CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent Application No.
10-2019-0044472, filed on April 16, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated
herein in its entirety by reference.
BACKGROUND
1. Field
[0002] One or more exemplary embodiments relate to an optical communication module.
2. Description of the Related Art
[0003] Optical communication modules may be used to transmit digital visual interface (DVI)
signals or high definition multimedia interface (HDMI) signals and may have a structure
in which a plurality of optical devices and a plurality of optical fibers are optically
aligned with each other to provide a plurality of communication channels.
[0004] Although such optical communication modules include optical devices to provide an
optical output from an electrical input, due to the temperature-dependent output characteristics
of optical devices, optical devices may not provide an optical output proportional
to an electrical input or may not provide sufficient optical output power at certain
temperatures in a low-temperature environment or a high-temperature environment.
SUMMARY
[0005] One or more embodiments include an optical communication module including a temperature
compensation element configured to heat or cool an optical device according to ambient
temperature for maintaining proper modulation performance and optical power over a
wide range of temperature in low-temperature and high-temperature environments.
[0006] According to one or more embodiments, an optical communication module includes:
an optical device configured to provide an optical output from an electrical input;
a circuit board on which the optical device is mounted and which is configured to
provide the electrical input to the optical device;
a temperature compensation element mounted on a side of the circuit board; and
a mechanical switch connected to the temperature compensation element and configured
to turn on/off according to ambient temperature for supplying or interrupting power
to the temperature compensation element.
[0007] For example, the mechanical switch may be configured to turn on and off without driving
power.
[0008] For example, the mechanical switch may include a bi-metal including different types
of metal plates which are bonded together and have different thermal expansion coefficients.
[0009] For example, the optical device and the temperature compensation element may be mounted
on opposite surfaces of the circuit board.
[0010] For example, the optical device and the temperature compensation element may be arranged
such that at least portions of the optical device and the temperature compensation
element may overlap each other.
[0011] For example, the temperature compensation element may include at least one of a heating
element configured to heat the optical device and a heat absorbing element configured
to cool the optical device.
[0012] For example, the temperature compensation element may include:
a heating element configured to generate heat at a low temperature; and
a heat absorbing element configured to absorb heat at a high temperature,
wherein the mechanical switch may include:
a heating switch connected to the heating element and configured to supply or interrupt
power to the heating element while turning on/off according to ambient temperature;
and
a cooling switch connected to the heat absorbing element and configured to supply
or interrupt power to the heat absorbing element while turning on/off according to
ambient temperature.
[0013] For example, the temperature compensation element may include a heating element for
heating, and
when the optical device has a temperature range of ΔT1 as a properly operable range
ranging from a first temperature to a second temperature,
the mechanical switch may be configured to turn on at the first temperature or lower,
and
the temperature compensation element may be configured to increase a temperature of
the optical device to a value different from ambient temperature by a temperature
difference ΔT2 which is less than the ΔT1.
[0014] For example, when the optical device has a temperature range of about 0 °C to about
60 °C as the properly operable range,
the mechanical switch may be configured to turn on at about 0 °C or lower, and
the temperature compensation element may be configured to increase the temperature
of the optical device to a value different from ambient temperature by about 50 °C.
[0015] For example, the ΔT1 may be about 60 °C, and the ΔT2 may be about 50 °C.
[0016] For example, the temperature compensation element may include a heat absorbing element
for cooling, and
when the optical device has a temperature range of ΔT1 as a properly operable range
ranging from a first temperature to a second temperature,
the mechanical switch may be configured to turn on at the second temperature or higher,
and
the temperature compensation element may be configured to decrease a temperature of
the optical device to a value different from ambient temperature by a temperature
difference ΔT2 which is less than the ΔT1.
[0017] For example, when the optical device has a temperature range of about 0 °C to about
60 °C as the properly operable range,
the mechanical switch may be configured to turn on at about 60 °C or higher, and
the temperature compensation element may be configured to decrease the temperature
of the optical device to a value different from ambient temperature by about 50 °C.
[0018] For example, the ΔT1 may be about 60 °C, and the ΔT2 may be about 50 °C.
[0019] For example, the temperature compensation element may include
a thermoelectric element including a first surface facing the optical device and a
second surface opposite the first surface, one of the first and second surfaces functioning
as a heating surface having a relatively high temperature, the other of the first
and second surfaces functioning as a heat absorbing surface having a relatively low
temperature,
wherein the mechanical switch may include:
a heating switch connected to the thermoelectric element and configured to supply
or interrupt power while turning on/off such that the first surface of the thermoelectric
element may function as the heating surface; and
a cooling switch connected to the thermoelectric element and configured to supply
or interrupt power while turning on/off such that the first surface of the thermoelectric
element may function as the heat absorbing surface.
[0020] For example, the heating switch and the cooling switch may be configured to supply
driving current to the thermoelectric element in opposite directions.
[0021] For example, the optical device, the circuit board, the temperature compensation
element, and the mechanical switch may be accommodated in a module housing.
[0022] For example, a stationary air layer contained in a module housing may be between
the optical device and the mechanical switch.
[0023] For example, a resin molding surrounding the optical device may be between the optical
device and the mechanical switch.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The above and other aspects, features, and advantages of certain embodiments of the
disclosure will be more apparent from the following description taken in conjunction
with the accompanying drawings, in which:
FIG. 1 is a view illustrating an optical communication module according to an embodiment;
FIG. 2 is a graph illustrating the optical power of an optical device with respect
to injection current at different temperatures when a temperature compensation element
is not operated and a vertical cavity surface emitting laser (VCSEL) is used as the
optical device;
FIG. 3 is a graph illustrating the temperature of the optical device with respect
to ambient temperature in a state in which the temperature compensation element is
operated;
FIGS. 4 to 6 are views illustrating optical communication modules according to comparative
examples for comparison with embodiments; and
FIGS. 7 and 8 are views schematically illustrating connection between the temperature
compensation element and a mechanical switch of the communication module according
to embodiments.
DETAILED DESCRIPTION
[0025] Reference will now be made in detail to embodiments, examples of which are illustrated
in the accompanying drawings, wherein like reference numerals refer to like elements
throughout. In this regard, the present embodiments may have different forms and should
not be construed as being limited to the descriptions set forth herein. Accordingly,
the embodiments are merely described below, by referring to the figures, to explain
aspects of the present description. As used herein, the term "and/or" includes any
and all combinations of one or more of the associated listed items. Expressions such
as "at least one of," when preceding a list of elements, modify the entire list of
elements and do not modify the individual elements of the list.
[0026] Optical communication modules will now be described according to embodiments with
reference to the accompanying drawings.
[0027] FIG. 1 is a view illustrating an optical communication module according to an embodiment.
Referring to FIG. 1, the optical communication module may include: an optical device
10 configured to output an optical signal in response to an electrical drive signal;
a circuit board 20 on which the optical device 10 is mounted and which is configured
to apply drive signals to the optical device 10; and an optical fiber 30 having an
end portion to which an optical signal output from the optical device 10 is input.
In the embodiment, a temperature compensation element 50 may be arranged on the circuit
board 20 on which the optical device 10 is mounted. For example, the optical device
10 and the temperature compensation element 50 may be mounted on opposite surfaces
of the circuit board 20. For example, the device 10 and the temperature compensation
element 50 may be mounted at overlapping positions with the circuit board 20 therebetween
to facilitate thermal flow between the optical device 10 and the temperature compensation
element 50.
[0028] The optical communication module may include a module housing 60 to protect internal
elements from an external environment and seal the inside of the optical communication
module. In addition, the optical communication module may include an opening for outputting
optical signals of the optical device 10 and a reflection mirror 11 for optically
aligning the end portion of the optical fiber 30.
[0029] FIG. 2 is a view illustrating the optical power of the optical device 10 with respect
to injection current at different temperatures when the temperature compensation element
50 is not operated and a vertical cavity surface emitting laser (VCSEL) is used as
the optical device 10. In FIG. 2, a modulation section M may refer to a section in
which modulation is performed to convert the high/low levels of injection current
into the high/low levels of optical power for converting an electrical input signal
(corresponding to the injection current) into an optical output signal (corresponding
to the optical power). The modulation section M may be set to be away from at least
a threshold current Ith. Here, when injection current is less than the threshold current
Ith, output power does not practically vary with the injection current (optical power
is substantially zero), and thus the modulation section M for modulation between injection
current and optical power may be set to be away from the threshold current Ith.
[0030] Referring to FIG. 2, since the modulation section M is away the threshold current
Ith when the temperature of the optical device 10 is 0 °C or higher, the temperature
of the optical device 10 may be maintained to be 0 °C or higher. When the temperature
of the optical device 10 is less than 0 °C, the threshold current Ith is within the
modulation section M, for example, when the temperature of the optical device 10 is
-10 °C, the threshold current Ith is about 2.5 mA which is within the modulation section
M. Thus, the temperature of the optical device 10 may be maintained to be about 0
°C or higher to place the threshold current Ith away from the modulation section M.
[0031] In addition, when the temperature of the optical device 10 is greater than about
60 °C, the optical power of the optical device 10 decreases, and thus during modulation
in which an optical output (corresponding to optical power) is converted into low/high
levels according to the low/high levels of an electrical input (corresponding to injection
current), the optical power difference between low/high levels may not be sufficiently
large, such that noise components and signal components may not be clearly distinguished.
In addition, a receiving end may have difficulty in extracting signal components by
removing nose components. Thus, a temperature range guaranteeing a proper operation
of the optical device 10 may be set to be from 0° to 60 °C.
[0032] In an embodiment, the temperature compensation element 50 may operate according to
ambient temperature, and in this case, temperatures corresponding to the lower limit
(for example, 0 °C) and the upper limit (for example, 60 °C) of the temperature range
guaranteeing a proper operation of the optical device 10 may be set as a lower threshold
temperature and a upper threshold temperature for initiating the operation of the
temperature compensation element 50 such that an intended optical output (corresponding
to optical power) may be obtained from an electrical input (corresponding to injection
current) substantially at any temperature by the modulation of the optical device
10.
[0033] For example, the lower threshold temperature of the temperature compensation element
50 may be set to be 0 °C, and thus when ambient temperature is about 0 °C or less,
the temperature compensation element 50 may be turned on to heat the optical device
10 to an intended temperature range (for example, 0 °C or higher). As described later,
as the temperature compensation element 50 is operated, the temperature of the optical
device 10 may be increased to have a difference from ambient temperature by about
50 °C. Therefore, even when ambient temperature decreases to about 0 °C or less, the
temperature of the optical device 10 may increase to a temperature of about 50 °C
or less as the temperature compensation element 50 is turned on.
