(19)
(11) EP 3 939 084 A2

(12)

(88) Date of publication A3:
24.06.2021

(43) Date of publication:
19.01.2022 Bulletin 2022/03

(21) Application number: 20885861.3

(22) Date of filing: 11.03.2020
(51) International Patent Classification (IPC): 
H01L 27/14(2006.01)
 G06K 19/07(2006.01)
(52) Cooperative Patent Classification (CPC):
G06K 19/0718; G06K 19/07707; G06K 19/07709; G06K 19/07749
(86) International application number:
PCT/US2020/022198
(87) International publication number:
WO 2021/091587 (14.05.2021 Gazette 2021/19)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 11.03.2019 US 201916299037

(71) Applicant: Ellipse World, Inc.
Culver City, CA 90232 (US)

(72) Inventors:
  • LALO, Cyril
    Los Angeles, California 90064 (US)
  • POCHIC, Sebastien
    1030 Schaerbeek (BE)
  • ESSEBAG, Jacques
    75116 Paris (FR)

(74) Representative: Descazeaux, Charles 
CDIP 85, boulevard Malesherbes
FR-75008 Paris
FR-75008 Paris (FR)

   


(54) PACKAGED ELECTRONIC MODULE AND MANUFACTURING METHOD THEREOF