TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of relays, and in particular,
to a sealed relay.
BACKGROUND
[0002] With the rapid development of the Internet, the requirements for servers are getting
higher and higher, and the power of the server is also getting bigger and bigger,
but the heat dissipation of the server has become the bottleneck of development. At
present, the cooling method of the server in the computer room usually adopts the
air-cooled method. However, in large data centers, air cooling alone is no longer
sufficient to meet the cooling requirements of high heat flux servers. Liquid cooling,
that is, using the working fluid as an intermediate heat transfer medium, transfers
the heat from the hot area to a distance and then cools it, because the specific heat
of liquid is much greater than that of air, and the heat dissipation rate is also
much faster than that of air, the cooling efficiency is much higher than that of air-cooled
heat dissipation. At the same time, liquid cooling can also be well controlled in
terms of noise. Therefore, liquid cooling has also become an inevitable trend of server
cooling.
[0003] Liquid cooling means that the server is immersed in liquid, and all components in
the server are required to be able to withstand the test of liquid immersion. As an
electronic component in the server, the relay also needs to be immersed in liquid.
Because the electromagnetic relay is a device that generates movement through a mechanical
structure, once the liquid enters the relay, it will affect the action and release
time of the relay, thereby affecting the overall response speed and function of the
server. Therefore, it is required that the relay can be made into a sealed type, and
long-term immersion will not damage its sealing.
[0004] The sealing of most traditional electromagnetic relays is achieved by using epoxy
resin to seal between a single case and the base. However, this kind of relay has
a disadvantage, that is, in the process of wave soldering, reflow soldering, etc.,
the epoxy resin is heated and melted, as a result, there may be tiny gaps at the junction
of the pins of the relay and the case, resulting in the relay being not tightly sealed,
and it is easy to enter the liquid in a liquid-cooled environment.
SUMMARY
[0005] In view of the technical problems existing in the related art, the present disclosure
provides a sealed relay, which can realize multiple sealing, effectively avoid the
influence of welding heat on its plastic sealing performance, and make its sealing
performance more reliable.
[0006] The technical solution adopted by the present disclosure to solve the technical problem
is: a sealed relay includes an electromagnetic relay provided with a plurality of
first lead-out pins, and further incudes a hollow sealed body and a plurality of second
lead-out pins, first ends of the plurality of second lead-out pins are electrically
connected to the plurality of first lead-out pins of the electromagnetic relay one
by one; the electromagnetic relay and the plurality of first lead-out pins are located
in the sealed body, and the sealed body is filled with potting glue, a sealing layer
is formed by the potting glue and is configured to at least wrap the first lead-out
pins of the electromagnetic relay; second ends of the second lead-out pins are located
outside the sealed body respectively.
[0007] In exemplary embodiments of the present disclosure, the plurality of first lead-out
pins are located at a first side of the case of the electromagnetic relay, the second
ends of the plurality of second lead-out pins are all located at a second side of
the case of electromagnetic relay; the first side and the second side of the case
of the electromagnetic relay are opposite to each other.
[0008] In exemplary embodiments of the present disclosure, an extending direction of a first
lead-out pin is opposite to an extending direction of a second end of a second lead-out
pin; and/or, the sealing layer is configured to wrap the electromagnetic relay and
the first lead-out pins of the electromagnetic relay.
[0009] In exemplary embodiments of the present disclosure, the sealed body includes an outer
case with an opening at one side and a cover plate, the electromagnetic relay is placed
into the outer case from the opening of the outer case, and the outer case is filled
with the potting glue and covered by a cover plate.
[0010] In exemplary embodiments of the present disclosure, parts of the plurality of first
lead-out pins of the electromagnetic relay that are located outside the case of the
electromagnetic relay are located at a side of the case opposite to the cover plate,
the plurality of second lead-out pins are configured to respectively pass through
the cover plate to make the second ends be located outside the cover plate.
[0011] In exemplary embodiments of the present disclosure, gaps between the plurality of
second lead-out pins and the cover plate are respectively sealed by dispensing glue;
the cover plate and the outer case are plastic-sealed by dispensing glue.
[0012] In exemplary embodiments of the present disclosure, the cover plate is placed in
the opening of the outer case, and a glue dispensing groove is provided at peripheral
edges of an outer periphery of the cover plate, through which the glue is flowed into
a gap between the cover plate and the outer case.
[0013] In exemplary embodiments of the present disclosure, the cover plate is provided with
a plurality of through holes, and the plurality of second lead-out pins are configured
to pass through the plurality of through holes one by one, and the plurality of through
holes are distributed in the glue dispensing groove.
[0014] In exemplary embodiments of the present disclosure, the cover plate is provided with
a first vent hole, and the first vent hole is sealed after the potting glue in the
sealed body is cured.
[0015] In exemplary embodiments of the present disclosure, the case of the electromagnetic
relay is provided with a second vent hole, the second vent hole and the plurality
of first lead-out pins are located at a same side of the case of the electromagnetic
relay, the second vent hole is sealed before the electromagnetic relay is installed
into the sealed body.
[0016] Compared with the related art, the present disclosure has the following beneficial
effects:
- 1. In the present disclosure, the sealed body and the potting glue in the sealed body
are used to protect the electromagnetic relay, so that the liquid cannot permeate
into the electromagnetic relay through the sealed body and the potting glue, so as
to realize multiple sealing functions. In particular, the present disclosure provides
the second lead-out pins, so that the first lead-out pins of the electromagnetic relay
are wrapped in the sealed body and the potting glue, during welding on the client
side, the heat cannot be transferred to the first lead-out pins of the electromagnetic
relay, so as to avoid tiny gaps at the joint between the first lead-out pins and the
potting glue due to the heat melting of the glue, so that the sealing performance
of the electromagnetic relay is very reliable.
- 2. The plurality of first lead-out pins are located at the first side of the case
of the electromagnetic relay, and the second ends of the plurality of second lead-out
pins are located at the second side of the case of the electromagnetic relay; the
first side and the second side of the case of the electromagnetic relay are opposite
to each other, so that the length of the second lead-out pins is long enough, and
the encapsulation amount of the potting glue on the first lead-out pins is sufficient,
thereby ensuring that the plastic sealing performance of the first lead-out pins of
the electromagnetic relay is completely unaffected by the welding heat.
- 3. The sealed body includes the outer case and the cover plate, not only is the structure
of the sealed body simple, but also the structure of the sealed body facilitates the
insertion and glue-filling operations of the electromagnetic relay.
- 4. The gaps between the second lead-out pins and the cover plate are sealed by dispensing
glue, respectively. The cover plate and the outer case are plastic-sealed by dispensing
glue, so that the sealed body can provide a closed space for the electromagnetic relay
and the potting glue, thereby, the sealing performance of the electromagnetic relay
is further improved.
- 5. The arrangement of the glue dispensing groove can effectively drain the glue by
using the glue dispensing groove, so that the glue dispensing operation between the
cover plate and the outer case is more convenient, and the amount of glue can be saved.
In particular, a plurality of through holes on the cover plate for passing through
the second lead-out pins are distributed in the glue dispensing groove, which makes
it possible to further seal the gaps between the second lead-out pins and the cover
plate when the glue is filled into the glue dispensing groove, thereby further simplifying
the glue dispensing process.
- 6. The cover plate is provided with a first vent hole, so that the present disclosure
can utilize the first vent hole to perform ventilation when using potting glue for
plastic sealing, so that the potting glue is easier to quickly cure, thereby helping
to shorten the curing cycle. In particular, the first vent hole of the cover plate
is sealed after the potting glue in the sealed body is cured, so that the sealed body
can provide a sealed space for the electromagnetic relay and the potting glue, thereby
further improving the sealing performance of the electromagnetic relay.
- 7. The second vent hole of the case of the electromagnetic relay is located on the
same side of the case of the electromagnetic relay as the plurality of first lead-out
pins, so as to ensure that the second vent hole is located in the sealing layer and
prevent the liquid from entering the electromagnetic relay through the second vent
hole due to poor sealing quality of the second vent hole.
[0017] The present disclosure will be described in further detail below with reference to
the accompanying drawings and embodiments. However, a sealed relay of the present
disclosure is not limited to the embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018]
FIG. 1 is a first schematic perspective diagram showing a configuration of an electromagnetic
relay and the second lead-out pins in a cooperation state of the first embodiment
of the present disclosure.
FIG. 2 is a second schematic perspective diagram showing a configuration of an electromagnetic
relay and the second lead-out pins in a cooperation state of the first embodiment
of the present disclosure.
FIG. 3 is a first schematic perspective diagram showing a configuration of a sealed
relay of the first embodiment of the present disclosure.
FIG. 4 is a second schematic perspective diagram showing a configuration of a sealed
relay of the first embodiment of the present disclosure.
FIG. 5 is a cross-sectional view of the sealed relay according to the first embodiment
of the present disclosure.
FIG. 6 is a cross-sectional view of the sealed relay according to the second embodiment
of the present disclosure.
DETAILED DESCRIPTION
First embodiment
[0019] As shown in FIGS. 1 to 5, a sealed relay of the present disclosure includes an electromagnetic
relay 1, a hollow sealed body 100 and a plurality of second lead-out pins 2, the electromagnetic
relay 1 is provided with a case 12 and a plurality of first lead-out pins 11, and
each of the second lead-out pins 2 is provided with a first end and a second end which
are opposite to each other, the first ends of the second lead-out pins 2 are electrically
connected to the first lead-out pins 11 of the electromagnetic relay 1 one by one;
the electromagnetic relay 1 and its first lead-out pins 11 are located in the sealed
body 100, and the sealed body 100 is filled with potting glue, and the potting glue
forms a sealing layer 5 that at least wraps the first lead-out pins 11 of the electromagnetic
relay 1; the second ends of the second lead-out pins 2 are located outside the sealed
body 100 respectively.
[0020] In this embodiment, the plurality of first lead-out pins 11 are located at the first
side of the case 12 of the electromagnetic relay 1, the second ends of the plurality
of second lead-out pins 2 are all located at the second side of the case 12 of electromagnetic
relay 1; the first side of the case 12 of the electromagnetic relay 1 is opposite
to the second side. In this way, the length of the second lead-out pin 2 is long enough,
and the encapsulation amount of the potting glue on the first lead-out pins 11 is
sufficient, thereby ensuring that during welding, the plastic sealing performance
of the first lead-out pins 11 of the electromagnetic relay 1 is completely unaffected
by the welding heat. The second lead-out pin 2 is specifically L-shaped. Specifically,
the second lead-out pin 2 is provided with a first portion 21 and a second portion
22, and the first portion 21 and the second portion 22 are connected to form an L
shape. The first portions 21 of the second lead-out pins 2 are located at the same
side as the plurality of first lead-out pins 11, and are electrically connected with
the corresponding first lead-out pins 11 (specifically, the electrical connection
can be realized by welding, riveting, etc.), the second portions 22 are fitted on
the outer side of the case 12 of the electromagnetic relay 1, and the free end of
the second portion 22 is the second end of the second lead-out pin 2 and extends away
from the first lead-out pins 11. The case 12 of the electromagnetic relay 1 generally
includes an upper case and a base, and the two are sealed and connected, and the magnetic
circuit part and the contact part of the electromagnetic relay are contained therein,
and only the first lead-out pins 11 are partially led out. The extending direction
of the first lead-out pin 11 is opposite to the extending direction of the second
end of the second lead-out pin 2. The sealing layer 5 wraps the electromagnetic relay
1 and the first lead-out pins 11 of the electromagnetic relay 1.
[0021] In this embodiment, as shown in FIG. 3 to FIG. 5 , the sealed body 100 includes an
outer case 3 with an opening at one side and a cover plate 4, the electromagnetic
relay 1 is placed into the outer case 3 from the opening of the outer case 3, and
is sealed with potting glue and covered by a cover plate 4. The parts of the first
lead-out pins 11 of the electromagnetic relay 1 that are located outside the case
12 of the electromagnetic relay 1 are located at the side of the case 12 opposite
to the cover plate 4, the second lead-out pins 2 respectively pass through the cover
plate 4 so that the second ends thereof are located outside the cover plate 4. Specifically,
the electromagnetic relay 1 is installed in the outer case 3 reversedly (that is,
the first lead-out pins 11 of the electromagnetic relay 1 face upward), the second
ends of the second lead-out pins 2 face downward, as shown in FIG. 4 and FIG. 5. In
other embodiments, the second lead-out pins 2 pass through the side of the outer case
3 opposite to the cover plate 4, and their second ends are located outside the outer
case 3. In other embodiments, the sealed body 100 includes two half-shells, the two
half-shells are butted in a sealed manner, the electromagnetic relay 1 and the first
lead-out pins 11 thereof are wrapped in the two half-shells, and the second lead-out
pins 2 respectively pass through one of the half-shells.
[0022] In this embodiment, the gaps between the second lead-out pins 2 and the cover plate
4 are respectively sealed by dispensing glue. The cover plate 4 and the outer case
3 are plastic-sealed by dispensing glue. Specifically, the cover plate 4 is placed
in the opening of the outer case 3, and a glue dispensing groove 41 is provided at
the peripheral edges of the outer periphery of the cover plate 4, the glue can flow
into the gap between the cover plate 4 and the outer case 3 through the glue dispensing
groove 41 , as shown in FIG. 3. The cover plate 4 is provided with a plurality of
through holes 42, and the second lead-out pins 2 pass through the plurality of through
holes 42 one by one, and the plurality of through holes 42 are distributed in the
glue dispensing groove 41. In this way, the present disclosure can utilize the glue
dispensing groove 41 to effectively drain the glue, so that the glue dispensing operation
between the cover plate 4 and the outer case 3 is more convenient, and the amount
of glue can be saved. In addition, when the glue is poured into the glue dispensing
groove 41, the gaps between the second lead-out pins 2 and the cover plate 4 can be
further sealed, thereby further simplifying the glue dispensing process.
[0023] In the embodiment, the cover plate 4 is provided with a first vent hole 43, and the
first vent hole 43 is sealed after the potting glue in the sealed body 100 is cured.
Specifically, the first vent hole 43 of the cover plate 4 may be sealed by riveting
and/or glue dispensing. The arrangement of the first vent hole 43 enables the present
disclosure to utilize the first vent hole 43 for ventilation when the potting glue
is used for plastic sealing, so that the potting glue is easier and quicker to cure,
which is beneficial to shorten the curing cycle of the potting glue. In particular,
the first vent hole 43 of the cover plate 4 is sealed after the potting glue in the
sealed body 100 is cured, so that the sealed body 100 can provide sealed space for
the electromagnetic relay 1 and the sealing layer 5 formed by the potting glue, thereby
further improving the sealing performance of the electromagnetic relay 1.
[0024] In this embodiment, ribs and/or slots (not shown in the figures) are provided inside
the outer case 3 to limit and clamp the electromagnetic relay 1 located in the outer
case 3.
[0025] In present disclosure, when the sealed relay is assembled, the electromagnetic relay
1 is first installed into the outer case 3, and then the sealing is carried out with
glue filling, or, the glue is poured into the outer case 3 first, and then the electromagnetic
relay 1 is installed into the outer case 3, and ensure that the electromagnetic relay
1 and its first lead-out pins 11 (or at least the first lead-out pins 11 of the electromagnetic
relay 1 ) are wrapped by the sealing layer 5 formed by the potting glue in the outer
case 3, then, the cover plate 4 is covered so that the second ends of the second lead-out
pins 2 are passed through the cover plate 4 respectively, glue dispensing and plastic
seal is performed between the outer case 3 and the cover plate 4 as well as between
the cover plate 4 and each of the second lead-out pins 2 to form a plastic sealing
layer 6, the plastic sealing layer 6 and the sealing layer 5 are cured at the same
time. Finally, the first vent hole 43 provided on the cover plate 4 are sealed by
riveting and/or glue dispensing.
[0026] A sealed relay disclosed in the present disclosure adopts double cases (the inner
case is the case 12 of the electromagnetic relay 1) and potting glue to achieve multiple
sealing based on the traditional electromagnetic relay. Liquid cannot penetrate into
the electromagnetic relay 1 disposed inside through the outer case 3, the cover plate
4, and the like. In civilian applications, compared with the sealed relay with metal
case, the cost is lower and the process is simpler. In particular, in the present
disclosure, each first lead-out pin 11 of the electromagnetic relay 1 is wrapped in
the outer case 3, and then plastic-sealed by means of glue filling, the second lead-out
pins 2 are led out the outer case 3, and the length of the second lead-out pins 2
is long enough, so that the encapsulation amount of the potting glue on the first
lead-out pins 11 is sufficient, during welding on the client side, the heat cannot
be transferred to the electromagnetic relay 1 disposed in the outer case 3, so the
joint between the first lead-out pins 11 and the glue will not cause tiny gaps due
to melting of the glue.
[0027] A sealed relay of the present disclosure adopts multiple sealing structures, so that
it has good sealing performance and can be used in a long-term immersion in a liquid
environment.