[0034] In addition, the upper threshold temperature of the temperature compensation element
50 may be set to be 60 °C, and thus when ambient temperature is about 60 °C or higher,
the temperature compensation element 50 may be turned on to cool the optical device
10 to an intended temperature range (for example, about 60 °C or less). As described
later, as the temperature compensation element 50 is operated, the temperature of
the optical device 10 may be decreased to have a difference from ambient temperature
by about 50 °C. Therefore, even when ambient temperature increases to about 60 °C
or higher, the temperature of the optical device 10 may decrease to a temperature
of about 10 °C or higher as the temperature compensation element 50 is turned on.
The mechanism, in which the temperature of the optical device 10 is increased or decreased
to have a constant difference from ambient temperature by the operation of the temperature
compensation element 50, will be described later.
[0035] FIG. 3 is a graph showing the temperature of the optical device 10 with respect to
ambient temperature in a state in which the temperature compensation element 50 is
operated. Here, as described later, ambient temperature may refer to the temperature
of a position at which a mechanical switch 51 configured to turn on and off to supply
and interrupt power to the temperature compensation element 50 according to ambient
temperature is arranged. The temperature of the optical device 10 may vary as the
optical device 10 is heated or cooled by the temperature compensation element 50 according
to the difference between the temperature of the optical device 10 and ambient temperature,
and ambient temperature may refer to an external temperature which is constant independent
of the operation of the temperature compensation element 50. For example, the external
temperature may refer to the temperature of an external environment surrounding the
optical communication module.
[0036] The temperature of the optical device 10 may refer to a temperature which is directly
affected by the operation of the temperature compensation element 50 and directly
affects the modulation or optical power of the optical device 10. The temperature
compensation element 50 may be in contact with the optical device 10 with the circuit
board 20 therebetween, such that the heating and cooling of the temperature compensation
element 50 may directly affect the temperature of the optical device 10. For example,
since the optical device 10 is in contact with the temperature compensation element
50 through the circuit board 20, the optical device 10 and the temperature compensation
element 50 may be quickly thermally balanced with each other through heat transfer
occurring by conduction.
[0037] Referring to FIG. 3, when ambient temperature is higher than about 0 °C, the temperature
compensation element 50 is not operated, and when ambient temperature is 0 °C or less,
the temperature compensation element 50 is operated such that the temperature of the
optical device 10 may be increased to have a constant difference of, for example,
about 50 °C from ambient temperature. For example, when ambient temperature is 0 °C,
the temperature of the optical device 10 may be increased to 50 °C as being heated
by the temperature compensation element 50.
[0038] In addition, when ambient temperature is lower than about 60 °C, the temperature
compensation element 50 is not operated, and when ambient temperature is about 60
°C or higher, the temperature compensation element 50 is operated such that the temperature
of the optical device 10 may be decreased to have a constant difference of, for example,
about 50 °C from ambient temperature. For example, when ambient temperature is about
60 °C, the temperature of the optical device 10 may be decreased to about 10 °C as
being cooled by the temperature compensation element 50.
[0039] When the temperature compensation element 50 is not operated, the ambient temperature
range in which the optical device 10 properly operates may be limited to a narrow
range of about 0 °C to about 60 °C, but when the temperature compensation element
50 is operated, the ambient temperature range in which the optical device 10 properly
operates may be extended to a wide range of about -50 °C to about 110 °C. That is,
owing to the use of the temperature compensation element 50, it may be possible to
maintain proper modulation performance within a widened temperature range during modulation
for converting an electrical signal (corresponding to injection current) into an optical
signal (corresponding to optical power).
[0040] The temperature compensation element 50 may maintain the temperature of the optical
device 10 within a proper range even in a low temperature environment or high temperature
environment by heating or cooling the optical device 10. That is, the temperature
compensation element 50 may include a heating element for heating the optical device
10 or a heat absorbing element for cooling the optical device 10. In some embodiments,
the temperature compensation element 50 may include at least one of a heating element
and a heat absorbing element, and in various other embodiments, the temperature compensation
element 50 may include only a heating element and may not include a heat absorbing
element, or may include only a heat absorbing element and may not include a heating
element, or may include both a heating element and a heat absorbing element. For example,
according to an ambient temperature condition in which the optical communication module
is placed, the temperature compensation element 50 included in the optical communication
module may optionally include only one of a heating element and a heat absorbing element
or may include both a heating element and a heat absorbing element.
[0041] Referring to FIG. 1, the temperature compensation element 50 may include a thermoelectric
element that heats or cools the optical device 10 by using an electrical power source
52 as a power input. In this case, the temperature compensation element 50 may be
connected to the mechanical switch 51 configured to supply or interrupt power to the
temperature compensation element 50 according to ambient temperature, and the temperature
compensation element 50 and the power source 52 may be connected to each other through
the mechanical switch 51.
[0042] The temperature compensation element 50 is started to operate by the mechanical switch
51 that senses ambient temperature, and once the temperature compensation element
50 is started to operate, the temperature compensation element 50 may apply a constant
amount of heat (heating) or remove a constant amount of heat (cooling) independent
of ambient temperature. Here, the constant amount of heat may refer to a heat amount
corresponding to the amount of heat loss caused by a constant temperature difference
between the temperature of the optical device 10 and ambient temperature. For example,
when the temperature compensation element 50 supplies an amount of heat corresponding
to constant heat loss caused by a constant temperature difference, for example, a
temperature difference of about 50 °C between the temperature of the optical device
10 and ambient temperature in a steady state, the constant temperature difference
between the optical device 10 and ambient temperature may be maintained, and thus
the temperature of the optical device 10 may be maintained to have a constant temperature
difference from ambient temperature. For reference, the term "amount of heat" may
refer to a thermal flow which occurs between two objects per unit time and is determined
not by the specific temperatures of the two objects but by the temperature difference
between the two objects. Therefore, the heat loss caused by a constant temperature
difference between the temperature of the optical device 10 and ambient temperature
may be constant, and in a steady state, the constant temperature difference between
the temperature of the optical device 10 and ambient temperature may be maintained
by supplying, from the temperature compensation element 50, an amount of heat corresponding
to the constant heat loss.
[0043] In an embodiment, the temperature compensation element 50 may be started to operate
by the mechanical switch 51 that turns on and off according to ambient temperature.
Here, unlike electrical switches, the mechanical switch 51 does not require a driving
power source for switching between ON and OFF states. For example, unlike the mechanical
switch 51 of the embodiment, electrical switches, such as a bipolar junction transistor
(BJT), a junction field effect transistor (JFET), or a metal-oxide-semiconductor field-effect
transistor (MOSFET), require a driving power source for switching between ON and OFF
states. For example, such an electrical switch needs to form an electric field to
form a channel for carriers such as holes or electrons, and thus requires a driving
power source for the operation of the electrical switch itself.
[0044] Unlike such electrical switches, the mechanical switch 51 of the present embodiment
does not require a power source for the operation of the mechanical switch 51 itself.
That is, in embodiments, the temperature compensation element 50 requires the power
source 52 for heating and cooling the optical device 10, but the mechanical switch
51 used to start the operation of the temperature compensation element 50 does not
require a separate driving power source for switching between ON and OFF states. For
example, in an embodiment, the mechanical switch 51 may be a temperature-sensitive
switch configured to respond to ambient temperature and switch between ON and OFF
states according to the ambient temperature without requiring a separate electrical
power source.
[0045] For example, a bi-metal switch in which different types of metal plates having different
thermal expansion coefficients are bonded together may be used as the mechanical switch
51. The on-off switching of the bi-metal switch may occur when the different types
of metal plates bend in one direction due to different amounts of thermal expansion
according to ambient temperature, and thus the bi-metal switch is not required to
be electrically powered for on-off switching.
[0046] For example, when the different types of metal plates having different thermal expansion
coefficients with respect to temperature are bent in a direction of a metal plate
having a relatively large or small thermal expansion coefficient in response to ambient
temperature, the bi-metal switch may turn on to supply power, and when the different
types of metal plates having different thermal expansion coefficients with respect
to temperature are returned to an original state in response to ambient temperature,
the bi-metal switch may turn off to interrupt power.
[0047] In an embodiment, the lower threshold temperature and the upper threshold temperature
at which the mechanical switch 51 starts to operate is may be set to 0 °C and 60 °C,
respectively. That is, when ambient temperature is about 0 °C or lower or about 60
°C or higher, the mechanical switch 51 may turn on to supply power to the temperature
compensation element 50 and initiate the operation of the temperature compensation
element 50. Furthermore, when ambient temperature falls within a proper range outside
a low temperature environment or high temperature environment in an ON state in which
power is being supplied to the temperature compensation element 50, the mechanical
switch 51 turns off to interrupt power to the temperature compensation element 50
and thus to stop the operation of the temperature compensation element 50.
[0048] The mechanical switch 51 may sense ambient temperature, not the temperature of the
optical device 10, and may turn on or off in response to ambient temperature. This
will now be described. That is, in a low temperature environment in which ambient
temperature is lower than the lower threshold temperature, the mechanical switch 51
may turn on, and as the operation of the temperature compensation element 50 is started
by the turning-on of the mechanical switch 51, the temperature of the optical device
10 may be increased to have a constant difference from ambient temperature. In this
case, since ambient temperature does not vary even when the temperature compensation
element 50 is operated, the mechanical switch 51 does not turn off and stays in the
ON state even though the temperature of the optical device 10 is increased as a result
of the operation of the temperature compensation element 50. In this state, the temperature
compensation element 50 may supply a constant amount of heat to the optical device
10, and the temperature of the optical device 10 may increase until the amount of
heat supplied to the optical device 10 and the amount of heat dissipating from the
optical device 10 are balanced to reach a steady state, that is, until the temperature
of the optical device 10 increases and then has a constant difference from ambient
temperature. The expression "the temperature of the optical device 10 and ambient
temperature have a constant difference from each other" may indicate that the amount
of heat dissipating from the optical device 10 to the outside is constant. The temperature
compensation element 50 may supply heat to the optical device 10 in an amount corresponding
to the amount of heat loss occurring when the temperature of the optical device 10
and ambient temperature have a difference of about 50 °C, thereby maintaining the
difference between the temperature of the optical device 10 and ambient temperature
at a constant level. In this case, since the optical device 10 is supplied with an
amount of heat, which corresponds to the amount of heat loss caused by the temperature
difference of about 50 °C from ambient temperature, from the temperature compensation
element 50, the amount of heat loss from the optical device 10 and the amount of heat
supplied to the optical device 10 may be maintained at constant levels with time,
thereby reaching a constant temperature steady state. That is, in an embodiment, a
constant amount of heat is supplied to the optical device 10 such that the temperature
of the optical device 10 may be increased to have a constant difference from ambient
temperature.
[0049] For reference, the term "amount of heat" may refer to a thermal flow which occurs
between two objects per unit time and is determined not by the specific temperatures
of the two objects but by the temperature difference between the two objects. Therefore,
the heat loss caused by a constant temperature difference between the temperature
of the optical device 10 and ambient temperature may be constant, and in a steady
state, the constant temperature difference between the temperature of the optical
device 10 and ambient temperature may be maintained by supplying, from the temperature
compensation element 50, an amount of heat corresponding to the heat loss.
[0050] As described above, the mechanical switch 51 turns on and off according to ambient
temperature but does not turn on and off according to the operation of the temperature
compensation element 50 or the temperature of the optical device 10. Unlike in embodiments,
when the mechanical switch 51 is configured to turn on and off according to the temperature
of the optical device 10, since the mechanical switch 51 is directly affected by the
operation of the temperature compensation element 50 or the temperature of the optical
device 10, the mechanical switch 51 may be repeatedly rapidly turned on and off for
a short period of time, adversely affecting the durability or reliability of the optical
communication module. For example, when the mechanical switch 51 turns on according
to the temperature of the optical device 10, the temperature compensation element
50 is started to operate, and then the mechanical switch 51 turns off immediately
after the temperature of the optical device 10 is varied to a proper vale by the operation
of the temperature compensation element 50. Then, the mechanical switch 51 immediately
turns on again as the temperature of the optical device 10 approaches the low/upper
threshold temperature while the temperature compensation element 50 is not operated.
In this manner, the mechanical switch 51 may repeatedly turn on and off for a short
period of time, and thus the operation of the temperature compensation element 50
may be repeatedly started and stopped for a short period of time. That is, due to
the mechanism in which the operation of the temperature compensation element 50 is
determined by the on-off switching of the mechanical switch 51 and the on-off switching
of the mechanical switch 51 is determined by the heating or cooling operation of the
temperature compensation element 50, the on-off switching of the mechanical switch
51 and the resulting starting/stopping of the operation of the temperature compensation
element 50 may be frequently repeated in an environment near a threshold temperature,
for example, near a lower threshold temperature of 0 °C or an upper threshold temperature
of 60 °C, and thus the durability or reliability of the optical communication module
may decrease.
[0051] In an embodiment, since the mechanical switch 51 is operated depending on ambient
temperature, the on-off switching of the mechanical switch 51 is not affected by the
operation of the temperature compensation element 50, and a steady state is induced
in which the amount of heat supplied to the optical device 10 from the temperature
compensation element 50 is balanced with the amount of heat loss caused by the difference
between the temperature of the optical device 10 and ambient temperature, such that
the temperature of the optical device 10 may be maintained to have a constant difference
from ambient temperature.
[0052] As described above, ambient temperature determining the on-off switching of the mechanical
switch 51 is different from the temperature of the optical device 10, and the mechanical
switch 51 may be positioned away from the optical device 10 and may be thermally insulated
such that ambient temperature and the temperature of the optical device 10 may not
be affected by each other.
[0053] For example, the module housing 60 may accommodate a stationary air layer of which
the flow rate is substantially zero, and thus the optical device 10 and the mechanical
switch 51 may be insulated from each other by the stationary air layer. For example,
the optical device 10 may be in contact with the temperature compensation element
50 with the circuit board 20 therebetween and thus may rapidly reach thermal equilibrium
with the temperature compensation element 50 by thermal conduction. However, since
the mechanical switch 51 is mounted on an inner wall of the module housing 60 away
from the circuit board 20 and is surrounded by the stationary air layer, the mechanical
switch 51 may not be affected by the temperature compensation element 50. As described
above, the optical device 10 is capable of rapidly reaching thermal equilibrium with
the temperature compensation element 50, and the mechanical switch 51 is insulated
so as not to be affected by the temperature compensation element 50, such that the
temperature of the optical device 10 and the temperature (ambient temperature) of
the mechanical switch 51 may be different from each other. Here, the module housing
60 may provide thermal insulation between the optical device 10 and the mechanical
switch 51 because the module housing 60 accommodate a stationary air layer of which
the flow rate is substantially zero. To this end, an inlet or an outlet for fluidly
connecting the inside and the outside of the module housing 60 to each other may not
be formed in the module housing 60, and the inside of the module housing 60 may be
sealed from the outside of the module housing 60.
[0054] Referring to FIG. 1, a solid insulator such as a resin molding 40 may be arranged
between the optical device 10 and the mechanical switch 51, and for example, the optical
device 10 and the mechanical switch 51 may be insulated from each other by the resin
molding 40 covering the periphery of the optical device 10. In this case, since the
resin molding 40 and the stationary air layer are between the optical device 10 and
the mechanical switch 51, the optical device 10 and the mechanical switch 51 may be
thermally insulated from each other. Here, the expression "the resin molding 40 is
arranged between the optical device 10 and the mechanical switch 51" may indicate
that the resin molding 40 is arranged on a heat dissipation path of the optical device
10. In various embodiments, the mechanical switch 51 may be placed on the inner wall
of the module housing 60 at a position facing the resin molding 40, and the optical
device 10 may dissipate heat through the resin molding 40 surrounding the optical
device 10.
[0055] In the embodiment shown in FIG. 1, the mechanical switch 51 is mounted on the inner
wall of the module housing 60 at a position opposite the optical device 10 with respect
to the circuit board 20. However, the technical scope of the present disclosure is
not limited thereto, and in other embodiments, the mechanical switch 51 may be placed
on the same side as the optical device 10 with respect to the circuit board 20. In
these arrangements, the stationary air layer contained in the module housing 60 and
the resin molding 40 surrounding the optical device 10 are arranged between the optical
device 10 and the mechanical switch 51, thereby thermally insulating the optical device
10 and the mechanical switch 51 from each other and preventing the temperature of
the optical device 10 and the temperature of the mechanical switch 51, that is, ambient
temperature, from affecting each other.
[0056] The mechanical switch 51 mounted on the inner wall of the module housing 60 may be
in contact with the outside with the module housing 60 therebetween and may thus exchange
heat with the outside by conduction for thermal equilibrium with the outside having
ambient temperature, and thus the temperature of the periphery of the mechanical switch
51 may substantially correspond to the temperature of the outside of the module housing
60. In other embodiments, the mechanical switch 51 may be placed outside the module
housing 60. The mechanical switch 51 placed outside the module housing 60 may determine,
based on ambient temperature, whether to initiate the operation of the temperature
compensation element 50.
[0057] In an embodiment, the temperature compensation element 50 may operate as a heating
element for heating, and when the temperature range in which the optical device 10
properly operates is from about 0 °C to about 60 °C, the mechanical switch 51 may
turn on at a temperature of about 0 °C or less. In this case, as the temperature compensation
element 50 is operated, the temperature of the optical device 10 may be increased
to be higher than ambient temperature by about 50°C.
[0058] When the temperature of the optical device 10 is increased to be higher than ambient
temperature by about 70 °C by the operation of the temperature compensation element
50, the optical device 10 may not be properly operated in case in which the ambient
temperature is about 0 °C because the temperature of the optical device 10 rises to
about 70 °C (which is higher than the upper threshold temperature of 60 °C for a proper
operation of the optical device 10). That is, when the temperature range in which
the optical device 10 properly operates is from about 0 °C to about 60 °C, the temperature
compensation element 50 may increase the temperature of the optical device 10 to a
value different from ambient temperature by less than about 60 °C, for example, by
about 50 °C.
[0059] In other words, when the optical device 10 has a properly operable temperature range
of ΔT1 (for example, a temperature range of about 60 °C) between a first temperature
(for example, about 0 °C) and a second temperature (for example, 60 °C), the mechanical
switch 51 may turn on at the first temperature (for example, about 0 °C) or lower,
and the temperature compensation element 50 may increase the temperature of the optical
device 10 to a value higher than ambient temperature by ΔT2 (for example, about 50
°C) which is less than ΔT1 (for example, about 60 °C).
[0060] In an embodiment, the temperature compensation element 50 may operate as a heat absorbing
element for cooling, and when the temperature range in which the optical device 10
properly operates is from about 0 °C to about 60 °C, the mechanical switch 51 may
turn on at a temperature of about 60 °C or higher. In this case, as the temperature
compensation element 50 is operated, the temperature of the optical device 10 may
be decreased to be lower than ambient temperature by about 50°C.
[0061] When the temperature of the optical device 10 is decreased to be lower than ambient
temperature by about 70 °C by the operation of the temperature compensation element
50, the optical device 10 may not be properly operated in case in which the ambient
temperature is about 60 °C because the temperature of the optical device 10 deceases
to about -10 °C (which is lower than the lower threshold temperature of 0 °C for a
proper operation of the optical device 10). That is, when the temperature range in
which the optical device 10 properly operates is from about 0 °C to about 60 °C, the
temperature compensation element 50 may decrease the temperature of the optical device
10 to a value different from ambient temperature by less than 60 °C, for example,
by about 50 °C.
[0062] In other words, when the optical device 10 has a properly operable temperature range
of ΔT1 (for example, a temperature range of about 60 °C) between a first temperature
(for example, about 0 °C) and a second temperature (for example, about 60 °C), the
mechanical switch 51 may turn on at the second temperature (for example, about 60
°C) or higher, and the temperature compensation element 50 may decrease the temperature
of the optical device 10 to a value lower than ambient temperature by ΔT2 (for example,
about 50 °C) which is less than ΔT1 (for example, about 60 °C).
[0063] FIGS. 4 to 6 are views illustrating optical communication modules according to comparative
examples for comparison with embodiments. The comparative example illustrated in FIG.
4 may include a feedback structure to compensate for optical power loss according
to variations in the optical power output of an optical device 10 with respect to
ambient temperature. For example, the feedback structure may be configured to detect
optical power from a portion of the output of the optical device 10 and control injection
current according to the detected optical power to maintain optical power at a constant
level regardless of ambient temperature. To this end, an optical communication module
may include: a partially reflective plate 71 configured to transmit most of the output
of the optical device 10 and reflect a portion of the output of the optical device
10 to a detection device 70 (for example, a photodiode); and a driving integrated
circuit (IC) 80 configured to control injection current to the optical device 10 by
feeding back optical power measured by the detection device 70.
[0064] The optical communication module of the comparative example may have a complex structure
because the partially reflective plate 71 for changing an optical path starting from
the optical device 10 and the detection device 70 for detecting optical power are
added to the optical communication module. For example, the partially reflective plate
71 for changing the optical path starting from the optical device 10 or the detection
device 70 for detecting optical power on the optical path extending via the partially
reflective plate 71 may be required to be precisely aligned at a position adjacent
to the optical device 10, for example, along the optical path of the optical device
10, and thus precise alignment and strict process control may be required therefor.
[0065] As shown in FIG. 5, in the comparative example in which a plurality of optical devices
10 are arranged to form an array, a partially reflective plate 71 and a detection
device 70 may be required for each of the optical devices 10, complicating the structure
of an optical communication module. In the case in which a partially reflective plate
71 and a detection device 70 are provided to only one of the optical devices 10, a
special structure may be required to provide the partially reflective plate 71 and
the detection device 70 selectively to one of the optical devices 10.
[0066] The comparative example shown in FIG. 6 may include a feedback structure to maintain
the temperature of an optical device 10 at an appropriate level. In the comparative
example, the temperature of the optical device 10 may be maintained at a target value
by measuring the temperature of the optical device 10 in real time and providing an
amount of heat corresponding to the difference between the measured temperature and
the target temperature. However, in this feedback structure, a separate temperature
measuring unit such as a thermistor 91 may be required to measure the temperature
of the optical device 10, and a driving IC 92 may be required to amplify/process a
signal corresponding to the difference between a measured temperature and a target
temperature to output a driving signal to a heating device 93 for providing a proper
amount of heat. Therefore, the structure of an optical communication module may be
complicated.
[0067] According to embodiments of the present disclosure, the operation of the temperature
compensation element 50 is started by the mechanical switch 51 configured to turn
on and off according to ambient temperature, and the temperature compensation element
50 provides a constant amount of heat to the optical device 10 while the operation
of the temperature compensation element 50 is initiated/stopped. Therefore, a temperature
measuring unit such as the thermistor 91 is not required to measure the temperature
of the optical device 10 in real time, and the driving IC 92 is not required to provide
a driving signal by amplifying/processing a signal corresponding to the difference
between a measured temperature of the optical device 10 and a target temperature.
[0068] FIGS. 7 and 8 are views schematically illustrating connection between the temperature
compensation element 50 and the mechanical switch 51 in the optical communication
module according to embodiments.
[0069] Referring to FIGS. 7 and 8, the temperature compensation element 50 may include a
heating element 50a for heating and a heat absorbing element 50b for cooling. The
heating element 50a and the heat absorbing element 50b may be respectively connected
to a heating switch 51a and a cooling switch 51b, and may be powered or not powered
according to the on-off states of the heating switch 51a and the cooling switch 51b.
A power source 52 connected to the heating element 50a and the heat absorbing element
50b through the heating switch 51a and the cooling switch 51b may include a heating
power source 52a for supplying power to the heating element 50a and a cooling power
source 52b for supplying power to the heat absorbing element 50b. Each of the heating
switch 51a and the cooling switch 51b may correspond to the mechanical switch 51 that
does not require driving power for on-off switching and may include, for example,
a bi-metal.
[0070] For example, the heating switch 51a may turn on when ambient temperature reaches
0 °C. The cooling switch 51b may turn on when ambient temperature reaches 60 °C. The
heating element 50a may provide a constant amount of heat to an optical device 10
when the heating switch 51a turns on, and the heat absorbing element 50b may remove
a constant amount heat from the optical device 10 when the cooling switch 51b turns
on. Here, the constant amount of heat may refer to a preset amount of heat for increasing
or decreasing the temperature of the optical device 10 by a predetermined temperature
difference.
[0071] In the structure shown in FIG. 7, the heating element 50a and the heat absorbing
element 50b of the temperature compensation element 50 are separately provided, and
in the structure shown in FIG. 8, the heating element 50a and the heat absorbing element
50b of the temperature compensation element 50 are provided as one thermoelectric
element 50 (temperature compensation element). For example, the thermoelectric element
50 (temperature compensation element) may include a first surface S1 facing the optical
device 10 and a second surface S2 opposite the first surface S1, wherein one of the
first and second surfaces S1 and S2 may function as a heating surface which has a
relatively high temperature, and the other of the first and second surfaces S1 and
S2 may function as a heat absorbing surface which has a relatively low temperature.
[0072] For example, in the thermoelectric element 50 (temperature compensation element),
the first surface S1 facing the optical device 10 may function as a high-temperature
heating surface and the second surface S2 which is opposite the first surface S1 may
function as a low-temperature heat absorbing surface according to the direction of
driving current, and when the direction of driving current is reversed, the first
surface S1 facing the optical device 10 may function as a low-temperature heat absorbing
surface and the second surface S2 which is opposite the first surface S1 may function
as a high-temperature heating surface.
[0073] For example, the heating switch 51a may be connected to the thermoelectric element
50 and may supply or interrupt power while turning on and off such that the first
surface S1 of the thermoelectric element 50 may function as a high-temperature heating
surface, and the cooling switch 51b may be connected to the thermoelectric element
50 and may supply or interrupt power while turning on and off such that the first
surface S1 of the thermoelectric element 50 may function as a low-temperature heat
absorbing surface. In this case, the heating switch 51a and the cooling switch 51b
may supply driving current to the thermoelectric element 50 in opposite directions
such that the first surface S1 of the thermoelectric element 50 facing the optical
device 10 may selectively function as a high-temperature heating surface or a low-temperature
heat absorbing surface.
