| (19) |
 |
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(11) |
EP 3 696 850 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
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11.11.2020 Bulletin 2020/46 |
| (43) |
Date of publication A2: |
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19.08.2020 Bulletin 2020/34 |
| (22) |
Date of filing: 12.09.2016 |
|
| (51) |
International Patent Classification (IPC):
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| (84) |
Designated Contracting States: |
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AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL
NO PL PT RO RS SE SI SK SM TR |
| (62) |
Application number of the earlier application in accordance with Art. 76 EPC: |
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16188368.1 / 3292943 |
| (71) |
Applicant: Interflux Electronics N.V. |
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9042 Gent (BE) |
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| (72) |
Inventors: |
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- Werkhoven, Daniel
9042 GENT (BE)
- Peeters, Annick
9042 GENT (BE)
- Lauwaert, Ralph
9042 GENT (BE)
- Maris, Isabelle
9042 GENT (BE)
- Van de Lisdonk, Bart
9042 GENT (BE)
- Teliszewski, Steven
9042 GENT (BE)
|
| (74) |
Representative: Arnold & Siedsma |
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Bezuidenhoutseweg 57
2594 AC The Hague
2594 AC The Hague (NL) |
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| |
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| (54) |
METHOD OF SOLDERING AN ELECTRONIC COMPONENT TO A SUBSTRATE WITH THE USE OF A SOLDER
PASTE COMPRISING A LEAD-FREE SOLDER ALLOY CONSISTING OF SN, BI AND AT LEAST ONE OF
SB AND MN |
(57) An electronic component package provided with an exposed die pad and a plurality
of contact pads at least partially present on a bottom side thereof (for example,
a quad-flat no lead (QFN) type package) is soldered to a substrate so that the contact
pads and the die pad are soldered to associated contacts on the substrate by reflowing
a solder paste composition comprising a lead-free solder alloy and a halide-free flux,
the lead-free solder alloy having an alloy composition consisting of 58.0-62.0 wt%
of tin (Sn), 38.0-41.0 wt% of bismuth (Bi) and either 0.01-1 wt% of manganese (Mn)
or 0.01-2 wt.% of antimony (Sb) and 0-1.0 wt% of manganese (Mn), the lead-free solder
alloy being free of nickel (Ni) and free of silver (Ag) and the solder alloy having
a particle size in the range of 10-40 µm as defined by sieve analysis.