(19)
(11) EP 3 784 822 A1

(12)

(43) Date of publication:
03.03.2021 Bulletin 2021/09

(21) Application number: 19716434.6

(22) Date of filing: 12.04.2019
(51) International Patent Classification (IPC): 
C25D 5/56(2006.01)
C23C 18/30(2006.01)
C23C 18/38(2006.01)
C23C 18/48(2006.01)
C23C 18/20(2006.01)
C23C 18/32(2006.01)
C23C 18/42(2006.01)
(86) International application number:
PCT/EP2019/059459
(87) International publication number:
WO 2019/206682 (31.10.2019 Gazette 2019/44)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 24.04.2018 EP 18168933

(71) Applicant: CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement
2002 Neuchâtel (CH)

(72) Inventor:
  • ANDREATTA, Gaëlle
    2000 Neuchâtel (CH)

(74) Representative: e-Patent SA 
Rue Saint-Honoré 1 Boîte Postale CP 2510
2001 Neuchâtel
2001 Neuchâtel (CH)

   


(54) METHOD OF METAL PLATING OF POLYMER-CONTAINING SUBSTRATES