[0074] As described above, according to the one or more of the above embodiments, the thermoelectric
element 50 is used to heat or cool the optical device 10 according to the surrounding
low-temperature or high-temperature environment, thereby making it possible to maintain
proper modulation performance over a widened temperature range when an electrical
signal is converted into an optical signal and to maintain the optical power of the
optical device 10 at a proper level.
[0075] It should be understood that embodiments described herein should be considered in
a descriptive sense only and not for purposes of limitation. Descriptions of features
or aspects within each embodiment should typically be considered as available for
other similar features or aspects in other embodiments. While one or more embodiments
have been described with reference to the figures, it will be understood by those
of ordinary skill in the art that various changes in form and details may be made
therein without departing from the spirit and scope of the disclosure as defined by
the following claims.
1. An optical communication module comprising:
an optical device configured to provide an optical output from an electrical input;
a circuit board on which the optical device is mounted and which is configured to
provide the electrical input to the optical device;
a temperature compensation element mounted on a side of the circuit board; and
a mechanical switch connected to the temperature compensation element and configured
to turn on/off according to ambient temperature for supplying or interrupting power
to the temperature compensation element.
2. The optical communication module of claim 1, wherein the mechanical switch is configured
to turn on and off without driving power.
3. The optical communication module of claim 1, wherein the mechanical switch comprises
a bi-metal comprising different types of metal plates which are bonded together and
have different thermal expansion coefficients.
4. The optical communication module of claim 1, wherein the optical device and the temperature
compensation element are mounted on opposite surfaces of the circuit board.
5. The optical communication module of claim 4, wherein the optical device and the temperature
compensation element are arranged such that at least portions of the optical device
and the temperature compensation element overlap each other.
6. The optical communication module of claim 1, wherein the temperature compensation
element comprises at least one of a heating element configured to heat the optical
device and a heat absorbing element configured to cool the optical device.
7. The optical communication module of claim 1, wherein
the temperature compensation element comprises:
a heating element configured to generate heat at a low temperature; and
a heat absorbing element configured to absorb heat at a high temperature,
wherein the mechanical switch comprises:
a heating switch connected to the heating element and configured to supply or interrupt
power to the heating element while turning on/off according to ambient temperature;
and
a cooling switch connected to the heat absorbing element and configured to supply
or interrupt power to the heat absorbing element while turning on/off according to
ambient temperature.
8. The optical communication module of claim 1, wherein
the temperature compensation element comprises a heating element for heating, and
when the optical device has a temperature range of ΔT1 as a properly operable range
ranging from a first temperature to a second temperature,
the mechanical switch is configured to turn on at the first temperature or lower,
and
the temperature compensation element is configured to increase a temperature of the
optical device to a value different from ambient temperature by a temperature difference
ΔT2 which is less than the ΔT1.
9. The optical communication module of claim 8, wherein
when the optical device has a temperature range of about 0 °C to about 60 °C as the
properly operable range,
the mechanical switch is configured to turn on at about 0 °C or lower, and
the temperature compensation element is configured to increase the temperature of
the optical device to a value different from ambient temperature by about 50 °C.
10. The optical communication module of claim 8, wherein the ΔT1 is about 60 °C, and the
ΔT2 is about 50 °C.
11. The optical communication module of claim 1, wherein
the temperature compensation element comprises a heat absorbing element for cooling,
and
when the optical device has a temperature range of ΔT1 as a properly operable range
ranging from a first temperature to a second temperature,
the mechanical switch is configured to turn on at the second temperature or higher,
and
the temperature compensation element is configured to decrease a temperature of the
optical device to a value different from ambient temperature by a temperature difference
ΔT2 which is less than the ΔT1.
12. The optical communication module of claim 11, wherein
when the optical device has a temperature range of about 0 °C to about 60 °C as the
properly operable range,
the mechanical switch is configured to turn on at about 60 °C or higher, and
the temperature compensation element is configured to decrease the temperature of
the optical device to a value different from ambient temperature by about 50 °C.
13. The optical communication module of claim 11, wherein the ΔT1 is about 60 °C, and
the ΔT2 is about 50 °C.
14. The optical communication module of claim 1, wherein the temperature compensation
element comprises a thermoelectric element comprising a first surface facing the optical
device and a second surface opposite the first surface, one of the first and second
surfaces functioning as a heating surface having a relatively high temperature, the
other of the first and second surfaces functioning as a heat absorbing surface having
a relatively low temperature,
wherein the mechanical switch comprises:
a heating switch connected to the thermoelectric element and configured to supply
or interrupt power while turning on/off such that the first surface of the thermoelectric
element functions as the heating surface; and
a cooling switch connected to the thermoelectric element and configured to supply
or interrupt power while turning on/off such that the first surface of the thermoelectric
element functions as the heat absorbing surface.
15. The optical communication module of claim 14, wherein the heating switch and the cooling
switch are configured to supply driving current to the thermoelectric element in opposite
directions.
16. The optical communication module of claim 1, wherein the optical device, the circuit
board, the temperature compensation element, and the mechanical switch are accommodated
in a module housing.
17. The optical communication module of claim 1, wherein a stationary air layer contained
in a module housing is between the optical device and the mechanical switch.
18. The optical communication module of claim 1, wherein a resin molding surrounding the
optical device is between the optical device and the mechanical switch.