(19)
(11) EP 4 059 053 A1

(12)

(43) Date of publication:
21.09.2022 Bulletin 2022/38

(21) Application number: 20926462.1

(22) Date of filing: 23.06.2020
(51) International Patent Classification (IPC): 
H01L 27/11582(2017.01)
H01L 27/11575(2017.01)
H01L 23/48(2006.01)
H01L 21/768(2006.01)
H01L 23/522(2006.01)
 H01L 27/11573(2017.01)
H01L 27/1157(2017.01)
H01L 25/065(2006.01)
H01L 23/00(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 27/1157; H01L 27/11573; H01L 27/11582; H01L 27/11575; H01L 25/18; H01L 24/08; H01L 2225/06541; H01L 2224/08145; H01L 2224/04042; H01L 2224/05568; H01L 2224/05567; H01L 2224/9202; H01L 2224/09181; H01L 24/48; H01L 24/05; H01L 24/03
 
C-Sets:
H01L 2224/9202, H01L 2224/03;
(86) International application number:
PCT/US2020/039105
(87) International publication number:
WO 2021/194537 (30.09.2021 Gazette 2021/39)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 25.03.2020 US 202016829591
25.03.2020 US 202016829667

(71) Applicant: SanDisk Technologies LLC
Addison, Texas 75001 (US)

(72) Inventors:
  • OKINA, Teruo
    San Jose, California 95119 (US)
  • NISHIDA, Akio
    San Jose, California 95119 (US)
  • KAI, James
    San Jose, California 95119 (US)

(74) Representative: Dehns 
St. Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE SAME BY REPLACING CARRIER SUBSTRATE WITH SOURCE LAYER