(19)
(11)
EP 3 740 340 A1
(12)
(43)
Date of publication:
25.11.2020
Bulletin 2020/48
(21)
Application number:
18901662.9
(22)
Date of filing:
19.01.2018
(51)
International Patent Classification (IPC):
B23K
35/02
(2006.01)
B23K
35/36
(2006.01)
B23K
35/26
(2006.01)
(86)
International application number:
PCT/US2018/014501
(87)
International publication number:
WO 2019/143358
(
25.07.2019
Gazette 2019/30)
(84)
Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD TN
(71)
Applicant:
NCC Nano, LLC
Dallas, TX 75251 (US)
(72)
Inventor:
HENDRIKS, Rob, Jacob
5654BN Eindhoven (NL)
(74)
Representative:
Mewburn Ellis LLP
Aurora Building Counterslip
Bristol BS1 6BX
Bristol BS1 6BX (GB)
(54)
METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE