination.
Further preferably, a graphical pattern is disposed to at least one side of at least
one of the first and second layers so that the graphical pattern points outwardly
and thus faces away from the first layer and second layer. Further preferably, at
least one of a third layer and fourth layer are disposed on at least one of the first
layer and second layer. The third layer and fourth layer may form cover layers of
the multilayer card body.
[0011] In a preferred embodiment, when sealing the side surface of the card body, the card
body is sealed from the side surface side such that delaminated layers at the side
surface are bonded together. As a result, the layers of the multilayer card body are
fixed together alongside the sealed side surface of the card body. In particular,
the side surface side of the card body is sealed circumferentially.
[0012] In a preferred embodiment, the side surface is sealed by generating heat in the side
surface, in particular ultrasonic-generated heat.
[0013] Preferably, a separating tool is adapted to generate the heat so that, as a consequence
of heat development, the side surface of the card body is sealed, by heated parts
of the separating tool. This allows performing both steps simultaneously, namely,
the step of separating and the step of sealing.
[0014] Alternatively, a separate heat source is adapted to generate the heat so that as
a consequence of heat development, the side surface of the card body is sealed by
means of the heat source. The heat source can be e.g. a heat lamp or a laser. This
allows performing the step of sealing as a step following the separating step without
performing a delamination test beforehand.
[0015] In a further preferred embodiment, the side surface is sealed by destroying and,
thereby, activating capsules which are present within or between at least one of the
first layer and second layer. This also allows performing both steps simultaneously,
namely, the step of separating and the step of sealing. Preferably, the capsules are
filled with an adhesive, wherein the adhesive is set free from the capsules at the
edge of the layers, due to the separating step. Preferably, destroying the capsules
is performed with the separating tool.
[0016] In a further preferred embodiment, the side surface is sealed by applying a sealing
material to the side surface. In doing so, sealing of the side surface is achieved
in an easy and cost-effective way. Preferably, the sealing material is an adhesive,
a varnish or a solvent that is applied to the side surface of the multilayer card
body. This allows performing the step of sealing as a step following the separating
step without performing a delamination test beforehand.
[0017] In a further preferred embodiment, the side surface is sealed by subjecting the side
surface to UV radiation or IR illumination. As a result, sealing of the side surface
of the multilayer card body is achieved in a fast and cost-effective way.
[0018] In a further preferred embodiment, the side surface is sealed by subjecting the side
surface to laser radiation. In doing so, sealing of the side surface of the card body
is achieved in a precise way. Preferably, the laser radiation starts a bonding process
by activating components within at least one of the first layer and second layer,
or by activating components of further layers applied to at least one of the first
layer and second layer. In particular, at least one further layer comprising said
components may be a pattern printed on one or both of the first and second layers.
[0019] In a further preferred embodiment, the side surface is sealed by using mechanical
or laser engrailed edges or micro-structuring. Preferably, the separating tool is
adapted to create such mechanical engrailed edges or micro-structuring. As an alternative,
a separating tool may be provided to create the mechanical or laser engrailed edges
or micro-structuring.
[0020] According to a second aspect of the invention, a multilayer card body manufactured
by the method as mentioned above is provided.
[0021] Such multilayer card body has improved mechanical properties and offers an increased
lifespan and durability as compared to state of the art card bodies. According to
a third aspect of the invention, a separating tool for sealing a side surface of a
multilayer card body during separation of the multilayer card body from a laminated
sheet is provided. The separating tool is adapted to perform one of:
- producing heat for sealing the side surface and
- destroying capsules within at least one of a first layer and a second layer of the
multilayer card body or between the first layer and second layer.
[0022] With the separating tool, a card body having a sealed side surface can be manufactured,
wherein a peel strength test to determine whether or not the layers at the side surface
are pre-damaged is not necessary.
[0023] According to a fourth aspect of the invention, an apparatus for manufacturing a multilayer
card body is provided. The apparatus comprises:
- a lamination device adapted to laminate together at least a first layer and a second
layer to form a laminated sheet,
- a separation device adapted to separate a multilayer card body from the laminated
sheet, the multilayer card body having a top surface, a bottom surface and a side
surface, and
- a sealing device adapted to seal the side surface of the multilayer card body, wherein
the sealing device is either integrated in the separating device so that sealing occurs
during separation, or the separating device is arranged subsequent to the sealing
device so that sealing occurs subsequent to the separation and without a device for
performing a test for determining delamination of the layers at the side surface before
the sealing device.
[0024] With the apparatus, a card body having a sealed side surface can be manufactured,
wherein a peel strength test to determine whether or not the layers at the side surface
are pre-damaged is not necessary.
[0025] In a preferred embodiment the sealing device comprises a separating tool, in particular
a die cutting or the separating tool as mentioned above.
[0026] With reference to the drawings, an exemplary embodiment of the invention will hereinafter
be explained in more detail.
[0027] There are shown:
FIG. 1 a flowchart of the manufacture of a card body,
FIG. 2 a cross section through a multilayer card body manufactured according to a
first embodiment of the method,
FIG. 3 a cross section through a multilayer card body manufactured according to a
second embodiment of the method,
FIG. 4 a cross section through a multilayer card body manufactured according to a
third embodiment of the method,
FIG. 5 a cross section through a multilayer card body manufactured according to a
fourth embodiment of the method,
FIG. 6 a cross section through a multilayer card body manufactured according to a
fifth embodiment of the method,
FIG. 7 a cross section through a multilayer card body manufactured according to a
sixth embodiment of the method, and
FIG. 8 a separating tool for punching out the card body.
[0028] For the following description, it will be assumed by way of example that a card body
is manufactured for a portable data carrier in the form of a chip card with conventional
outer dimensions according to ISO standard 7810. However, the method can also be used
in the same manner for manufacturing portable data carriers with other dimensions.
For example, they can be manufactured as portable data carriers in the SIM-card format
or portable data carriers serving, e.g. together with a housing, as a USB stick.
[0029] The method is illustrated as a flowchart in Fig. 1. It commences with a step 100
by making available two layers 2, 4 e.g. of thin paper or of plastic material. Expediently,
the layers are provided in sheet form or as a web. Later the two layers 2, 4 form
the structure of a multilayer card body 1 for a data carrier to be manufactured, as
is represented in the following Fig. 2 to Fig. 7.
[0030] In the arrangement as shown e.g. in Fig. 2, preferably a graphical pattern 5, 6 is
respectively applied to at least one side of the layers 2, 4 e.g. by a screen printing
or offset printing or by means of digital printing. The graphical pattern 5, 6 may
comprise flat areas, structures and/or alphanumeric characters. The graphical patterns
5, 6 may be of different configuration. The printing step may be executed with conventional
printing parameters and printing inks as are used for printing chip cards and credit
cards.
[0031] Further, preferably, there is applied to one, expediently to both, respectively other
sides of the layers 2, 4 a thin film of an adhesive 3 for supporting the subsequent
lamination in step 300. The adhesive 3 is preferably provided in the form of an adhesive
lacquer. The application of the adhesive 3 may be effected e.g. by screen printing.
Where the layers 2, 4 are of thermoplastic material and lamination occurs under the
influence of heat, the adhesive may be omitted.
[0032] In this arrangement, two further layers, namely a third layer 7 and a fourth layer
8, are provided. The layers 7, 8 preferably consist of a common polymer, e.g. PVC
or PETG. Expediently, the layers 7, 8 are transparent or semi-transparent.
[0033] The layers 7, 8 can be provided as foils which will be laminated with the other layers
2, 4. Alternatively, they can also be applied in the form of a lacquer layer, e.g.
by a suitable printing method. If the finished data carrier is to possess a magnetic
strip, one of the layers 7, 8 may expediently be equipped with the magnetic strip.
[0034] In a step 200 all layers, namely the layers 2, 4 and the layers 7, 8, are brought
together. In doing so, the layers 7, 8 are disposed as cover layers to the first layer
2 and second layer 4 so that the layers 2 and 4 are lying between the cover layers
7, 8. The layers 2, 4 and the cover layers 7, 8 are disposed one above the other in
a sandwich arrangement.
[0035] Expediently, if the portable data carrier to be manufactured is a chip card, a cavity
may be provided in the card body 1 for inserting a chip module therein.
[0036] The layers 2, 4, 7, 8 are laminated into a laminated sheet in the following step
300. Lamination is done by conventional laminating methods for manufacturing chip
cards or credit cards.
[0037] After the step 300 is performed, there is obtained a planar, multilayer laminated
sheet which has two layers 2, 4 bearing a graphical pattern 5, 6 on their respective
outer sides. The two layers 2, 4 are covered on both sides with a transparent or translucent
cover layer 7, 8. The upper surfaces 12, 13 of the laminated sheet correspond to the
final upper surfaces 12, 13 of the finished multilayer card body 1.
[0038] In the following step 400, a card body 1 having the final outer contour of the multilayer
card body 1 is separated from the planar laminated sheet. The card body 1 is expediently
done by punching the card out by using a separating tool, but can also be done by
cutting or milling.
[0039] In step 500, the side surface 10 of the card body 1 is sealed either during the separating
step 400 or as a step following the separating step 400, wherein no test for determining
delamination of the layers at the side surface 10 is performed prior to the sealing
step 500.
[0040] In a subsequent step 600, the outer surface may be finished. For instance, hot-stamped
elements can be applied to the card body 1 by a conventional hot-stamping method.
[0041] The card body 1 present thereafter can finally be personalised in a step 700. This
may be done for example by applying personal data in a thermal transfer process and/or
by notching; other personalisation methods known per se can likewise be used.
[0042] Each card body 1 according to Fig. 2 to Fig 7 comprises two polymer layers 2, 4.
An adhesive 3 is applied between the two layers 2, 4. Graphical patterns 5, 6 are
arranged on an outer side of each of the two layers 2, 4. Over the graphical patterns
5, 6, there is respectively applied a transparent cover layer 7, 8 on both sides.
The side surface side 10 of the card body 1 is sealed circumferentially.
[0043] Fig. 2 and Fig. 3 show respective cross sections through a multilayer card body 1,
wherein the side surface 10 is sealed during the separating step 400.
[0044] Instead, Fig. 4 to Fig. 7 show respective cross sections through a multilayer card
body 1 manufactured according to a method, wherein the side surface 10 is sealed in
a step following the separating step 400, wherein no test for determining delamination
of the layers at the side surface 10 is performed prior to the sealing so that the
step of sealing directly follows the step of separation. Thus, no further step lies
between the step 400 and step 500. In other words, a test, i.e. a peel strength test,
is not necessary to determine if the side surface 10 is pre-damaged or not, since
the side surface 10 of any card body 1 is sealed.
[0045] In the embodiment shown in Fig. 2, the side surface 10 is sealed by generating heat
in the side surface 10 by means of a separating tool 20 as shown in Fig. 8. The separating
tool 20 is adapted to generate heat so that as a consequence of the heat development
the card body 1 is sealed from the side surface 10 side such that delaminated layers
at the side surface 10 are bonded together. In one variant, the heat is generated
using ultrasonic waves.
[0046] Fig. 3 shows a second cross section through the multilayer card body 1. The side
surface 10 is sealed by destroying and, thereby, activating capsules 14 within the
card layers. The capsules 14 are activated when being destroyed as a result of the
separating step 400. Preferably, the capsules are filled with an adhesive. As a consequence
of the destruction of the capsules 14, the adhesive is set free at the edge of the
layers so that the card body 1 is sealed from the side surface 10 side such that delaminated
layers at the side surface 10 are bonded together.
[0047] Fig. 4 shows a third cross section through the multilayer card body 1. The side surface
10 is sealed by applying a sealing material 30 to the side surface 10. The sealing
material 30 is, e.g. an adhesive 30. As alternatives, the side surface 10 may be sealed
by applying a varnish or a solvent to the side surface 10. Like the adhesive 30, the
varnish is adapted to seal the side surface 10. The solvent may cause a chemical reaction
at layer interfaces at the side surface 10. The card body 1 is sealed from the side
surface 10 side such that delaminated layers at the side surface 10 are bonded together.
[0048] Fig. 5 shows a fourth cross section through the multilayer card body 1. The side
surface 10 is sealed by generating heat in the side surface 10. A heat source 40 is
adapted to generate heat so that as a consequence of heat development the card body
1 is sealed from the side surface 10 side such that delaminated layers at the side
surface 10 are bonded together. In particular the heat source is a heat lamp or a
laser. In one variant, the generated heat is generated using ultrasonic waves.
[0049] Fig. 6 shows a fifth cross section through the multilayer card body 1. The side surface
10 is sealed by subjecting the side surface 10 to IR illumination 50. As a reaction
of the IR illumination 50, the card body 1 is sealed from the side surface 10 side
such that delaminated layers at the side surface 10 are bonded together. As alternatives,
the side surface 10 may be sealed by UV radiation 60 or laser radiation 70. Preferably,
the laser radiation 70 is adapted to cause a micro-welding effect. The radiation may
either induce heat into the material or cause a chemical bonding reaction or both.
[0050] Fig. 7 shows a sixth cross section through the multilayer card body 1. The side surface
10 is sealed by subjecting the side surface 10 to laser radiation 70 to start a bonding
process by activating printed components 15 of the graphical pattern 5, 6. Preferably,
the layers are made of a material which is permeable to the laser radiation to enable
activation of the components 15.
[0051] Preferably, the components 15 comprise capsules which are destroyed and activated
by the laser radiation. Expediently, the capsules are filled with an adhesive. As
a consequence of the destruction of the capsules, the adhesive is set free at the
edge of the layers such that delaminated layers at the side surface 10 are bonded
together. The laser radiation is preferably applied from the side surface 10 side.
[0052] Alternatively, the components 15 comprise a chemical composition, which is activated
by laser application. As a consequence of activating reactants of the chemical composition,
the card body 1 is sealed such that delaminated layers at the side surface 10 are
bonded together.
[0053] Fig. 8 shows a separating tool 20. The separating tool 20 is used for sealing the
side surface 10 of a multilayer card body 1 during the separating step 400 of the
card body 1 from a laminated sheet. The separating tool 20 is adapted to generate
heat for sealing the side surface 10. The separating tool 20 has a hot region 25 which
extends over a separation area of the separating tool 20 giving the shape to the card
body 10. A respective cross section of a card body 1 punched out and sealed by the
separating tool 20 is shown in Fig. 2.