(19)
(11) EP 4 005 205 A1

(12)

(43) Date of publication:
01.06.2022 Bulletin 2022/22

(21) Application number: 20863420.4

(22) Date of filing: 10.09.2020
(51) International Patent Classification (IPC): 
H04N 19/169(2014.01)
H04N 19/17(2014.01)
H04N 19/119(2014.01)
(52) Cooperative Patent Classification (CPC):
H04N 19/17; H04N 19/119; H04N 19/169; H04N 19/61; H04N 19/46; H04N 19/167; H04N 19/174; H04N 19/176; H04N 19/865; H04N 19/70
(86) International application number:
PCT/CN2020/114508
(87) International publication number:
WO 2021/047590 (18.03.2021 Gazette 2021/11)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 10.09.2019 US 201962898127 P
11.09.2019 US 201962898620 P
09.09.2020 US 202017016257

(71) Applicant: HFI Innovation Inc.
Zhubei City, Hsinchu County 302 (TW)

(72) Inventors:
  • HSU, Chih-Wei
    Hsinchu City 30078 (TW)
  • CHEN, Lulin
    San Jose California 95134 (US)
  • HUANG, Yu-Wen
    Hsinchu City 30078 (TW)

(74) Representative: Hoefer & Partner Patentanwälte mbB 
Pilgersheimer Straße 20
81543 München
81543 München (DE)

   


(54) SIGNALING OF SUBPICTURE STRUCTURES