(19)
(11) EP 3 904 897 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
22.12.2021 Bulletin 2021/51

(43) Date of publication:
03.11.2021 Bulletin 2021/44

(21) Application number: 20172145.3

(22) Date of filing: 29.04.2020
(51) International Patent Classification (IPC): 
G01R 33/32(2006.01)
G01N 24/10(2006.01)
B01L 3/00(2006.01)
G01R 33/032(2006.01)
 G01R 33/30(2006.01)
G01R 33/60(2006.01)
G01N 21/64(2006.01)
(52) Cooperative Patent Classification (CPC):
B01L 3/5085; G01R 33/323; G01R 33/60; G01N 24/10; G01R 33/032; B01L 2300/0654; G01R 33/30
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Technische Universität München
80333 München (DE)

(72) Inventors:
  • DEEG, Andreas
    81379 München (DE)
  • BUCHER, Dominik
    82178 Puchheim (DE)

(74) Representative: Lucke, Andreas 
Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22
80336 München
80336 München (DE)


(56) References cited: : 
   
       


    (54) PARALLELIZED MAGNETIC SENSING OF SAMPLES USING SOLID-STATE SPIN SYSTEMS


    (57) Disclosed herein is a sensor chip for parallelized magnetic sensing of a plurality of samples, a system for parallelized magnetic sensing of a plurality of samples and a method for probing a plurality of samples using optically addressable solid-state spin systems. The sensor chip comprises an optically transparent substrate comprising a plurality of optically addressable solid-state spin systems arranged in a plurality of sensing regions in a surface layer below a top surface of the substrate. The sensor chip further comprises a plurality of sample sites, wherein each sample site is arranged above a respective sensing region. The sensor chip has a light guiding system configured to provide an optical path through the substrate connecting each of the sensing regions.