Second embodiment
[0028] A sealed relay of the present disclosure, which is different from the sealed relay
of the first embodiment above in that: the case 12 of the electromagnetic relay 1
is provided with a second vent hole (not shown in the figures), the second vent hole
and the plurality of first lead-out pins 11 are located at the same side of the case
12 of electromagnetic relay 1, the second vent hole is sealed before the electromagnetic
relay 1 is put into the sealed body 100. In this way, when it is necessary to make
the sealing layer 5 only partially wrap the electromagnetic relay 1 (as shown in FIG.
6), it can ensure that the second vent hole is always in the sealing layer 5 to avoid
the second vent hole is not protected by the sealing layer 5 and further avoid the
risk of liquid entering the interior of the electromagnetic relay 1 through the second
vent hole when the second vent hole itself is not well scalded or the quality of the
glue seal is poor.
1. A sealed relay, comprising an electromagnetic relay (1) provided with a plurality
of first lead-out pins (11),
characterized in that, further comprising:
a hollow sealed body (100); and
a plurality of second lead-out pins (2), wherein first ends of the plurality of second
lead-out pins (2) are electrically connected to the plurality of first lead-out pins
(11) of the electromagnetic relay (1) one by one;
wherein the electromagnetic relay (1) and the plurality of first lead-out pins (11)
are located in the sealed body (100), and the sealed body (100) is filled with potting
glue, a sealing layer (5) is formed by the potting glue and is configured to at least
wrap the first lead-out pins (11) of the electromagnetic relay (1); second ends of
the second lead-out pins (2) are located outside the sealed body (100) respectively.
2. The sealed relay according to claim 1, wherein the plurality of first lead-out pins
(11) are located at a first side of the case (12) of the electromagnetic relay (1),
the second ends of the plurality of second lead-out pins (2) are all located at a
second side of the case (12) of electromagnetic relay (1); the first side and the
second side of the case (12) of the electromagnetic relay (1) are opposite to each
other.
3. The sealed relay according to claim 2, wherein an extending direction of a first lead-out
pin (11) is opposite to an extending direction of a second end of a second lead-out
pin (2); and/or, the sealing layer (5) is configured to wrap the electromagnetic relay
(1) and the first lead-out pins (11) of the electromagnetic relay (1).
4. The sealed relay according to any one of claims 1 to 3, wherein the sealed body (100)
comprises an outer case (3) with an opening at one side and a cover plate (4), the
electromagnetic relay (1) is placed into the outer case (3) from the opening of the
outer case (3), and the outer case (3) is filled with the potting glue and covered
by a cover plate (4).
5. The sealed relay according to claim 4, wherein parts of the plurality of first lead-out
pins (11) of the electromagnetic relay (1) that are located outside the case (12)
of the electromagnetic relay (1) are located at a side of the case (12) opposite to
the cover plate (4), the plurality of second lead-out pins (2) are configured to respectively
pass through the cover plate (4) to make the second ends be located outside the cover
plate (4).
6. The sealed relay according to claim 5, wherein gaps between the plurality of second
lead-out pins (2) and the cover plate (4) are respectively sealed by dispensing glue;
the cover plate (4) and the outer case (3) are plastic-sealed by dispensing glue.
7. The sealed relay according to claim 6, wherein the cover plate (4) is placed in the
opening of the outer case (3), and a glue dispensing groove (41) is provided at peripheral
edges of an outer periphery of the cover plate (4), through which the glue is flowed
into a gap between the cover plate (4) and the outer case (3).
8. The sealed relay according to claim 7, wherein the cover plate (4) is provided with
a plurality of through holes (42), and the plurality of second lead-out pins (2) are
configured to pass through the plurality of through holes (42) one by one, and the
plurality of through holes (42) are distributed in the glue dispensing groove (41).
9. The sealed relay according to claim 4, wherein the cover plate (4) is provided with
a first vent hole (43), and the first vent hole (43) is sealed after the potting glue
in the sealed body (100) is cured.
10. The sealed relay according to any one of claims 1 to 3, wherein the case (12) of the
electromagnetic relay (1) is provided with a second vent hole, the second vent hole
and the plurality of first lead-out pins (11) are located at a same side of the case
(12) of the electromagnetic relay (1), the second vent hole is sealed before the electromagnetic
relay (1) is installed into the sealed body (100).