(19)

(11)

EP 3 811 550 A1

(12)

(43) Date of publication: 28.04.2021 Bulletin 2021/17 (21) Application number: 19737355.8 (22) Date of filing: 18.06.2019

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 24/10(2009.01) H04L 1/00(2006.01) (86) International application number: PCT/US2019/037784 (87) International publication number: WO 2019/246136 (26.12.2019 Gazette 2019/52)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 21.06.2018 US 201816014777 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: GUPTA, Piyush San Diego, California 92121-1714 (US) LI, Junyi San Diego, California 92121-1714 (US) WANG, Hua San Diego, California 92121-1714 (US) LI, Chong San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6 Dublin 6 (IE)