SPRING CONTACT AND TEST SOCKET HAVING SPRING CONTACT EMBEDDED THEREIN

(19)

(11)

EP 4 043 888 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	published in accordance with Art. 153(4) EPC

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	14.12.2022 Bulletin 2022/50

(43)	Date of publication:
	17.08.2022 Bulletin 2022/33

(21)	Application number: 19948172.2

(22)	Date of filing: 17.12.2019

(51)

International Patent Classification (IPC):

G01R 1/067^(2006.01)
G01R 31/28^(2006.01)

G01R 1/04^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	G01R 1/0466; G01R 1/06722; G01R 1/06738; G01R 1/07314; G01R 31/2863

(86)	International application number:
	PCT/KR2019/017865

(87)	International publication number:
	WO 2021/066255 (08.04.2021 Gazette 2021/14)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	KH MA MD TN

(30)

Priority:

02.10.2019 KR 20190122622

(71)	Applicants:
	Hicon Co., Ltd. Seongnam-si, Gyeonggi-do 13211 (KR) Hwang, Dong Weon Seongnam-si, Gyeonggi-do 13544 (KR) Hwang, Logan Jae Beverly Hills, CA 90210 (US) Hwang, Jae Baek Seoul 06004 (KR)

(72)	Inventors:
	HWANG, Dong Weon Seongnam-si Gyeonggi-do 13544 (KR) HWANG, Logan Jae Beverly Hills, CA 90210 (US) HWANG, Jae Baek Seoul 06004 (KR)

(74)	Representative: De Vries & Metman
	Overschiestraat 180 1062 XK Amsterdam 1062 XK Amsterdam (NL)

(54)	SPRING CONTACT AND TEST SOCKET HAVING SPRING CONTACT EMBEDDED THEREIN

(57) A test socket of the present invention comprises: a plurality of spring contacts, each of which includes an upper contact pin, a lower contact pin, and a coil spring for elastically supporting the upper contact pin and the lower contact pin; a main plate including a plurality of receiving holes formed to allow the spring contacts to be received and positioned therein, respectively, and including first openings, each of which is formed to have a diameter (d2) smaller than the diameter (d1) of the receiving hole so as to support the upper contact pin; and a film plate disposed under the main plate and including second openings, each of which is formed at a position corresponding to the receiving hole, and has a diameter (d3) smaller than the diameter (d1) of the receiving hole so as to support the lower contact pin (120).