(19)
(11) EP 3 921 460 A1

(12)

(43) Date of publication:
15.12.2021 Bulletin 2021/50

(21) Application number: 20702499.3

(22) Date of filing: 06.02.2020
(51) International Patent Classification (IPC): 
C25D 3/56(2006.01)
C25D 5/50(2006.01)
H01L 21/768(2006.01)
C25D 5/34(2006.01)
C25D 7/12(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 21/76877; H01L 23/53238; H01L 21/76883; H01L 21/2885; H01L 21/76867; C25D 7/123; C25D 5/18; C25D 5/50; C25D 3/58; C25D 3/562; H01L 23/53209
(86) International application number:
PCT/EP2020/053018
(87) International publication number:
WO 2020/161256 (13.08.2020 Gazette 2020/33)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 08.02.2019 FR 1901264
14.01.2020 FR 2000297

(71) Applicant: Aveni
91300 Massy (FR)

(72) Inventors:
  • MEVELLEC, Vincent
    92100 BOULOGNE (FR)
  • CAILLARD, Louis
    94230 CACHAN (FR)
  • THIAM, Mikaïlou
    60200 COMPIEGNE (FR)
  • SUHR, Dominique
    92290 CHATENAY - MALABRY (FR)

(74) Representative: Cabinet Beau de Loménie 
158, rue de l'Université
75340 Paris Cedex 07
75340 Paris Cedex 07 (FR)

   


(54) ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS