(19)
(11) EP 3 718 134 A1

(12)

(43) Date of publication:
07.10.2020 Bulletin 2020/41

(21) Application number: 18883845.2

(22) Date of filing: 30.11.2018
(51) International Patent Classification (IPC): 
H01L 21/822(2006.01)
(86) International application number:
PCT/US2018/063328
(87) International publication number:
WO 2019/108945 (06.06.2019 Gazette 2019/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 01.12.2017 US 201715829442
20.02.2018 US 201815899622
07.08.2018 US 201816057747

(71) Applicant: Silicon Genesis Corporation
Santa Clara, California 95051 (US)

(72) Inventors:
  • FONG, Theodore E.
    Pleasanton, CA 94566 (US)
  • CURRENT, Michael I.
    San Jose, CA 95124 (US)

(74) Representative: White, Andrew John et al
Mathys & Squire LLP The Shard 32 London Bridge Street
London SE1 9SG
London SE1 9SG (GB)

   


(54) THREE DIMENSIONAL INTEGRATED CIRCUIT