(19)
(11) EP 3 824 051 A1

(12)

(43) Date of publication:
26.05.2021 Bulletin 2021/21

(21) Application number: 19745437.4

(22) Date of filing: 03.07.2019
(51) International Patent Classification (IPC): 
C10M 169/02(2006.01)
C10M 169/04(2006.01)
(86) International application number:
PCT/US2019/040525
(87) International publication number:
WO 2020/018286 (23.01.2020 Gazette 2020/04)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 18.07.2018 US 201862699777 P

(71) Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC.
Midland, MI 48686-0994 (US)

(72) Inventor:
  • HESSE, Detlev
    65207 Weesbaden (DE)

(74) Representative: Houghton, Mark Phillip 
Patent Outsourcing Limited 1 King Street
Bakewell, Derbyshire DE45 1DZ
Bakewell, Derbyshire DE45 1DZ (GB)

   


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