(19)
(11) EP 4 003 638 A1

(12)

(43) Date of publication:
01.06.2022 Bulletin 2022/22

(21) Application number: 20742775.8

(22) Date of filing: 24.07.2020
(51) International Patent Classification (IPC): 
B23K 37/00(2006.01)
H01L 23/473(2006.01)
H01L 25/18(2006.01)
H01L 23/373(2006.01)
 H01L 23/10(2006.01)
H01L 25/07(2006.01)
H01L 21/56(2006.01)
H01L 23/433(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 23/10; H01L 23/473; H01L 25/072; H01L 25/18; H01L 23/3735; H01L 23/4334; H01L 21/565; H01L 2924/181; H01L 2924/19107; H01L 2224/48472
 
C-Sets:
H01L 2924/181, H01L 2924/00012;
(86) International application number:
PCT/EP2020/071001
(87) International publication number:
WO 2021/014002 (28.01.2021 Gazette 2021/04)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 25.07.2019 EP 19188381

(71) Applicant: Hitachi Energy Switzerland AG
5400 Baden (CH)

(72) Inventors:
  • TORRESIN, Daniele
    5400 Baden (CH)
  • MOHN, Fabian
    5408 Ennetbaden (CH)
  • AGOSTINI, Bruno
    8006 Zürich (CH)
  • GRADINGER, Thomas
    5032 Aarau Rohr (CH)
  • SCHUDERER, Juergen
    8047 Zürich (CH)

(74) Representative: Michalski Hüttermann & Partner Patentanwälte mbB 
Kaistraße 16A
40221 Düsseldorf
40221 Düsseldorf (DE)

   


(54) ARRANGEMENT OF A POWER SEMICONDUCTOR MODULE AND A COOLER