(19)
(11) EP 3 884 289 A1

(12)

(43) Date of publication:
29.09.2021 Bulletin 2021/39

(21) Application number: 19828439.0

(22) Date of filing: 04.12.2019
(51) International Patent Classification (IPC): 
G01R 33/035(2006.01)
H01L 27/18(2006.01)
H01L 23/00(2006.01)
G01R 33/12(2006.01)
(52) Cooperative Patent Classification (CPC):
G01R 33/0354; G01R 33/1246; G01R 31/71; H01L 24/81
(86) International application number:
PCT/US2019/064526
(87) International publication number:
WO 2020/146062 (16.07.2020 Gazette 2020/29)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 07.01.2019 US 201916241661

(71) Applicant: Northrop Grumman Systems Corporation
Falls Church, VA 22042-4511 (US)

(72) Inventors:
  • GRANINGER, Aurelius L.
    Sykesville, Maryland 21784 (US)
  • STRAND, Joel D.
    Ellicott City, Maryland 21042 (US)
  • STOUTIMORE, Micah John Atman
    Kensington, Maryland 20895 (US)
  • KEANE, Zachary Kyle
    Baltimore, Maryland 21217 (US)
  • HARTMAN, Jeffrey David
    1607 Woodruff Court, Maryland 21144 (US)
  • HACKLEY, Justin C.
    Catonsville, Maryland 21228 (US)

(74) Representative: Iqbal, Md Mash-Hud 
Marks & Clerk LLP 62-68 Hills Road
Cambridge CB2 1LA
Cambridge CB2 1LA (GB)

   


(54) SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION