(19)
(11) EP 4 025 379 A1

(12)

(43) Date of publication:
13.07.2022 Bulletin 2022/28

(21) Application number: 20761287.0

(22) Date of filing: 31.08.2020
(51) International Patent Classification (IPC): 
B23K 35/26(2006.01)
B23K 35/02(2006.01)
C22C 13/00(2006.01)
H05K 3/34(2006.01)
(52) Cooperative Patent Classification (CPC):
H05K 3/3463; B23K 35/262; C22C 13/00; B23K 35/025; H05K 3/3485
(86) International application number:
PCT/EP2020/074193
(87) International publication number:
WO 2021/043708 (11.03.2021 Gazette 2021/10)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 06.09.2019 EP 19195895

(71) Applicant: Henkel AG & Co. KGaA
40589 Düsseldorf (DE)

(72) Inventors:
  • BUCKLAND, Daniel
    Hertfordshire WD6 3PD (GB)
  • WILDING, Ian
    Bedfordshire LT1 4HZ (GB)
  • REN, Guang
    Hubei 432100 (CN)
  • COLLINS, Maurice
    Limerick (IE)

   


(54) SOLDER ALLOY AND SOLDER PASTE CONTAINING SAID ALLOY