(19)
(11) EP 3 740 340 A1

(12)

(43) Date of publication:
25.11.2020 Bulletin 2020/48

(21) Application number: 18901662.9

(22) Date of filing: 19.01.2018
(51) International Patent Classification (IPC): 
B23K 35/02(2006.01)
B23K 35/36(2006.01)
B23K 35/26(2006.01)
(86) International application number:
PCT/US2018/014501
(87) International publication number:
WO 2019/143358 (25.07.2019 Gazette 2019/30)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD TN

(71) Applicant: NCC Nano, LLC
Dallas, TX 75251 (US)

(72) Inventor:
  • HENDRIKS, Rob, Jacob
    5654BN Eindhoven (NL)

(74) Representative: Mewburn Ellis LLP 
Aurora Building Counterslip
Bristol BS1 6BX
Bristol BS1 6BX (GB)

   


(54) METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE