(19)
(11) EP 3 890 919 A1

(12)

(43) Date of publication:
13.10.2021 Bulletin 2021/41

(21) Application number: 19842882.3

(22) Date of filing: 03.12.2019
(51) International Patent Classification (IPC): 
B23K 35/26(2006.01)
C22C 13/00(2006.01)
B23K 103/18(2006.01)
B23K 35/00(2006.01)
 B23K 1/06(2006.01)
B23K 103/02(2006.01)
B23K 35/02(2006.01)
B23K 103/00(2006.01)
(52) Cooperative Patent Classification (CPC):
B23K 2103/50; B23K 2103/18; B23K 1/06; B23K 35/262; B23K 2103/08; B23K 2103/02; B23K 35/0222; C22C 13/00; B23K 1/19; B23K 35/004; B23K 2103/52
(86) International application number:
PCT/IB2019/060395
(87) International publication number:
WO 2020/115653 (11.06.2020 Gazette 2020/24)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 06.12.2018 SK PP1392018
06.12.2018 SK PV2222018 U

(71) Applicant: Slovenská Technická Univerzita v Bratislave
812 43 Bratislava (SK)

(72) Inventors:
  • KOLE ÁK, Roman
    919 08 Boleráz (SK)
  • KOSTOLNÝ, Igor
    976 75 Jasenie (SK)

(74) Representative: Porubcan, Róbert 
Puskinova 19
900 28 Ivanka pri Dunaji
900 28 Ivanka pri Dunaji (SK)

   


(54) ACTIVE SOFT SOLDER FOR ULTRASONIC SOLDERING AT HIGHER APPLICATION TEMPERATURES