(19)

(11)

EP 3 864 791 A1

(12)

(43) Date of publication: 18.08.2021 Bulletin 2021/33 (21) Application number: 19871391.9 (22) Date of filing: 04.10.2019

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04L 27/34(2006.01) H04J 13/10(2011.01) H04L 5/02(2006.01) H04L 27/26(2006.01) H04J 13/00(2011.01) (86) International application number: PCT/US2019/054849 (87) International publication number: WO 2020/076656 (16.04.2020 Gazette 2020/16)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 08.10.2018 US 201862742780 P 02.11.2018 US 201862755391 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: SENGUPTA, Avik San Jose, California 95134 (US) DAVYDOV, Alexei Nizhny Novgorod, 603132 (RU) MOROZOV, Gregory V. Nizhny Novgorod, 603107 (RU) PAWAR, Sameer Santa Clara, California 95050 (US) WANG, Guotong Beijing, Heilongjiang 100084 (CN) (74) Representative: Goddar, Heinz J.  Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München 80336 München (DE)