(19)
(11) EP 3 909 071 A1

(12)

(43) Date of publication:
17.11.2021 Bulletin 2021/46

(21) Application number: 20738967.7

(22) Date of filing: 08.01.2020
(51) International Patent Classification (IPC): 
H01L 23/00(2006.01)
H01L 23/528(2006.01)
 H01L 23/525(2006.01)
H01L 21/67(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 21/67; H01L 23/525; H01L 23/528; H01L 23/00
(86) International application number:
PCT/US2020/012690
(87) International publication number:
WO 2020/146466 (16.07.2020 Gazette 2020/29)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 09.01.2019 US 201962790259 P
28.09.2019 US 201962907562 P

(71) Applicant: Kulicke and Soffa Industries, Inc.
Fort Washington, PA 19034 (US)

(72) Inventors:
  • BAJWA, Adeel Ahmad
    Blue Bell, PA 19422 (US)
  • COLOSIMO, Thomas J.
    Chester, PA 19380 (US)

(74) Representative: Körner, Thomas Ottmar 
freigutpartners gmbh Gämsenstrasse 3
8006 Zürich
8006 Zürich (CH)

   


(54) METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS