POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR ASSEMBLY AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

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EP 4 012 759 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	03.01.2024 Bulletin 2024/01

(45)	Mention of the grant of the patent:
	22.11.2023 Bulletin 2023/47

(21)	Application number: 20213165.2

(22)	Date of filing: 10.12.2020

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International Patent Classification (IPC):

H01L 23/00^(2006.01)
H01L 23/16^(2006.01)

H01L 23/049^(2006.01)
H01L 25/07^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	H01L 23/562; H01L 23/049; H01L 25/072; H01L 25/071; H01L 23/16; H01L 24/72

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POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR ASSEMBLY AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

LEISTUNGSHALBLEITERMODUL, LEISTUNGSHALBLEITERANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSHALBLEITERMODULS

MODULE SEMI-CONDUCTEUR DE PUISSANCE, ENSEMBLE SEMI-CONDUCTEUR DE PUISSANCE ET PROCÉDÉ DE FABRICATION D'UN MODULE SEMI-CONDUCTEUR DE PUISSANCE

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(43)	Date of publication of application:
	15.06.2022 Bulletin 2022/24

(73)	Proprietor: Hitachi Energy Ltd
	8050 Zürich (CH)

(72)	Inventors:
	DUGAL, Franc 8121 Benglen (CH) PAQUES, Gontran 5708 Birrwil (CH)

(74)	Representative: Epping - Hermann - Fischer
	Patentanwaltsgesellschaft mbH Schloßschmidstraße 5 80639 München 80639 München (DE)

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References cited: :

EP-A1- 1 263 045
US-A1- 2009 021 916
US-A1- 2010 302 741

EP-A2- 0 067 575
US-A1- 2009 039 498

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).